摘要:
A nitride crystal is characterized in that, in connection with plane spacing of arbitrary specific parallel crystal lattice planes of the nitride crystal obtained from X-ray diffraction measurement performed with variation of X-ray penetration depth from a surface of the crystal while X-ray diffraction conditions of the specific parallel crystal lattice planes are satisfied, a uniform distortion at a surface layer of the crystal represented by a value of |d1−d2|/d2 obtained from the plane spacing d1 at the X-ray penetration depth of 0.3 μm and the plane spacing d2 at the X-ray penetration depth of 5 μm is equal to or lower than 2.1×10−3. The above configuration provides the nitride crystal having a crystal surface layer that is evaluated directly and reliably without breaking the crystal so that it can be used in a preferred fashion as a substrate for a semiconductor device as well as the nitride crystal substrate, an epilayer-containing nitride crystal substrate, a semiconductor device and a method of manufacturing the same.
摘要:
A nitride crystal is characterized in that, in connection with plane spacing of arbitrary specific parallel crystal lattice planes of the nitride crystal obtained from X-ray diffraction measurement performed with variation of X-ray penetration depth from a surface of the crystal while X-ray diffraction conditions of the specific parallel crystal lattice planes are satisfied, a uniform distortion at a surface layer of the crystal represented by a value of |d1−d2|/d2 obtained from the plane spacing d1 at the X-ray penetration depth of 0.3 μm and the plane spacing d2 at the X-ray penetration depth of 5 μm is equal to or lower than 2.1×10−3. The above configuration provides the nitride crystal having a crystal surface layer that is evaluated directly and reliably without breaking the crystal so that it can be used in a preferred fashion as a substrate for a semiconductor device as well as the nitride crystal substrate, an epilayer-containing nitride crystal substrate, a semiconductor device and a method of manufacturing the same.
摘要:
A method of manufacturing a group III-nitride crystal substrate including the steps of introducing an alkali-metal-element-containing substance, a group III-element-containing substance and a nitrogen-element-containing substance into a reactor, forming a melt containing at least the alkali metal element, the group III-element and the nitrogen element in the reactor, and growing group III-nitride crystal from the melt, and characterized by handling the alkali-metal-element-containing substance in a drying container in which moisture concentration is controlled to at most 1.0 ppm at least in the step of introducing the alkali-metal-element-containing substance into the reactor is provided. A group III-nitride crystal substrate attaining a small absorption coefficient and the method of manufacturing the same, as well as a group III-nitride semiconductor device can thus be provided.
摘要:
A low-distortion gallium nitride crystal substrate including low dislocation single crystal regions (Z) having a definite c-axis and a definite a-axis, C-plane growth regions (Y) having a c-axis and a-axis parallel to the c-axis and a-axis of the low dislocation single crystal regions (Z), voluminous defect accumulating regions (H) having a c-axis inverse to the c-axis of the low dislocation single crystal regions (Z) and an a-axis parallel with the a-axis of the low dislocation single crystal regions (Z), and 0.1/cm2 to 10/cm2 c-axis gross core regions (F) containing at least one crystal having a c-axis parallel to the c-axis of the low dislocation single crystal regions (Z) and an a-axis different from the a-axis of the low dislocation single crystal regions (Z).
摘要翻译:一种低失真氮化镓晶体基板,包括具有确定的c轴和一定a轴的低位错单晶区域(Z),C平面生长区域(Y)具有平行于 低位错单晶区域(Z)的c轴和a轴,具有与低位错单晶区域(Z)的c轴相反的c轴的大量缺陷积聚区域(H) 与低位错单晶区域(Z)的a轴平行的轴线和0.1 / cm 2至10 / cm 2的c轴总芯部区域(F )含有至少一个具有与低位错单晶区域(Z)的c轴平行的c轴和不同于低位错单晶区域(Z)的a轴的a轴的晶体。
摘要:
A silicon nitride sintered body prepared through a nitriding reaction of Si, consists of crystal grains mainly composed of silicon nitride and/or SIALON and a grain boundary phase. The grain boundary phase includes a first component including at least one element selected from a group of Na, K, Mg, Ca and Sr and a second component including at least one element selected from a group of Y and lanthanoid series elements. The molar ratio of the first component to the second component is in the range of 1:1 to 6:1 in terms of oxides. The mean breadth and the mean length of the crystal grains are not more than 0.1 .mu.m and not more than 3 .mu.m respectively, and the standard deviation of the mean length in the sintered body is within 1.5 .mu.m. Especially, the mean breadth of the crystal grains is at least 0.4 .mu.m and not more than 0.9 .mu.m.
摘要:
An aluminum nitride sintered body has a high breakdown voltage for serving as a substrate material particularly suited to highly integrated circuits. The aluminum nitride sintered body contains titanium, which is included as a solid solute in the aluminum nitride crystal lattice in a weight ratio of at least 50 ppm and not more than 1000 ppm. The unpaired electron concentration in the sintered body as determined from an absorption spectrum of electron spin resonance is at least 1.times.10.sup.13 /g. At least 0.1 percent by weight and not more than 5.0 percent by weight, in terms of TiO.sub.2, of an oxy-nitride of titanium and aluminum exists in the aluminum nitride sintered body. The aluminum nitride sintered body has a breakdown voltage of 20 kV/mm. The sintered body is obtained by nitriding aluminum nitride raw material powder in a nitrogen atmosphere at a temperature of 800 to 1400.degree. C., adding an oxy-nitride of titanium thereto with a sintering assistant, and sintering the mixture.
摘要:
Disclosed herein is a measuring apparatus and a measuring method which can measure a physical property value such as an oxygen content or thermal conductivity of a sample material such as an aluminum nitride sintered body with high accuracy, over the entire material in a short time. A microwave oscillation source generates microwaves. A sample material to be evaluated, such as an aluminum nitride sintered body, is placed in a cavity resonator, irradiated with microwaves (M), and subjected to a magnetic field (H) applied by electromagnets. An amount of microwaves absorbed by the object is measured by a microwave absorption measuring unit. This amount of microwave absorption is obtained from an electron spin resonance spectrum. The concentration of unpaired electrons in the object is obtained from the measured amount of microwave absorption on the basis of a known relation between an amount of microwave absorption and concentration of unpaired electrons. The concentration of unpaired electrons is converted into a physical property value such as an oxygen content or a thermal conductivity value. Such conversion processing is carried out by a computer.
摘要:
A GaN substrate on which an epitaxially grown layer of good quality can be formed is obtained. A GaN substrate as a group III nitride substrate has a surface in which the number of chlorine atoms per square centimeter of the surface is not more than 2×1014, and the number of silicon atoms per square centimeter of the surface is not more than 3×1013, wherein a plane orientation of the surface is any of a (0001) plane, a (11-20) plane, a (10-12) plane, a (10-10) plane, a (20-21) plane, a (10-11) plane, a (11-21) plane, a (11-22) plane, and a (11-24) plane of a wurtzite structure.
摘要:
Affords a method of storing GaN substrates from which semiconductor devices of favorable properties can be manufactured, the stored substrates, and semiconductor devices and methods of manufacturing the semiconductor devices. In the GaN substrate storing method, a GaN substrate (1) is stored in an atmosphere having an oxygen concentration of 18 vol. % or less, and/or a water-vapor concentration of 12 g/m3 or less. Surface roughness Ra of a first principal face on, and roughness Ra of a second principal face on, the GaN substrate stored by the storing method are brought to no more than 20 nm and to no more than 20 μm, respectively. In addition, the GaN substrates are rendered such that the principal faces form an off-axis angle with the (0001) plane of from 0.05° to 2° in the direction, and from 0° to 1° in the direction.
摘要翻译:提供一种存储可以制造具有良好特性的半导体器件的GaN衬底的方法,存储的衬底以及半导体器件以及制造半导体器件的方法。 在GaN衬底存储方法中,将GaN衬底(1)储存在氧气浓度为18体积%的气氛中。 %以下,和/或12g / m 3以下的水蒸气浓度。 通过存储方法储存的GaN衬底上的第一主面的表面粗糙度Ra和第二主面的粗糙度Ra分别为不大于20nm且不大于20μm。 此外,使GaN基板使得主面与(0001)面在<100°方向上形成从0.05°至2°的偏轴角度,并且在<0001方向上从0°到1°, 11 20>方向。