公开(公告)号：US12121975B2

公开(公告)日：2024-10-22

申请号：US17144265

申请日：2021-01-08

申请人： DISCO CORPORATION

发明人： Keiji Nomaru

IPC分类号： B23B25/06

CPC分类号： B23B25/06

摘要： A cutting machine includes a monitoring unit that monitors a cutting edge of a cutting blade. The monitoring unit includes an imaging unit that images the cutting edge of the cutting blade, a pulse light source that emits a pulse light to illuminate an imaging zone imaged by the imaging unit, and a camera that captures an image outputted from the imaging unit. The imaging unit includes a first imaging unit that images one side surface of the cutting edge of the cutting blade, a second imaging unit that images an opposite side surface of the cutting edge, and a third imaging unit that images an outer peripheral edge portion of the cutting edge.

公开(公告)号：US12097642B2

公开(公告)日：2024-09-24

申请号：US17146657

申请日：2021-01-12

申请人： DISCO CORPORATION

发明人： Keiji Nomaru

IPC分类号： B28D5/00 ,  B23K26/00 ,  B23K26/53

CPC分类号： B28D5/0011 ,  B23K26/0006 ,  B23K26/53 ,  B28D5/0052

摘要： A wafer producing method for producing a wafer from a semiconductor ingot includes a thermal stress wave generating step of applying a pulsed laser beam having a wavelength that is absorbable by the semiconductor ingot to the semiconductor ingot held on the chuck table to generate a thermal stress wave and a fracture layer forming step of applying a pulsed laser beam having a wavelength that is transmittable through the semiconductor ingot to the semiconductor ingot in synchronism with a time during which the thermal stress wave reaches a position corresponding to a thickness of a wafer to be produced from the semiconductor ingot, causing the pulsed laser beam whose wavelength is transmittable through the semiconductor ingot to be absorbed in a region where a band gap is reduced by a tensile stress of the thermal stress wave.

公开(公告)号：US11938570B2

公开(公告)日：2024-03-26

申请号：US17024871

申请日：2020-09-18

申请人： DISCO CORPORATION

发明人： Keiji Nomaru

IPC分类号： B23K26/53 ,  B23B31/30 ,  B23K26/00 ,  B23K26/03 ,  B23K26/04 ,  B23K26/06 ,  B23K26/064 ,  B23K26/067 ,  B23K26/08 ,  B23K26/38 ,  B23K26/402 ,  B23K37/04 ,  B23K101/40

CPC分类号： B23K26/53 ,  B23B31/307 ,  B23K26/0006 ,  B23K26/032 ,  B23K26/04 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/067 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/38 ,  B23K26/402 ,  B23K37/0408 ,  B23K2101/40

摘要： A laser beam applying unit of a laser processing apparatus includes a beam splitter disposed on a first optical path connecting a laser oscillator and a condenser, a wide band light source disposed on a second optical path branched by the beam splitter, a spectroscope that is disposed between the wide band light source and the beam splitter and that branches the laser beam from the second optical path to a third optical path, and a Z position detection unit that is disposed on the third optical path branched by the spectroscope and that detects the position in a Z-axis direction of a workpiece according to an intensity of light corresponding to the wavelength of return light that is generated when the light of the wide band light source is condensed by the condenser and is reflected by the workpiece held by a chuck table.

公开(公告)号：US11504804B2

公开(公告)日：2022-11-22

申请号：US17006030

申请日：2020-08-28

申请人： DISCO CORPORATION

发明人： Keiji Nomaru

IPC分类号： B23K26/06 ,  B23K26/082 ,  B23K26/70 ,  B23K26/0622

摘要： A method of confirming an optical axis of a laser processing apparatus includes placing an image capturing unit so as to be movable in X-axis directions, removing a second mirror and capturing an image of a laser beam with the image capturing unit for receiving the laser beam reflected by a first mirror, installing the second mirror and capturing an image of the laser beam with the image capturing unit for receiving the laser beam reflected by a third mirror, and determining whether an optical axis of the laser beam reflected by the first mirror and an optical axis of the laser beam reflected by the third mirror exist in one XZ plane or not on the basis of the captured images and a reference line in the captured images.

公开(公告)号：US11165408B2

公开(公告)日：2021-11-02

申请号：US16042097

申请日：2018-07-23

申请人： DISCO CORPORATION

发明人： Jun Abatake ,  Kenya Kai ,  Kentaro Shiraga ,  Keiji Nomaru

IPC分类号： H03H3/02 ,  H03H3/08 ,  H01L41/337 ,  H03H9/02 ,  B23K26/00 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/361 ,  B23K26/03 ,  H01L41/313 ,  H01L41/335 ,  B23K26/57 ,  G01B11/06 ,  B24B7/22

摘要： A method of manufacturing a substrate for an acoustic wave device includes: a substrate joining step of joining a piezoelectric material layer to a surface on one side of a support substrate; a grinding step of grinding the piezoelectric material layer; a removal amount map forming step of measuring in-plane thickness of the piezoelectric material layer by an optical thickness meter, and calculating a removal amount for the piezoelectric material layer for adjusting thickness variability of the piezoelectric material layer to or below a threshold on the basis of each coordinate in the plane, to form a removal amount map; a laser processing step of applying a pulsed laser beam of such a wavelength as to be absorbed in the piezoelectric material layer, to selectively remove the piezoelectric material layer, based on the removal amount map; and a polishing step of polishing the surface of the piezoelectric material layer.

公开(公告)号：US11090762B2

公开(公告)日：2021-08-17

申请号：US16157283

申请日：2018-10-11

申请人： DISCO CORPORATION

发明人： Yuji Hadano ,  Masatoshi Nayuki ,  Keiji Nomaru

IPC分类号： B23K26/02 ,  B23K26/06 ,  B23K26/12 ,  B23K26/14 ,  B23K26/18

摘要： A laser processing apparatus includes a liquid supply mechanism at an upper portion of a holding unit. The liquid supply mechanism includes: a liquid chamber provided with a transparent plate located with a gap formed between the transparent plate and an upper surface of a workpiece held by the holding table; a liquid supply nozzle adapted to supply a liquid to the gap from one side of the liquid chamber; and a liquid discharge nozzle adapted to recover the liquid from the other side of the liquid chamber, to produce a flow of the liquid. A laser beam applying unit includes a condenser adapted to focus a laser beam emitted by a laser oscillator, to apply the laser beam to the workpiece held by the holding table through the transparent plate and the liquid supplied to the gap.

公开(公告)号：US11015919B2

公开(公告)日：2021-05-25

申请号：US16715672

申请日：2019-12-16

申请人： DISCO CORPORATION

发明人： Nobuyuki Kimura ,  Keiji Nomaru

IPC分类号： G01B11/06

摘要： A thickness measuring apparatus includes a white light source for emitting white light, a dispersing mechanism for producing time differences corresponding to the wavelengths of light components of the white light to thereby generate spectral light, the spectral light being applied to the workpiece and then reflected on the upper surface and the lower surface of the workpiece to obtain return light, a two-dimensional image sensor having a photodetecting area for detecting the return light, the photodetecting area including a plurality of pixels, a storing section for storing the intensity of the return light detected by the plural pixels according to wavelength with time difference, the intensity of the return light detected by each pixel being stored as a spectral interference waveform, and a thickness computing section for computing the thickness of the workpiece from the spectral interference waveform stored in the storing section.

公开(公告)号：US10557704B2

公开(公告)日：2020-02-11

申请号：US16265353

申请日：2019-02-01

申请人： DISCO CORPORATION

发明人： Shuichiro Tsukiji ,  Yuki Ikku ,  Keiji Nomaru ,  Satoshi Kobayashi

IPC分类号： G01B11/22

摘要： A non-destructive detection method includes, after carrying out a preparation step of preparing an inspection apparatus, an image acquisition step of intermittently moving an objective lens by a predetermined distance in a Z-axis direction orthogonal to an X-Y plane to be made closer to a first surface, positioning a focal point to a Z-axis coordinate value where a distance of the focal point extends by a refractive index of a workpiece, acquiring an X-Y plane image of an inside of the workpiece for each of a plurality of Z-axis coordinate values, and then, recording the acquired images in a recording unit, and a modified layer detecting step of detecting a state of a modified layer from the X-Y plane image for each of the plurality of Z-axis coordinate values recorded in the recording unit.

公开(公告)号：US20190039185A1

公开(公告)日：2019-02-07

申请号：US16048608

申请日：2018-07-30

申请人： DISCO CORPORATION

发明人： Masatoshi Nayuki ,  Keiji Nomaru

IPC分类号： B23K26/364 ,  H01L21/687 ,  H01L21/67

摘要： A laser processing apparatus for processing a wafer along projected dicing lines with a laser beam has a laser oscillator, a polygon mirror having a plurality of reflecting surfaces and rotatable about a central axis thereof, and an fθ lens for focusing the beam reflected by the reflecting surfaces of the polygon mirror and applying the focused beam to the wafer. The reflecting surfaces of the polygon mirror include a zero-gradient reflecting surface lying at a zero gradient parallel to the central axis, a positive-gradient reflecting surface that is inclined at a positive gradient from the zero gradient, and a negative-gradient reflecting surface that is inclined at a negative gradient from the zero gradient. The polygon mirror swings the laser beam in a direction perpendicular to a processing feed direction within the width of each of the projected dicing lines and in the processing feed direction.

公开(公告)号：US09802270B2

公开(公告)日：2017-10-31

申请号：US14840338

申请日：2015-08-31

申请人： DISCO CORPORATION

发明人： Keiji Nomaru ,  Koichi Katayama

IPC分类号： B23K26/067 ,  B23K26/364 ,  B23K26/402 ,  H01L21/687 ,  B23K103/00

CPC分类号： B23K26/0676 ,  B23K26/364 ,  B23K26/402 ,  B23K2103/50 ,  B23K2103/56

摘要： A laser machining apparatus has a laser beam irradiation unit that includes: a pulsed laser oscillator that oscillates a pulsed laser beam at a given repetition frequency; first and second condensers that collect the pulsed laser beam oscillated by the pulsed laser oscillator; and a beam splitting unit arranged between the pulsed laser oscillator and the first and second condensers to split the pulsed laser beam oscillated by the pulsed laser oscillator and direct the resultant beams alternately toward the first and second condensers. The beam splitting unit includes a photoelastic modulator that has a piezo element and a synthetic quartz formed in one piece and modulates the laser beam so that a polarization plane of the laser beam is alternately at 0 and 90 degrees by applying, to the piezo element, a high frequency voltage at a frequency that matches the natural frequency of the synthetic quartz.