公开(公告)号：US09920448B2

公开(公告)日：2018-03-20

申请号：US14944585

申请日：2015-11-18

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson

IPC: C25D3/38 ,  C25D17/00 ,  C25D17/10 ,  C25D21/18

CPC classification number: C25D21/18 ,  C25D3/38 ,  C25D17/001 ,  C25D17/002 ,  C25D17/10

Abstract: An electroplating system includes a processor has a vessel having a first or upper compartment and a second or lower compartment containing catholyte and anolyte, respectively, with an processor anionic membrane between them. An inert anode is located in the second compartment. A replenisher is connected to the vessel via catholyte return and supply lines and anolyte return and supply lines, to circulate catholyte and anolyte through compartments in the replenisher separated by a replenisher anionic membrane. The replenisher adds metal ions into the catholyte by moving ions from a bulk metal source, and moves anions from the anolyte through the anionic membrane and into the catholyte. Concentrations or metal ions and anions in the catholyte and the anolyte remain balanced.

公开(公告)号：US20170335484A1

公开(公告)日：2017-11-23

申请号：US15674346

申请日：2017-08-10

Applicant: APPLIED Materials, Inc.

Inventor： Gregory J. Wilson ,  Paul R. McHugh

IPC: C25D17/00 ,  C25D7/12 ,  C25D21/12

CPC classification number: C25D17/005 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/007 ,  C25D21/12

Abstract: An electro-processing apparatus has a contact ring including a seal which is able to compensate for electric field distortions created by a notch (or other irregularity) on the wafer or work piece. The shape of the contact ring at the notch is changed, to reduce current crowding at the notch. The change in shape changes the resistance of the current path between a thief electrode and the wafer edge to increase thief electrode current drawn from the region of the notch. As a result, the wafer is plated with a film having more uniform thickness.

公开(公告)号：US09689082B2

公开(公告)日：2017-06-27

申请号：US14686537

申请日：2015-04-14

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson

IPC: C25D17/00 ,  C25D7/12

CPC classification number: C25D17/001 ,  C25D7/123 ,  C25D17/005 ,  C25D17/008

Abstract: An electroplating apparatus has a vessel for holding electrolyte. A head has a rotor including a contact ring for holding a wafer having a notch. The contact ring includes a perimeter voltage ring having perimeter contact fingers for contacting the wafer around the perimeter of the wafer, except at the notch. The contact ring also has a notch contact segment having one or more notch contact fingers for contacting the wafer at the notch. The perimeter voltage ring is insulated from the notch contact segment. A negative voltage source is connected to the perimeter voltage ring, and a positive voltage source connected to the notch contact segment. The positive voltage applied at the notch reduces the current crowding effect at the notch. The wafer is plated with a film having more uniform thickness.

公开(公告)号：US20170145582A1

公开(公告)日：2017-05-25

申请号：US15423298

申请日：2017-02-02

Applicant: APPLIED Materials, Inc.

Inventor： Nolan L. Zimmerman ,  George Mattinger ,  Gregory J. Wilson ,  Eric A. Englhardt ,  Balamurugan Ramasamy

IPC: C25D17/00

CPC classification number: C25D17/004 ,  C25D17/001 ,  C25D17/002 ,  F16J15/00 ,  F16J15/025 ,  F16J15/16 ,  F16J15/3204 ,  F16J15/3236

Abstract: A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against a wafer surface. The seal ring may be on a rotor of the processor, with the seal ring having an outer wall joined to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Knife edge seal rings that slip or deflect laterally on the wafer surface may also be used. In these designs, the slipping is substantially uniform and consistent, resulting in improved performance.

公开(公告)号：US20160348263A1

公开(公告)日：2016-12-01

申请号：US14721693

申请日：2015-05-26

Applicant: APPLIED Materials, Inc.

Inventor： Daniel J. Woodruff ,  Gregory J. Wilson ,  Paul R. McHugh

IPC: C25D17/00 ,  C25D21/10

CPC classification number: C25D17/001 ,  C25D17/002 ,  C25D17/008 ,  C25D21/10

Abstract: An electroplating processor includes a base having a vessel body. A membrane assembly including a membrane housing is attached to a membrane plate. A membrane is provided on a membrane support attached to the membrane housing. An anode assembly includes an anode cup and one or more anodes in the anode cup. An anode plate is attached to the anode cup. Two or more posts on a first side of the anode plate are engageable with post fittings on the membrane plate. Latches on a second side of the anode plate are engageable with and releasable from a latch fitting on the membrane plate. The anode assembly is quickly and easily removable from the processor for maintenance, without disturbing or removing other components of the processor.

Abstract translation: 电镀处理器包括具有容器主体的底座。 包括膜壳体的膜组件附接到膜板。 膜附着在膜壳体上。 阳极组件包括阳极杯和阳极杯中的一个或多个阳极。 阳极板连接到阳极杯。 在阳极板的第一侧上的两个或更多个柱可与膜板上的柱接头接合。 在阳极板的第二侧上的闩锁可以与膜板上的闩锁配件接合并且可从其释放。 阳极组件可快速且容易地从处理器移除以进行维护，而不会干扰或去除处理器的其它部件。

公开(公告)号：US09469911B2

公开(公告)日：2016-10-18

申请号：US14601989

申请日：2015-01-21

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Roey Shaviv

IPC: C25D5/00

CPC classification number: C25D17/008 ,  C25D5/00 ,  C25D17/001 ,  C25D17/007 ,  C25D17/12

Abstract: An electroplating apparatus has one or more membrane tube rings which act as electric field shields, to provide advantageous plating characteristics at the perimeter of a work piece. The membrane tube rings may be filled with fluids having different conductivity, to change the shielding effect as desired for electroplating different types of substrates. The membrane tube rings may optionally be provided in or on a diffuser plate in the vessel of the apparatus.

Abstract translation: 电镀设备具有一个或多个膜管环，其作为电场屏蔽，以在工件的周边提供有利的电镀特性。 膜管环可以填充具有不同导电性的流体，以根据需要改变电镀不同类型的基底的屏蔽效果。 膜管环可以可选地设置在装置的容器中的扩散器板中或其上。

公开(公告)号：US20160237584A1

公开(公告)日：2016-08-18

申请号：US14620984

申请日：2015-02-12

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  John L. Klocke ,  Randy A. Harris ,  Bridger Hoerner ,  Paul Van Valkenburg

IPC: C25D5/22 ,  C25D5/34 ,  C25D17/00 ,  C25D17/06 ,  H01L21/288 ,  C25D7/12

CPC classification number: C25D5/34 ,  C25D5/022 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004

Abstract: A method for processing a wafer includes holding the wafer in a face-up position with a seal ring contacting the wafer on a contact circumference. A bead of liquid is applied onto the entire contact circumference, with the bead of liquid contacting the wafer and the seal ring. The wafer is then inverted into a head-down position, lowered into contact with electrolyte and plated with a conductive film. Formation of the bead of liquid helps to displace air bubbles as the wafer is immersed into the electrolyte which reduces plating defects.

Abstract translation: 一种用于处理晶片的方法包括将晶片保持在面朝上位置，其中密封环在接触圆周上接触晶片。 液体珠被施加到整个接触圆周上，液体珠接触晶片和密封环。 然后将晶片倒置成下降位置，降低成与电解质接触并镀上导电膜。 当晶片浸入电解质中时，液体珠的形成有助于置换气泡，这减少了电镀缺陷。

公开(公告)号：US09099297B2

公开(公告)日：2015-08-04

申请号：US13943684

申请日：2013-07-16

Applicant: APPLIED Materials, Inc.

Inventor： Gregory J. Wilson ,  Paul R. McHugh

IPC: C25D17/02 ,  H01L21/02 ,  C25D17/00 ,  C25D7/12 ,  C25D5/02

CPC classification number: H01L21/02002 ,  C25D5/028 ,  C25D5/08 ,  C25D7/123 ,  C25D17/002 ,  C25D17/005 ,  C25D17/007 ,  C25D17/02

Abstract: An electrochemical processor may include a head having a rotor configured to hold a workpiece, with the head moveable to position the rotor in a vessel. Inner and outer anodes are in inner and outer anolyte chambers within the vessel. An upper cup in the vessel, has a curved upper surface and inner and outer catholyte chambers. A current thief is located adjacent to the curved upper surface. Annular slots in the curved upper curved surface connect into passageways, such as tubes, leading into the outer catholyte chamber. Membranes may separate the inner and outer anolyte chambers from the inner and outer catholyte chambers, respectively.

Abstract translation: 电化学处理器可以包括具有被配置为保持工件的转子的头部，头部可移动以将转子定位在容器中。 内阳极和外阳极在容器内部和外部阳极电解液室中。 容器中的上杯具有弯曲的上表面和内部和外部阴极电解液室。 目前的小偷位于弯曲的上表面附近。 弯曲的上曲面中的环形槽连接到通道，例如管，通向外阴极室。 膜可以分别将内部和外部阳极电解液室与内部和外部阴极电解液室分开。

公开(公告)号：US20150075976A1

公开(公告)日：2015-03-19

申请号：US14553840

申请日：2014-11-25

Applicant: APPLIED Materials, Inc.

Inventor： Randy A. Harris ,  Daniel J. Woodruff ,  Jeffrey I. Turner ,  Gregory J. Wilson ,  Paul R. McHugh

IPC: C25D17/12 ,  C25D17/00

CPC classification number: C25D17/12 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002

Abstract: An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.

Abstract translation: 电镀处理器包括具有形成在通道中的连续流路的电极板。 流路可以可选地是卷绕的流动路径。 一个或多个电极定位在通道中。 膜板在它们之间附着有电极板。 电解液以高速移动通过流路，防止气泡粘到膜底部。 流动路径中的任何气泡被夹带在快速移动的电解质中并从膜中带走。 电镀处理器可以替代地具有延伸通过形成为线圈或其它形状的管状膜的线电极，任选地包括具有直段的形状。

公开(公告)号：US20140266219A1

公开(公告)日：2014-09-18

申请号：US13827953

申请日：2013-03-14

Applicant: APPLIED MATERIALS, INC.

Inventor： Gregory J. Wilson ,  Paul R. McHugh ,  Daniel J. Woodruff

IPC: G01N17/02

CPC classification number: G01N27/18 ,  G01N33/004 ,  G01N33/006

Abstract: A detection fixture is provided with a processor for electroplating a substrate such as a semiconductor wafer, to detect the level of electrolyte in a bowl of the processor. The detected electrolyte level is used in controlling entry of the substrate into the electrolyte, to achieve desired electrolyte wetting characteristics. The processor has a substrate holder supported on a lifter for lowering the substrate holder into the bowl. The detection fixture may emulate a substrate and be held by the substrate holder in the same way that the substrate holder holds a substrate. The lifter lowers the detection fixture until it makes contact with the electrolyte, with the position of the fixture indicative the electrolyte level. The detection fixture is then removed from the processor.

Abstract translation: 检测夹具设置有用于电镀诸如半导体晶片的基板的处理器，以检测处理器的碗中的电解质的水平。 检测到的电解质水平用于控制基板进入电解质，以达到所需的电解液润湿特性。 处理器具有支撑在升降器上的衬底保持器，用于将衬底保持器降低到碗中。 检测夹具可以模仿衬底并且以与衬底保持器保持衬底相同的方式由衬底保持器保持。 升降器降低检测夹具直到与电解液接触，夹具的位置表示电解液液位。 然后将检测夹具从处理器中取出。