Semiconductor device and methods thereof
    52.
    发明申请
    Semiconductor device and methods thereof 有权
    半导体器件及其方法

    公开(公告)号:US20070246802A1

    公开(公告)日:2007-10-25

    申请号:US11702624

    申请日:2007-02-06

    IPC分类号: H01L23/58 H01L21/469

    摘要: A semiconductor device and method thereof. The example method may include forming a semiconductor device, including forming a first layer on a substrate, the first layer including aluminum nitride (AlN), forming a second layer by oxidizing a surface of the first layer and forming a third layer on the second layer, the first, second and third layers each being highly oriented with respect to one of a plurality crystallographic planes. The example semiconductor device may include a substrate including a first layer, the first layer including aluminum nitride (AlN), a second layer formed by oxidizing a surface of the first layer and a third layer formed on the second layer, the first, second and third layers each being highly oriented with respect to one of a plurality crystallographic planes.

    摘要翻译: 半导体器件及其方法。 示例性方法可以包括形成半导体器件,包括在衬底上形成第一层,第一层包括氮化铝(AlN),通过氧化第一层的表面并在第二层上形成第三层来形成第二层 ,第一层,第二层和第三层各自相对于多个晶面之一高度取向。 示例性半导体器件可以包括:衬底,其包括第一层,第一层包括氮化铝(AlN),通过氧化第一层的表面形成的第二层和形成在第二层上的第三层,第一层,第二层和第二层 第三层各自相对于多个晶面之一高度取向。

    Three-dimensional crossbar array
    53.
    发明授权
    Three-dimensional crossbar array 有权
    三维交叉数组

    公开(公告)号:US08803212B2

    公开(公告)日:2014-08-12

    申请号:US13209606

    申请日:2011-08-15

    申请人: Hans S. Cho

    发明人: Hans S. Cho

    摘要: A three-dimensional crossbar array may include a metal layer, and an insulator layer disposed adjacent the metal layer. A trench may be formed in the metal layer to create sections in the metal layer, and a portion of the trench may include an insulator. A hole may be formed in the trench and contact a section of the metal layer. The hole may define a via. A contact region between the via and the section of the metal layer may define a crossbar array.

    摘要翻译: 三维交叉开关阵列可以包括金属层和邻近金属层设置的绝缘体层。 可以在金属层中形成沟槽以在金属层中形成部分,并且沟槽的一部分可以包括绝缘体。 可以在沟槽中形成孔并接触金属层的一部分。 孔可以定义通孔。 通孔和金属层的截面之间的接触区域可以限定交叉开关阵列。

    Electrically actuated device
    54.
    发明授权
    Electrically actuated device 有权
    电动装置

    公开(公告)号:US08502188B2

    公开(公告)日:2013-08-06

    申请号:US13142504

    申请日:2011-06-28

    IPC分类号: H01L29/02

    摘要: An electrically actuated device includes a first electrode and a second electrode crossing the first electrode at a non-zero angle, thereby forming a junction therebetween. A material is established on the first electrode and at the junction. At least a portion of the material is a matrix region. A current conduction channel extends substantially vertically between the first and second electrodes, and is defined in at least a portion of the material positioned at the junction. The current conduction channel has a controlled profile of dopants therein.

    摘要翻译: 电驱动装置包括第一电极和第二电极,其以非零角度与第一电极交叉,从而在它们之间形成接合部。 在第一电极和接合处建立材料。 材料的至少一部分是矩阵区域。 电流传导通道在第一和第二电极之间基本垂直地延伸,并且限定在位于结处的材料的至少一部分中。 电流传导通道在其中具有受控的掺杂剂分布。

    THREE-DIMENSIONAL CROSSBAR ARRAY
    56.
    发明申请
    THREE-DIMENSIONAL CROSSBAR ARRAY 有权
    三维十字架阵列

    公开(公告)号:US20130043056A1

    公开(公告)日:2013-02-21

    申请号:US13209606

    申请日:2011-08-15

    申请人: Hans S. Cho

    发明人: Hans S. Cho

    IPC分类号: H01B5/00 H01B13/00

    摘要: A three-dimensional crossbar array may include a metal layer, and an insulator layer disposed adjacent the metal layer. A trench may be formed in the metal layer to create sections in the metal layer, and a portion of the trench may include an insulator. A hole may be formed in the trench and contact a section of the metal layer. The hole may define a via. A contact region between the via and the section of the metal layer may define a crossbar array.

    摘要翻译: 三维交叉开关阵列可以包括金属层和邻近金属层设置的绝缘体层。 可以在金属层中形成沟槽以在金属层中形成部分,并且沟槽的一部分可以包括绝缘体。 可以在沟槽中形成孔并接触金属层的一部分。 孔可以定义通孔。 通孔和金属层的截面之间的接触区域可以限定交叉开关阵列。

    Semiconductor device including gate stack formed on inclined surface and method of fabricating the same
    58.
    发明授权
    Semiconductor device including gate stack formed on inclined surface and method of fabricating the same 有权
    包括在倾斜表面上形成的栅叠层的半导体器件及其制造方法

    公开(公告)号:US08012819B2

    公开(公告)日:2011-09-06

    申请号:US12654866

    申请日:2010-01-07

    IPC分类号: H01L29/78

    摘要: A semiconductor device includes a transistor. The transistor includes a substrate having an inclined surface, a first upper surface extending from a lower portion of the inclined surface, and a second upper surface extending from an upper end of the inclined surface. A gate stack structure is formed on the inclined surface and includes a gate electrode. A first impurity region formed on one of the first and second upper surfaces contacts the gate stack structure. A second impurity region formed on the second upper surface contacts the gate stack structure. A channel between the first and second impurity regions is formed along the inclined surface in a crystalline direction.

    摘要翻译: 半导体器件包括晶体管。 晶体管包括具有倾斜表面的基板,从倾斜表面的下部延伸的第一上表面和从倾斜表面的上端延伸的第二上表面。 栅极堆叠结构形成在倾斜表面上并且包括栅电极。 形成在第一和第二上表面中的一个上的第一杂质区域接触栅极堆叠结构。 形成在第二上表面上的第二杂质区域接触栅堆叠结构。 第一和第二杂质区之间的通道在结晶方向上沿着倾斜表面形成。

    Microlens and an image sensor including a microlens
    60.
    发明授权
    Microlens and an image sensor including a microlens 失效
    微透镜和包括微透镜的图像传感器

    公开(公告)号:US07750424B2

    公开(公告)日:2010-07-06

    申请号:US11819386

    申请日:2007-06-27

    IPC分类号: H01L31/062 H01L31/107

    摘要: A microlens, an image sensor including the microlens, a method of forming the microlens and a method of manufacturing the image sensor are provided. The microlens includes a polysilicon pattern, having a cylindrical shape, formed on a substrate, and a round-type shell portion enclosing the polysilicon pattern. The microlens may further include a filler material filling an interior of the shell portion, or a second shell portion covering the first shell portion. The method of forming a microlens includes forming a silicon pattern on a semiconductor substrate having a lower structure, forming a capping film on the semiconductor substrate over the silicon pattern, annealing the silicon pattern and the capping film altering the silicon pattern to a polysilicon pattern having a cylindrical shape and the capping film to a shell portion for a round-type microlens, and filling an interior of the shell portion with a lens material through an opening between the semiconductor substrate and an edge of the shell portion. The image sensor includes a microlens formed by a similar method and a photodiode having a cylindrical shape.

    摘要翻译: 提供微透镜,包括微透镜的图像传感器,形成微透镜的方法和制造图像传感器的方法。 微透镜包括形成在基板上的具有圆柱形状的多晶硅图案和包围多晶硅图案的圆形外壳部分。 微透镜还可以包括填充壳体部分的内部的填充材料或覆盖第一壳体部分的第二壳体部分。 形成微透镜的方法包括在具有较低结构的半导体衬底上形成硅图案,在硅图案上的半导体衬底上形成覆盖膜,使硅图案和覆盖膜退火,将硅图案改变为具有 圆筒形,并且封盖膜用于圆形微透镜的外壳部分,并且通过半导体基板和外壳部分的边缘之间的开口用透镜材料填充外壳部分的内部。 图像传感器包括通过类似方法形成的微透镜和具有圆柱形状的光电二极管。