公开(公告)号：US10424527B2

公开(公告)日：2019-09-24

申请号：US15812290

申请日：2017-11-14

Applicant: International Business Machines Corporation

Inventor： Kamal K. Sikka ,  Hilton T. Toy ,  Krishna R. Tunga ,  Thomas Weiss

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/00 ,  H01L23/10 ,  H01L23/053

Abstract: An electrical package may comprise a first substrate with a first substrate surface, and a microprocessor chip connected to the first substrate surface. The microprocessor chip may comprise a first chip surface that electrically connects to the first substrate surface, and a second chip surface located opposite the first chip surface. The electrical package may comprise a heat spreader assembly that comprises a lid section and a contact surface thermally connected to the second-chip surface. The electrical package may also comprise a pedestal between the contact surface and the lid section. The pedestal may comprise a first end that is located near the contact surface and a second end that is located near the lid section. The second end may be wider than the first end.

公开(公告)号：US10172232B2

公开(公告)日：2019-01-01

申请号：US15827275

申请日：2017-11-30

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Edward N. Cohen ,  Silvio Dragone ,  Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: G08B21/00 ,  H05K1/02 ,  H05K5/02 ,  H05K1/18 ,  G08B13/12 ,  H05K3/22 ,  H05K1/11

Abstract: Tamper-respondent assemblies and fabrication methods are provided which incorporate enclosure to circuit board protection. The tamper-respondent assemblies include a circuit board, and an electronic enclosure mounted to the circuit board and facilitating enclosing at least one electronic component within a secure volume. A tamper-respondent electronic circuit structure facilitates defining the secure volume, and the tamper-respondent electronic circuit structure includes a tamper-respondent circuit. An adhesive is provided to secure, in part, the electronic enclosure to the circuit board. The adhesive contacts, at least in part, the tamper-respondent circuit so that an attempted separation of the electronic enclosure from the circuit board causes the adhesive to break the tamper-respondent circuit, facilitating detection of the separation by a monitor circuit of the tamper-respondent electronic circuit structure.

公开(公告)号：US09913389B2

公开(公告)日：2018-03-06

申请号：US14955283

申请日：2015-12-01

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Michael J. Fisher ,  David C. Long ,  Michael T. Peets ,  Robert Weiss ,  Thomas Weiss ,  James E. Tersigni

IPC: H05K7/00 ,  H05K5/02 ,  G06F21/00 ,  G06F21/86

CPC classification number: H05K5/0208 ,  G06F21/00 ,  G06F21/86

Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.

公开(公告)号：US20150001701A1

公开(公告)日：2015-01-01

申请号：US13928406

申请日：2013-06-27

Applicant: International Business Machines Corporation

Inventor： Shidong Li ,  Gregg B. Monjeau ,  Kamal K. Sikka ,  Hilton T. Toy ,  Thomas Weiss

IPC: H01L25/00 ,  H01L23/02 ,  H01L25/10

CPC classification number: H05K1/0204 ,  H01L23/02 ,  H01L23/16 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/433 ,  H01L23/49816 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/15311 ,  H05K5/03 ,  H01L2924/00

Abstract: A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.

Abstract translation: 多芯片模块包括载体，加强框架，多个半导体芯片和多个盖子。 载体具有构造成电连接到母板的顶表面和底表面。 加强框架包括接纳多个半导体芯片的多个开口，并且可以用吸收加强框架和载体之间的尺寸变化的粘合剂附接到载体的顶表面。 半导体芯片同心地布置在加强框架的多个开口内，并且多个盖子附接到加强框架以封闭多个开口。

公开(公告)号：US11282773B2

公开(公告)日：2022-03-22

申请号：US16845404

申请日：2020-04-10

Applicant: International Business Machines Corporation

Inventor： Krishna R. Tunga ,  Thomas Weiss ,  Charles Leon Arvin ,  Bhupender Singh ,  Brian W. Quinlan

IPC: H01L23/498 ,  H01L23/538 ,  H01L21/50 ,  H01L23/00 ,  H01L21/60

Abstract: An electrical device includes an electrically insulating body having an insulating body surface and a conductive pad array, a small conductive pad arranged on the insulating body surface and within the conductive pad array, and an enlarged conductive pad. The enlarged conductive pad is arranged on the insulating body and within the conductive pad array, wherein the enlarged conductive pad is spaced apart from the small conductive pad and is larger than the small conductive pad. C4 assemblies and methods of making C4 assemblies including the electrical device are also described.

公开(公告)号：US20210242139A1

公开(公告)日：2021-08-05

申请号：US16779529

申请日：2020-01-31

Applicant: International Business Machines Corporation

Inventor： Tuhin Sinha ,  Krishna R. Tunga ,  Brian W. Quinlan ,  Charles Leon Arvin ,  Steven Paul Ostrander ,  Thomas Weiss

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/16 ,  H01L23/14 ,  H01L21/48 ,  H01L23/66 ,  H01L23/538

Abstract: A multi-chip module (MCM) package includes an organic laminate substrate; first and second semiconductor device chips that are mounted to a top side of the substrate and that define a chip gap region between opposing edges of the chips; and a stiffener that is embedded in the bottom side of the substrate. The stiffener extends across a stiffening region, which underlies the chip gap region, and does not protrude beyond a bottom side metallization of the substrate.

公开(公告)号：US10950573B2

公开(公告)日：2021-03-16

申请号：US16358658

申请日：2019-03-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Charles L. Arvin ,  Clement J. Fortin ,  Christopher D. Muzzy ,  Krishna R. Tunga ,  Thomas Weiss

IPC: H01L23/00 ,  H01L23/532

Abstract: Disclosed are interconnects in which one substrate having a high melting temperature, lead-free solder column is joined to a second substrate having openings filled with a low melting temperature, lead-free solder such that the high melting temperature, lead-free solder column penetrates into the low melting temperature, lead-free solder so as to obtain a short moment arm of solder.

公开(公告)号：US10586782B2

公开(公告)日：2020-03-10

申请号：US15640475

申请日：2017-07-01

Applicant: International Business Machines Corporation

Inventor： Charles L. Arvin ,  Clement J. Fortin ,  Christopher D. Muzzy ,  Brian W. Quinlan ,  Thomas A. Wassick ,  Thomas Weiss

IPC: H01L23/00 ,  H01L23/498

Abstract: A method and structure for joining a semiconductor device and a laminate substrate or two laminate substrates where the joint is formed with lead free solders and lead free compositions. The various lead free solders and lead free compositions are chosen so that there is a sufficient difference in liquidus temperatures such that some components may be joined to, or removed from, the laminate substrate without disturbing other components on the laminate substrate.

公开(公告)号：US20190148260A1

公开(公告)日：2019-05-16

申请号：US15812290

申请日：2017-11-14

Applicant: International Business Machines Corporation

Inventor： Kamal K. Sikka ,  Hilton T. Toy ,  Krishna R. Tunga ,  Thomas Weiss

IPC: H01L23/367 ,  H01L23/053 ,  H01L23/00 ,  H01L23/10

CPC classification number: H01L23/3675 ,  H01L23/053 ,  H01L23/10 ,  H01L23/433 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/81815 ,  H01L2224/83815 ,  H01L2224/9221 ,  H01L2924/1432 ,  H01L2924/3511

Abstract: An electrical package may comprise a first substrate with a first substrate surface, and a microprocessor chip connected to the first substrate surface. The microprocessor chip may comprise a first chip surface that electrically connects to the first substrate surface, and a second chip surface located opposite the first chip surface. The electrical package may comprise a heat spreader assembly that comprises a lid section and a contact surface thermally connected to the second-chip surface. The electrical package may also comprise a pedestal between the contact surface and the lid section. The pedestal may comprise a first end that is located near the contact surface and a second end that is located near the lid section. The second end may be wider than the first end.

公开(公告)号：US10264665B2

公开(公告)日：2019-04-16

申请号：US15835557

申请日：2017-12-08

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： William L. Brodsky ,  James A. Busby ,  Zachary T. Dreiss ,  Michael J. Fisher ,  David C. Long ,  William Santiago-Fernandez ,  Thomas Weiss

IPC: H05K1/02 ,  H05K5/02 ,  G06F21/87 ,  H05K1/18

Abstract: Tamper-respondent assemblies and methods of fabrication are provided which include at least one tamper-respondent sensor having unexposed circuit lines forming, at least in part, one or more tamper-detect network(s), and the tamper-respondent sensor having at least one external bond region. The tamper-respondent assembly further includes at least one conductive trace and an adhesive. The conductive trace(s) forms, at least in part, the one or more tamper-detect network(s), and is exposed, at least in part, on the tamper-respondent sensor(s) within the external bond region(s). The adhesive contacts the conductive trace(s) within the external bond region(s) of the tamper-respondent sensor(s), and the adhesive, in part, facilitates securing the at least one tamper-respondent sensor within the tamper-respondent assembly. In enhanced embodiments, the conductive trace(s) is a chemically compromisable conductor susceptible to damage during a chemical attack on the adhesive within the external bond region(s).