公开(公告)号：US08642694B2

公开(公告)日：2014-02-04

申请号：US12713569

申请日：2010-02-26

申请人： Koji Morita ,  Hirofumi Yamashita ,  Hitomi Ohara ,  Shiro Kobayashi ,  Masahiko Ishii

发明人： Koji Morita ,  Hirofumi Yamashita ,  Hitomi Ohara ,  Shiro Kobayashi ,  Masahiko Ishii

IPC分类号： C08L67/04 ,  C08G63/08 ,  C08G63/02 ,  C08G63/06

CPC分类号： C08L67/04 ,  C08F220/06 ,  C08F220/14 ,  C08F220/18 ,  C08F2220/1825 ,  C08F2220/281 ,  C08L33/066 ,  C08L33/068 ,  C08L2666/04 ,  C08L2666/02

摘要： There are provided: a bio-based coating composition which is a bio-based ingredient coating composition in consideration of environment and does not need any expensive ingredient and is also excellent in hydrolysis resistance; and an article coated with the coating composition. The bio-based coating composition is characterized by comprising the following film-forming ingredients: a lactic acid polymer (A) which contains a polyfunctional compound having a hydroxyl group and/or a carboxyl group in a functionality of not less than 3 and lactic acid as essential monomer ingredients and has a specific SP value; and a resin (B) which contains a hydroxyl group and/or a carboxyl group and has a specific SP value; wherein the difference (ΔSP) between the SP values of the lactic acid polymer (A) and the resin (B) is in the range of 0.2 to 4.0. The coated article is characterized by being obtained by being coated with the aforementioned coating composition.

摘要翻译： 提供：生物基涂料组合物，考虑到环境是生物基成分涂料组合物，不需要任何昂贵的成分，并且耐水解性也优异; 和涂覆有涂料组合物的制品。 生物基涂料组合物的特征在于包含以下成膜成分：含有官能度不低于3的具有羟基和/或羧基的多官能化合物的乳酸聚合物（A）和乳酸 作为必需单体成分，具有特定的SP值; 和含有羟基和/或羧基并具有特定SP值的树脂（B）; 其中，乳酸聚合物（A）和树脂（B）的SP值之差（DeltaSP）在0.2〜4.0的范围内。 涂层制品的特征在于通过涂覆上述涂料组合物获得。

公开(公告)号：US20130226436A1

公开(公告)日：2013-08-29

申请号：US13260003

申请日：2010-11-17

申请人： Koji Morita

发明人： Koji Morita

IPC分类号： F02D41/02

CPC分类号： F02D41/0235 ,  F02D19/084 ,  F02D19/087 ,  F02D19/088 ,  F02D41/1454 ,  F02D41/1473 ,  F02D41/182 ,  F02D41/187 ,  F02D2041/147 ,  Y02T10/36

摘要： When alcohol mixing fuel is supplied to an internal combustion engine, an intake air flow rate is detected and a basic amplitude amount α of an upstream target air-fuel ratio abyfr corresponding to this detected intake air flow rate is calculated. Next, alcohol concentration in the fuel (in more detail, ethanol concentration Cetha) and a cooling water temperature (or an intake air temperature) are detected, hydrogen concentration Ch in a mixing exhaust gas is calculated based on the detected ethanol concentration Cetha and the detected cooling water temperature (or the detected intake air temperature) amplitude gain β corresponding to the calculated hydrogen concentration is calculated and finally, an amplitude amount (α×β) of the upstream target air-fuel ratio is calculated.

摘要翻译： 当将混合燃料的燃料供应到内燃机时，检测进气流量，并且计算与该检测到的进气流量相对应的上游目标空燃比abyfr的基本振幅量α。 接下来，检测燃料中的酒精浓度（更详细地，乙醇浓度Cetha）和冷却水温度（或进气温度），基于检测到的乙醇浓度Cetha计算混合排气中的氢浓度Ch 计算与计算出的氢浓度相对应的检测到的冷却水温度（或检测到的进气温度）振幅增益β，最后计算上游目标空燃比的振幅量（α×β）。

公开(公告)号：US08374377B2

公开(公告)日：2013-02-12

申请号：US12764207

申请日：2010-04-21

申请人： Mamoru Yamaguchi ,  Koji Morita

发明人： Mamoru Yamaguchi ,  Koji Morita

IPC分类号： H04R1/02 ,  H04R1/00 ,  H04R11/02

CPC分类号： H04R1/025 ,  B60R11/0217 ,  H04R2499/13

摘要： A speaker apparatus in accordance with the present invention is for use with a vehicle having a compartment and is to be mounted to the vehicle. The speaker apparatus includes: an interior member including a hole edge that defines an attachment hole; a speaker unit configured to be placed in the attachment hole, the speaker unit including a limiting member; and a speaker grille configured to be attached in the attachment hole from an inside of the compartment, the speaker grille including a claw-fixing portion that is bendable and is configured to be engaged with the hole edge. Accompanying the engagement of the claw-fixing portion with the hole edge, the speaker grille is fixed to the interior member. Accompanying the placement of the speaker unit in the attachment hole, the limiting member is positioned in a bending space for the claw-fixing portion and thereby prevents disengagement of the claw-fixing portion from the hole edge.

摘要翻译： 根据本发明的扬声器装置用于具有隔间的车辆并且将被安装到车辆上。 扬声器装置包括：内部构件，其包括限定附接孔的孔边缘; 配置成放置在所述安装孔中的扬声器单元，所述扬声器单元包括限制构件; 以及扬声器格栅，其构造成从所述隔间的内部附接在所述安装孔中，所述扬声器格栅包括可弯曲并被配置为与所述孔边缘接合的爪固定部。 伴随着爪固定部与孔边缘的接合，扬声器格栅固定在内部构件上。 伴随着扬声器单元在安装孔中的放置，限位构件位于用于爪固定部的弯曲空间中，从而防止爪固定部从孔边缘脱离。

公开(公告)号：US20100071271A1

公开(公告)日：2010-03-25

申请号：US12443545

申请日：2007-10-19

申请人： Shinji Soma ,  Koji Morita ,  Tomohiro Inagaki ,  Takayuki Moroto ,  Kazuhiko Sugita ,  Tomoyasu Imai ,  Yasuji Kunihiro

发明人： Shinji Soma ,  Koji Morita ,  Tomohiro Inagaki ,  Takayuki Moroto ,  Kazuhiko Sugita ,  Tomoyasu Imai ,  Yasuji Kunihiro

IPC分类号： B24D18/00 ,  B24D5/06 ,  B24D5/10

CPC分类号： B24D3/14 ,  B24D5/06 ,  B24D5/10 ,  B24D18/0009 ,  B24D99/005

摘要： A grinding wheel is manufactured such that (a) any one of particles for an abrasive grain layer and particles for a substrate layer are put into the press-mold die, and other particles are put onto the particles in the press-mold die, and then the substrate layer and the abrasive grain layer are integrally press-molded to form a non-baked grinding chip with an arcuate shape; (b) depressions are formed on the abrasive grain layer of the non-baked grinding chip; (c) the grinding chip on which the depressions are formed is baked; and (d) the plurality of baked-grinding chips are adhered to a core of the grinding wheel.

摘要翻译： 制造砂轮，使得（a）将用于磨粒层的颗粒和用于基材层的颗粒中的任一种放入压模模具中，并将其它颗粒放在压模模中的颗粒上， 然后将基材层和磨粒层整体加压成型，形成具有弓形形状的非烘烤研磨片; （b）在非烘烤研磨片的磨粒层上形成凹部; （c）烘烤形成凹部的研磨片; 和（d）多个烘烤磨碎片粘附到砂轮的芯部。

公开(公告)号：US20100028768A1

公开(公告)日：2010-02-04

申请号：US12507510

申请日：2009-07-22

申请人： Koji Morita ,  Satoshi Fujiki ,  Hideki Nakai

发明人： Koji Morita ,  Satoshi Fujiki ,  Hideki Nakai

IPC分类号： H01M2/16 ,  H01M4/48

CPC分类号： H01M4/525 ,  H01M2/1653 ,  H01M4/131 ,  H01M4/134 ,  H01M4/362 ,  H01M4/485 ,  H01M4/5825 ,  H01M10/052 ,  Y02E60/122

摘要： A positive electrode active material includes: a complex oxide particle containing at least lithium and one or plural transition metals; and a coating layer provided in at least a part of the complex oxide particle, wherein the coating layer contains at least one element M which is different from the principal transition metal constituting the complex oxide particle and which is selected among elements belonging to the Groups 2 to 13, and at least one element X selected among phosphorus (P), silicon (Si) and germanium (Ge), and the element M and the element X show different distribution from each other in the coating layer.

摘要翻译： 正极活性物质包括：至少含有锂和一种或多种过渡金属的复合氧化物颗粒; 以及设置在所述复合氧化物粒子的至少一部分中的涂层，其中所述涂层含有与构成所述复合氧化物粒子的所述主过渡金属不同的至少一种元素M，所述元素M选自属于第2族的元素 至13，以及选自磷（P），硅（Si）和锗（Ge）中的至少一种元素X，元素M和元素X在涂层中表现出彼此不同的分布。

公开(公告)号：US07273043B2

公开(公告)日：2007-09-25

申请号：US11715972

申请日：2007-03-09

申请人： Shigeo Okubo ,  Zenichiro Mashiki ,  Nobuyuki Shibagaki ,  Hiroyuki Nomura ,  Yoshiyuki Shogenji ,  Kenichi Kinose ,  Takuji Matsubara ,  Yusuke Nakayama ,  Yukihiro Sonoda ,  Koji Morita

发明人： Shigeo Okubo ,  Zenichiro Mashiki ,  Nobuyuki Shibagaki ,  Hiroyuki Nomura ,  Yoshiyuki Shogenji ,  Kenichi Kinose ,  Takuji Matsubara ,  Yusuke Nakayama ,  Yukihiro Sonoda ,  Koji Morita

IPC分类号： F02M33/04 ,  F02M33/02

CPC分类号： F02D41/0042 ,  F02D41/3023 ,  F02D41/3094 ,  F02M63/029 ,  F02M69/046

摘要： When an injection sharing ratio r is neither 0 nor 1, an engine ECU executes a program including a step of calculating a purge reduction amount of an in-cylinder injector as fpg×r and calculating a purge reduction amount of an intake manifold injector as fpg×(1−r) when performing purge processing according to a current fuel injection sharing ratio of the injectors, and a step of calculating a correction fuel injection amount of the in-cylinder injector by raising the fuel injection amount to a minimum fuel injection amount, and calculating a correction fuel injection amount of the intake manifold injector by subtracting the raised amount from the fuel injection amount of the intake manifold injector when the fuel injection amount of the in-cylinder injector calculated by using the purge reduction amount is lower than the minimum injection amount.

摘要翻译： 当喷射共享比r既不是0也不是1时，发动机ECU执行包括将缸内喷射器的吹扫减少量计算为fpgxr并计算进气歧管喷射器的吹扫减少量的步骤的程序，如fpgx（1 -r），以及根据喷射器的当前燃料喷射分配比进行吹扫处理的步骤，以及通过将燃料喷射量上升到最小燃料喷射量来计算缸内喷射器的校正燃料喷射量的步骤，并且计算 当通过使用吹扫减少量计算的缸内喷油器的燃料喷射量低于最小喷射量时，通过从进气歧管喷油器的燃料喷射量中减去上升量的进气歧管喷射器的校正燃料喷射量 。

公开(公告)号：US07075036B2

公开(公告)日：2006-07-11

申请号：US10479960

申请日：2002-06-07

申请人： Shinichi Ogimoto ,  Koji Morita

发明人： Shinichi Ogimoto ,  Koji Morita

IPC分类号： H01L21/603

CPC分类号： B23K20/023 ,  B23K2101/40 ,  B23K2101/42

摘要： An electronic part compression bonding apparatus includes a compression bonding unit which bonds the electronic parts onto the substrate by thermocompression, a pressure supply unit, a pressure control unit which controls pressure, a heating unit which heats the compression bonding unit, a temperature control unit, and a thermocompression bonding control unit which controls the pressure control unit and the heating unit based on thermocompression bonding condition data in which at least one of pressure and heating temperature is variably set during a process from start until completion of a thermocompression bonding operation of the electronic parts. In the thermocompression bonding condition data, the pressure is set to a first pressure in a first stage in a process of the thermocompression bonding operation and a second pressure, which is lower than the first pressure, in a second stage that follows the first stage.

摘要翻译： 电子部件压接装置包括通过热压将电子部件接合到基板上的压接单元，压力供给单元，控制压力的压力控制单元，加压压接单元的加热单元，温度控制单元， 以及热压接合控制单元，其基于热压接条件数据来控制压力控制单元和加热单元，其中在从电子器件的热压接操作的开始到完成的处理期间可变地设置压力和加热温度中的至少一个 部分。 在热压接条件数据中，在第一阶段的第二阶段中，在热压接操作的过程中的第一阶段将压力设定为第一压力，而在第一阶段之后的第二阶段将压力设定为低于第一压力的第二压力。

公开(公告)号：US20050255270A1

公开(公告)日：2005-11-17

申请号：US11165345

申请日：2005-06-24

申请人： Shin Takanezawa ,  Koji Morita ,  Takako Watanabe ,  Toshihisa Kumakura ,  Hiroyuki Fukai ,  Hiroaki Fujita

发明人： Shin Takanezawa ,  Koji Morita ,  Takako Watanabe ,  Toshihisa Kumakura ,  Hiroyuki Fukai ,  Hiroaki Fujita

IPC分类号： B32B27/38 ,  C08G59/62 ,  C08K5/53 ,  C08L63/04 ,  H05K1/00 ,  H05K3/46 ,  B65D1/00

CPC分类号： H05K3/4676 ,  H05K3/4644 ,  H05K2201/0209 ,  H05K2201/0212 ,  Y10S428/901 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T428/1376 ,  Y10T428/236 ,  Y10T428/24157 ,  Y10T428/24917 ,  Y10T428/2804 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/2887 ,  Y10T428/31511 ,  Y10T428/31515

摘要： Directed to an insulating resin composition which comprises (A) a novolak epoxy resin having a biphenyl structure, (B) carboxylic acid-modified acrylonitrile butadiene rubber particles, (C) a triazine ring-containing cresol novolak phenolic resin, (D) a phenolic hydroxyl group-containing phosphorus compound, and (E) inorganic filler, an insulating film having a support using the same, a multilayer wiring board, and a process for producing a multilayer wiring board.

公开(公告)号：US06798078B2

公开(公告)日：2004-09-28

申请号：US10022297

申请日：2001-12-12

申请人： Koji Morita ,  Takayuki Murai ,  Takao Yoshikawa

发明人： Koji Morita ,  Takayuki Murai ,  Takao Yoshikawa

IPC分类号： H01L2328

CPC分类号： H01L23/544 ,  H01L23/3121 ,  H01L24/40 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/05599 ,  H01L2224/40225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/85399 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device for power control includes a substrate made of aluminum. Lands of copper are formed on the substrate. Semiconductor chips, such as FETs, are mounted on the lands. The semiconductor chips are joined with the lands only through solder layers. A synthetic resin, which includes epoxide, covers the lands, the solder layers and the semiconductor chips on the substrate. Preferably, a coefficient of expansion of the synthetic resin is generally less than a coefficient of expansion of the substrate or a coefficient of expansion of the lands. Each semiconductor chip defines at least two corners positioned generally opposite to each other. Each land defines at least two corners disposed in proximity to the corners of the semiconductor chip. The corners of the land generally confine the corners of the semiconductor chip therein.

摘要翻译： 用于功率控制的半导体器件包括由铝制成的衬底。 在基板上形成铜的区域。 诸如FET的半导体芯片安装在焊盘上。 半导体芯片仅通过焊料层与焊盘接合。 包括环氧化物的合成树脂覆盖基板上的焊盘，焊料层和半导体芯片。 优选地，合成树脂的膨胀系数通常小于基材的膨胀系数或者焊盘的膨胀系数。 每个半导体芯片限定至少两个通常彼此相对定位的角。 每个区域限定了靠近半导体芯片的拐角设置的至少两个拐角。 地面的拐角通常将半导体芯片的角部限制在其中。

公开(公告)号：US06516681B1

公开(公告)日：2003-02-11

申请号：US09662743

申请日：2000-09-15

申请人： Francois Pierrot ,  Olivier Company ,  Tetsuro Shibukawa ,  Koji Morita

发明人： Francois Pierrot ,  Olivier Company ,  Tetsuro Shibukawa ,  Koji Morita

IPC分类号： B25J906

CPC分类号： B25J17/0266 ,  A61B2034/304 ,  B25J9/0051 ,  Y10T74/20305 ,  Y10T74/20317

摘要： A four-degree-of-freedom parallel robot capable of displacing a traveling plate with four degrees of freedom at a high speed and a high acceleration and positioning the traveling plate with high rigidity and high precision. The four-degree-of-freedom parallel robot has four actuators fixed to a base, four parallel linkages each of which is coupled at its upper end to a tip end of an arm of each of the actuators through a kinematic element such as a universal joint, and a traveling plate whose four corners are coupled to lower ends of the parallel linkages through kinematic elements. By controlling the actuators, a main member of the traveling plate is displaced with four degrees of freedom, i.e., translated in all directions and rotated around a predetermined axis. Only axial forces are applied to rods constituting the parallel linkages. Thus, the traveling plate can be positioned at a high speed and with high rigidity as well as high precision.

摘要翻译： 一种四自由度平行机器人，能够以高速和高加速度的四自由度移动行驶板，并且以高刚性和高精度定位行进板。 四自由度并联机器人具有固定在基座上的四个致动器，四个平行连杆，每个致动器的上端通过诸如通用的运动元件联接到每个致动器的臂的末端 接头和行星板，其四个角通过运动元件联接到平行连杆的下端。 通过控制致动器，行进板的主要构件以四个自由度移位，即在所有方向上平移并围绕预定轴线旋转。 只有轴向力施加到构成平行连杆的杆上。 因此，移动板可以高速，高刚性和高精度地定位。