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    Methods and apparatus for calibrating distributed fiber temperature sensing system
    51.
    发明授权
    Methods and apparatus for calibrating distributed fiber temperature sensing system 有权
    校准分布式光纤温度传感系统的方法和装置

    公开(公告)号：US07526397B2

    公开(公告)日：2009-04-28

    申请号：US11685628

    申请日：2007-03-13

    申请人： Kent Kalar ,  Michael E. Sanders ,  Chung Lee ,  Brian Park ,  Mohammed Fassih-Nia

    发明人： Kent Kalar ,  Michael E. Sanders ,  Chung Lee ,  Brian Park ,  Mohammed Fassih-Nia

    IPC分类号： G01K15/00

    CPC分类号： G01K11/32 ,  G01K15/00

    摘要： Systems and methods for calibrating a temperature sensing system are disclosed. In one respect, a line may be placed in operative relation with a first reference cell and a second reference cell. The temperatures of the first and second reference cells may be adjusted. In one non-limiting example, the temperature of the first reference cell may be adjusted to a temperature above an ambient temperature and the temperature of the second reference cell may be adjusted to a temperature below an ambient temperature. The temperature sensing system may be calibrated based on the temperature data of the first and second reference cells.

    摘要翻译： 公开了用于校准温度感测系统的系统和方法。 在一个方面，线可以与第一参考单元和第二参考单元处于操作关系。 可以调节第一和第二参考单元的温度。 在一个非限制性实例中，第一参考电池的温度可以被调节到高于环境温度的温度，并且可以将第二参考电池的温度调节到低于环境温度的温度。 可以基于第一和第二参考单元的温度数据来校准温度感测系统。

    Systems and Methods for Detecting Corrosion
    52.
    发明申请
    Systems and Methods for Detecting Corrosion 有权
    检测腐蚀的系统和方法

    公开(公告)号：US20080048103A1

    公开(公告)日：2008-02-28

    申请号：US11876511

    申请日：2007-10-22

    申请人： Chung Lee ,  Willaim Hallidy

    发明人： Chung Lee ,  Willaim Hallidy

    IPC分类号： G01N21/75

    CPC分类号： G01N21/7703 ,  G01N2021/7716 ,  G01N2021/7786

    摘要： Systems and methods for detecting corrosion are provided. In one embodiment, a luminescent material coupled to a cladding of an optical fiber may be altered when exposed to corrosion. The backscatter emission of the luminescent material, which includes the altered optical properties, may be used to determine properties of the corrosion including, for example, thickness, or location of the corrosion.

    摘要翻译： 提供了检测腐蚀的系统和方法。 在一个实施例中，当暴露于腐蚀时，耦合到光纤的包层的发光材料可以改变。 包括改变的光学性质的发光材料的反向散射可以用于确定腐蚀的性质，包括例如腐蚀的厚度或位置。

    METHOD OF ENCAPSULATING AN ORGANIC LIGHT EMITTING DEVICE
    53.
    发明申请
    METHOD OF ENCAPSULATING AN ORGANIC LIGHT EMITTING DEVICE 失效
    封装有机发光器件的方法

    公开(公告)号：US20080038986A2

    公开(公告)日：2008-02-14

    申请号：US11239988

    申请日：2005-09-30

    申请人： Chung Lee ,  Atul Kumar ,  Chieh Chen ,  George Tzeng

    发明人： Chung Lee ,  Atul Kumar ,  Chieh Chen ,  George Tzeng

    IPC分类号： H01J9/26 ,  H01J9/32

    CPC分类号： H01L51/5253

    摘要： A method of forming an organic light emitting device on a substrate is provided, wherein the method includes forming an active device structure on the substrate, adhering a mask to the substrate, wherein the mask covers an electrical contact portion of the substrate while exposing the active device structure, forming an encapsulant layer over the active device structure and the mask, forming a separation between a portion of the encapsulant layer that covers the active device structure and a portion of the encapsulant layer that covers the mask, and removing the mask from the substrate.

    摘要翻译： 提供一种在衬底上形成有机发光器件的方法，其中该方法包括在衬底上形成有源器件结构，将掩模粘贴到衬底上，其中掩模覆盖衬底的电接触部分，同时暴露活性物质 在活性器件结构和掩模上形成密封剂层，在覆盖有源器件结构的封装剂层的一部分和覆盖掩模的封装剂层的一部分之间形成间隔， 基质。

    Vapor Phase Deposition System and Method
    54.
    发明申请
    Vapor Phase Deposition System and Method 审中-公开
    气相沉积系统及方法

    公开(公告)号：US20060275547A1

    公开(公告)日：2006-12-07

    申请号：US11421385

    申请日：2006-05-31

    申请人： Chung Lee ,  Atul Kumar ,  George Tzeng ,  Oanh Nguyen

    发明人： Chung Lee ,  Atul Kumar ,  George Tzeng ,  Oanh Nguyen

    IPC分类号： C23C16/00

    CPC分类号： C23C14/50 ,  H01L21/67109 ,  H01L21/6831 ,  H01L21/68721 ,  H01L21/68778

    摘要： A system for depositing a vapor phase organic compound onto a substrate, comprising a vacuum chamber comprising a wall, a wall heater in thermal communication with the wall of the vacuum chamber, at least one of an evaporative source and a transport polymerization source configured to introduce the vapor phase organic compound into the chamber, and a substrate holder disposed within the vacuum chamber, wherein the substrate holder comprises a cooled chuck, a heat transfer gas source for introducing a heat transfer gas to a space between the cooled chuck and the substrate, and a substrate clamping mechanism comprising at least one of an electrostatic, mechanical and magnetic clamping mechanism.

    摘要翻译： 一种用于将气相有机化合物沉积到基底上的系统，包括真空室，包括壁，与真空室的壁热连通的壁加热器，蒸发源和运输聚合源中的至少一个，其配置成引入 所述气相有机化合物进入所述室，以及衬底保持器，其设置在所述真空室内，其中所述衬底保持器包括冷却的卡盘，用于将传热气体引入所述冷却的卡盘和所述衬底之间的空间的传热气体源， 以及包括静电，机械和磁性夹紧机构中的至少一个的衬底夹持机构。

    Substrate Holder
    55.
    发明申请
    Substrate Holder 审中-公开
    基板支架

    公开(公告)号：US20060274474A1

    公开(公告)日：2006-12-07

    申请号：US11421389

    申请日：2006-05-31

    申请人： Chung Lee ,  Atul Kumar ,  George Tzeng ,  Oanh Nguyen

    发明人： Chung Lee ,  Atul Kumar ,  George Tzeng ,  Oanh Nguyen

    IPC分类号： H01H47/00

    CPC分类号： C23C14/12 ,  C23C14/50 ,  C23C14/541 ,  H01L21/67109 ,  H01L21/68721 ,  H01L21/68778

    摘要： A substrate holder for holding and cooling a substrate during a film deposition process is disclosed, wherein the substrate holder comprises a cooled chuck, and a clamping member movably associated with the cooled chuck, wherein the clamping member is movable between an unclamped position in which a substrate is removable from the substrate holder and a clamped position in which a substrate is clamped to the substrate holder substantially adjacent the cooled chuck.

    摘要翻译： 公开了一种用于在膜沉积工艺期间保持和冷却衬底的衬底保持器，其中衬底保持器包括冷却的卡盘以及与冷却卡盘可移动地相关联的夹紧构件，其中夹紧构件可在松开位置之间移动， 衬底可从衬底保持器和夹持位置移除，其中衬底被夹持到衬底保持器基本上邻近冷却的卡盘。

    Leadframe and packaged light emitting diode
    57.
    发明申请
    Leadframe and packaged light emitting diode 有权
    引线框和封装发光二极管

    公开(公告)号：US20060133044A1

    公开(公告)日：2006-06-22

    申请号：US11178144

    申请日：2005-07-08

    申请人： Do Kim ,  Chung Lee ,  Keon Lee

    发明人： Do Kim ,  Chung Lee ,  Keon Lee

    IPC分类号： H05K7/20

    CPC分类号： H01L33/62 ,  H01L23/4334 ,  H01L24/48 ,  H01L25/0753 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

    摘要： A leadframe that is configured to be used with an electronic device, e.g., light emitting diode (LED), includes a heat sink supporting ring for supporting a heat sink. An outer frame is spaced apart from the heat sink supporting ring, and encloses the heat sink supporting ring. At least one supporting lead connects the heat sink supporting ring and the outer frame. A separated lead is extended from the outer frame toward the heat sink supporting ring, and is spaced apart from the heat sink supporting ring. A package body that may be formed by an injection molding after a heat sink is inserted into the leadframe.

    摘要翻译： 被配置为与诸如发光二极管（LED）的电子设备一起使用的引线框架包括用于支撑散热器的散热器支撑环。 外框架与散热器支撑环间隔开，并且包围散热器支撑环。 至少一个支撑引线连接散热器支撑环和外框。 分离的引线从外框架朝向散热器支撑环延伸，并且与散热器支撑环间隔开。 可以在散热器之后通过注射成型形成的封装体插入引线框架中。

    System for forming composite polymer dielectric film
    59.
    发明申请
    System for forming composite polymer dielectric film 有权
    用于形成复合聚合物电介质膜的系统

    公开(公告)号：US20050223989A1

    公开(公告)日：2005-10-13

    申请号：US10816179

    申请日：2004-03-31

    申请人： Chung Lee ,  Atul Kumar ,  Chieh Chen ,  Yuri Pikovsky

    发明人： Chung Lee ,  Atul Kumar ,  Chieh Chen ,  Yuri Pikovsky

    IPC分类号： B05D1/18 ,  B05D3/06 ,  B05D7/00 ,  B05D7/24 ,  C23C16/00 ,  H01L21/312

    CPC分类号： H01L21/0212 ,  B05D1/185 ,  B05D1/60 ,  B05D3/065 ,  B05D3/067 ,  B05D7/52 ,  H01L21/02263 ,  H01L21/02304 ,  H01L21/02337 ,  H01L21/02362 ,  H01L21/3121 ,  H01L21/3127

    摘要： A system for depositing a composite polymer dielectric film on a substrate is disclosed, wherein the composite polymer dielectric film includes a low dielectric constant polymer layer disposed between a first silane-containing layer and a second silane-containing layer. The system includes a process module having a processing chamber and a monomer delivery system configured to admit a gas-phase monomer into the processing chamber for deposition of the low dielectric constant polymer layer, a post-treatment module for annealing the composite polymer dielectric film, and a silane delivery system configured to admit a vapor flow containing a silane precursor into at least one of the process module and the post-treatment module for the formation of the first silane-containing layer and the silane-containing layer.

    摘要翻译： 公开了一种用于在基板上沉积复合聚合物电介质膜的系统，其中复合聚合物电介质膜包括设置在第一含硅烷层和第二含硅烷层之间的低介电常数聚合物层。 该系统包括具有处理室和单体输送系统的处理模块，该单体输送系统构造成将气相单体进入处理室以沉积低介电常数聚合物层，用于退火复合聚合物电介质膜的后处理模块， 以及硅烷输送系统，其被构造成允许含有硅烷前体的蒸汽流进入至少一个工艺模块和后处理模块中，用于形成第一含硅烷层和含硅烷层。