公开(公告)号：US5747917A

公开(公告)日：1998-05-05

申请号：US601477

申请日：1996-02-14

申请人： Harald Herchen

发明人： Harald Herchen

IPC分类号： H01L21/302 ,  H01J37/32 ,  H01L21/205 ,  H01L21/3065 ,  H01J17/26 ,  H01J7/24 ,  H01J61/28 ,  H05B31/26

CPC分类号： H01J37/32357

摘要： An improved plasma applicator uses a double-walled sapphire sleeve assembly to provide a high efficiency cooling mechanism that is adapted for use with high power applications and aggressive plasma chemistries in the generation of a plasma. Plasma contained within a highly thermally emissive first sapphire member heats the member, causing it to radiate thermal energy. The radiated thermal energy crosses a narrow gap and passes through an infrared-transparent second sapphire member. An infrared-absorbing coolant fluid that exhibits negligible microwave absorption is flowed in a second gap between the second sapphire member and a third member and absorbs most of the infrared radiation over the fluid's bulk. The use of a bulk fluid optimizes the cooling of the plasma to reduce ion and electron density and maximize reactive species output from the applicator to a vacuum process chamber.

摘要翻译： 改进的等离子体施加器使用双壁蓝宝石套筒组件来提供高效率冷却机构，其适用于高功率应用和侵蚀性等离子体化学品的产生等离子体。 包含在高度发热的第一蓝宝石构件内的等离子体加热构件，使其辐射热能。 辐射热能穿过窄间隙并穿过红外线透明的第二蓝宝石部件。 显示出微不足道的微波吸收的红外线吸收式冷却剂流体在第二蓝宝石构件和第三构件之间的第二间隙中流动，并且吸收流体本体上的大部分红外辐射。 大量流体的使用优化了等离子体的冷却，以减少离子和电子密度，并使从施涂器到真空处理室的反应物种输出最大化。

公开(公告)号：US08802331B2

公开(公告)日：2014-08-12

申请号：US13306511

申请日：2011-11-29

申请人： Harald Herchen ,  Martin Janousek

发明人： Harald Herchen ,  Martin Janousek

IPC分类号： H01M8/02 ,  H01M8/04 ,  G01N27/72 ,  G01N27/82 ,  G01N21/95 ,  G01N29/24 ,  G01N29/07

CPC分类号： G01N29/2418 ,  G01N21/95 ,  G01N27/82 ,  G01N29/07 ,  H01M8/0202 ,  Y02P70/56

摘要： Various embodiments provide methods for testing a fuel cell interconnect including the steps of providing a fuel cell interconnect and performing a non-destructive test on the fuel cell interconnect comprising at least one of detecting a magnetic response of the interconnect, calculating a volume by optically illuminating the interconnect, detecting an acoustic response of the interconnect, and detecting a thermal response of the interconnect.

摘要翻译： 各种实施例提供了用于测试燃料电池互连的方法，包括以下步骤：提供燃料电池互连并对燃料电池互连进行非破坏性测试，包括检测互连的磁响应中的至少一个，通过光学照射来计算体积 互连，检测互连的声响应，以及检测互连的热响应。

公开(公告)号：US08785821B2

公开(公告)日：2014-07-22

申请号：US12823802

申请日：2010-06-25

申请人： Harald Herchen

发明人： Harald Herchen

IPC分类号： H05B3/68 ,  C23C16/00

CPC分类号： H05B3/283 ,  H01L21/67103 ,  H01L21/67109

摘要： A substrate processing apparatus for heating a substrate is provided. The substrate processing apparatus can include a top and bottom planar member. A heater layer can be disposed between the top and the bottom planar member and held in place by evacuating a region between the two planar members. The heater layer can be made of alternating insulating and conducting layers with heater elements formed on the conducting layers in predetermined pattern.

摘要翻译： 提供了一种用于加热基板的基板处理装置。 基板处理装置可以包括顶部和底部平面部件。 加热器层可以设置在顶部和底部平面构件之间，并且通过抽吸两个平面构件之间的区域而保持就位。 加热器层可以由具有以预定图案形成在导电层上的加热器元件的交替绝缘和导电层制成。

公开(公告)号：US07743728B2

公开(公告)日：2010-06-29

申请号：US12106824

申请日：2008-04-21

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool). In one embodiment, the cluster tool is adapted to perform a track lithography process in which a photosensitive material is applied to a substrate, patterned in a stepper/scanner, and then removed in a developing process completed in the cluster tool. In one embodiment of the cluster tool, substrates are grouped together in groups of two or more for transfer or processing to improve system throughput, reduce the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, and thus increase system reliability. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

摘要翻译： 实施例通常提供使用多室处理系统（例如，集群工具）来处理衬底的装置和方法。 在一个实施例中，簇工具适于执行轨道光刻工艺，其中感光材料被施加到基板上，在步进/扫描器中图案化，然后在以集群工具完成的显影过程中去除。 在集群工具的一个实施例中，将基板分成两组或更多组以进行传送或处理，以提高系统吞吐量，减少机器人必须在处理室之间传送一批衬底的移动次数，从而减少 提高系统可靠性。 实施例还提供了用于增加衬底转移过程以减少系统停机时间的可靠性的方法和装置。

公开(公告)号：US20090067956A1

公开(公告)日：2009-03-12

申请号：US12254778

申请日：2008-10-20

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： H01L21/67

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more repeatable wafer history, and also the cluster tool has a smaller system footprint. In one embodiment, the cluster tool is adapted to perform a track lithography process in which a substrate is coated with a photosensitive material, is then transferred to a stepper/scanner, which exposes the photosensitive material to some form of radiation to form a pattern in the photosensitive material, which is then removed in a developing process completed in the cluster tool. In track lithography type cluster tools, since the chamber processing times tend to be rather short, and the number of processing steps required to complete a typical track system process is large, a significant portion of the time it takes to process a substrate is taken up by the processes of transferring the substrates in a cluster tool between the various processing chambers. In one embodiment of the cluster tool, the cost of ownership, is reduced by grouping substrates together and transferring and processing the substrates in groups of two or more to improve system throughput, and reduces the number of moves a robot has to make to transfer a batch of substrates between the processing chambers, thus reducing wear on the robot and increasing system reliability. In one aspect of the invention, the substrate processing sequence and cluster tool are designed so that the substrate transferring steps performed during the processing sequence are only made to chambers that will perform the next processing step in the processing sequence. Embodiments also provide for a method and apparatus that are used to improve the coater chamber, the developer chamber, the post exposure bake chamber, the chill chamber, and the bake chamber process results. Embodiments also provide for a method and apparatus that are used to increase the reliability of the substrate transfer process to reduce system down time.

公开(公告)号：US20090060480A1

公开(公告)日：2009-03-05

申请号：US11849978

申请日：2007-09-04

申请人： Harald Herchen

发明人： Harald Herchen

IPC分类号： H01L21/00 ,  F27B5/18

CPC分类号： H01L21/67248 ,  F27B17/0025

摘要： A method of operating a bake plate disposed in a semiconductor processing chamber having a face plate opposing the bake plate includes providing a temperature control signal to the bake plate and measuring a face plate temperature associated with the face plate. The method also includes determining a difference between the face plate temperature and a predetermined temperature and modifying the temperature control signal provided to the bake plate in response to the determined difference.

摘要翻译： 设置在具有与烘烤板相对的面板的半导体处理室中的烘烤板的操作方法包括向烘烤板提供温度控制信号并测量与面板相关联的面板温度。 该方法还包括确定面板温度和预定温度之间的差异，并且响应于所确定的差异来修改提供给烘烤板的温度控制信号。

公开(公告)号：US20080223293A1

公开(公告)日：2008-09-18

申请号：US12033837

申请日：2008-02-19

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05B7/06

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： A cluster tool for processing a substrate includes a cassette and a processing module including a first process chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing modules also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.

摘要翻译： 用于处理衬底的集群工具包括盒和处理模块，该处理模块包括被配置为在衬底上执行冷却处理的第一处理室，被配置为在衬底上执行烘烤处理的第二处理室，以及输入 房间。 第一处理室，第二处理室和输入室基本上彼此相邻。 处理模块还包括机器人，该机器人被配置为在输入室中接纳基板，并将基板传送和定位在第一处理室和第二处理室中。 机器人包括机器人叶片，致动器和热交换装置。 热交换装置包括冷冻转运组件。 该群集工具还包括一个6轴关节式机器人，该机器人被配置为将基板传送到盒和输入室之间。

公开(公告)号：US20080160462A1

公开(公告)日：2008-07-03

申请号：US11693646

申请日：2007-03-29

申请人： Harald Herchen ,  Kim Vellore ,  Erica Renee Porras

发明人： Harald Herchen ,  Kim Vellore ,  Erica Renee Porras

IPC分类号： G03C5/00 ,  H05B3/68

CPC分类号： H01L21/67225 ,  H01L21/67109 ,  H01L21/67248

摘要： A thermal processing module for a track lithography tool includes a bake plate comprising a process surface and a lower surface opposing the process surface. The thermal processing module also includes a plurality of electrodes coupled to the bake plate Each of the plurality of electrodes is adapted to receive a drive signal. The thermal processing module further includes a plurality of proximity pins coupled to the process surface and extending to a predetermined height from the process surface, a plurality of flexible members coupled to the lower surface of the bake plate, a chill plate coupled to the plurality of flexible members and defining a plurality of chambers, and a plurality of channels. Each of the plurality of channels is in fluid communication with one of the plurality of chambers and with one or more sources of a pressurized fluid.

摘要翻译： 用于轨道光刻工具的热处理模块包括烘烤板，烘烤板包括工艺表面和与工艺表面相对的下表面。 热处理模块还包括耦合到烘烤板的多个电极。多个电极中的每一个适于接收驱动信号。 热处理模块还包括耦合到处理表面并且从处理表面延伸到预定高度的多个邻近销，耦合到烘烤板的下表面的多个柔性构件，与多个 柔性构件和限定多个腔室以及多个通道。 多个通道中的每一个与多个室中的一个与加压流体的一个或多个源流体连通。

公开(公告)号：US07357842B2

公开(公告)日：2008-04-15

申请号：US11112281

申请日：2005-04-22

申请人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

发明人： Tetsuya Ishikawa ,  Rick J. Roberts ,  Helen R. Armer ,  Leon Volfovski ,  Jay D. Pinson ,  Michael Rice ,  David H. Quach ,  Mohsen S. Salek ,  Robert Lowrance ,  John A. Backer ,  William Tyler Weaver ,  Charles Carlson ,  Chongyang Wang ,  Jeffrey Hudgens ,  Harald Herchen ,  Brian Lue

IPC分类号： B05C13/02 ,  C23C14/00 ,  H01L21/677

CPC分类号： H01L21/67225 ,  G03B27/32 ,  G03D13/006 ,  G03F7/40 ,  G05B19/41825 ,  G05B2219/40476 ,  G05B2219/45031 ,  G05B2219/49137 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/6831 ,  H01L21/6838 ,  H01L21/68707 ,  H01L22/26 ,  Y02P90/087 ,  Y10S414/135 ,  Y10S414/136 ,  Y10T29/53187 ,  Y10T29/5323

摘要： A cluster tool for processing a substrate includes a cassette and a processing module including a first processing chamber that is configured to perform a chill process on a substrate, a second processing chamber that is configured to perform a bake process on the substrate, and an input chamber. The first processing chamber, the second processing chamber, and the input chamber are substantially adjacent to each other. The processing module also includes a robot that is configured to receive the substrate in the input chamber and transfer and position the substrate in the first processing chamber and second processing chamber. The robot includes a robot blade, an actuator, and a heat exchanging device. The heat exchanging device includes a chilled transfer arm assembly. The cluster tool also includes a 6-axis articulated robot configured to transfer the substrate between the cassette and the input chamber.

摘要翻译： 用于处理基板的集群工具包括盒和处理模块，该处理模块包括被配置为在衬底上执行冷却处理的第一处理室，被配置为在衬底上执行烘烤处理的第二处理室，以及输入 房间。 第一处理室，第二处理室和输入室基本上彼此相邻。 处理模块还包括被配置为在输入室中接收基板并将基板传送和定位在第一处理室和第二处理室中的机器人。 机器人包括机器人叶片，致动器和热交换装置。 热交换装置包括冷却的传送臂组件。 该群集工具还包括一个6轴关节式机器人，该机器人被配置为将基板传送到盒和输入室之间。

公开(公告)号：US20070261818A1

公开(公告)日：2007-11-15

申请号：US11414140

申请日：2006-04-27

申请人： Harald Herchen

发明人： Harald Herchen

IPC分类号： F25B29/00 ,  F28F27/02

CPC分类号： F28F27/02

摘要： A heat exchanger is disclosed having multiple temperature outputs. The heat exchanger may have a body and a heating system. The body may have a first end, a second end, a first side, and a second side. The first end may oppose the second end and the first side may oppose the second side. The body may define a plurality of fluid channels, a plurality of input ports, a plurality of output ports, and each of the fluid channels may be accessible by an input port on either the side of the body and an output port on the opposed side of the body. The heating system may be configured to deliver thermal energy to the first end of the body. The body may be configured to allow the thermal energy to substantially flow from the first end to the second end, thereby producing a temperature gradient across the body.

摘要翻译： 公开了具有多个温度输出的热交换器。 热交换器可以具有主体和加热系统。 主体可以具有第一端，第二端，第一侧和第二侧。 第一端可能与第二端相对，第一端可能与第二面相反。 主体可以限定多个流体通道，多个输入端口，多个输出端口，并且每个流体通道可以通过主体侧面上的输入端口和相对侧上的输出端口来访问 的身体。 加热系统可以被配置为将热能传递到身体的第一端。 主体可以被配置为允许热能基本上从第一端流到第二端，由此产生横跨身体的温度梯度。