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    MEMS device package and method for manufacturing the same
    51.
    发明申请
    MEMS device package and method for manufacturing the same 有权
    MEMS器件封装及其制造方法

    公开(公告)号：US20060141650A1

    公开(公告)日：2006-06-29

    申请号：US11270482

    申请日：2005-11-10

    申请人： Jong-seok Kim ,  Yun-kwon Park ,  Kuang-woo Nam ,  Seok-chul Yun ,  In-sang Song

    发明人： Jong-seok Kim ,  Yun-kwon Park ,  Kuang-woo Nam ,  Seok-chul Yun ,  In-sang Song

    IPC分类号： H01L21/00

    CPC分类号： B81C1/00269

    摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The inventive MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device to provide a space where the MEMS active device is positioned and an electrical path for the MEMS active device, each of the internal electrode pads, and comprises first and second pads arranged opposite to one another with a clearance therebetween; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; connection members each formed on the inner surfaces of the via holes to be in contact with the internal electrode pads at one ends thereof; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are in contact with the other ends of the connection members.

    摘要翻译： 提供了微机电系统（MEMS）装置封装及其制造方法。 本发明的MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧，以提供MEMS有源器件所在的空间，以及用于MEMS有源器件的电气路径，每个内部电极焊盘，并且包括第一和 第二垫彼此相对布置，其间具有间隙; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 每个所述连接部件形成在所述通孔的内表面上，以在其一端与所述内部电极焊盘接触; 以及形成在封闭基板的​​顶表面上的外部电极焊盘，使得外部电极焊盘与连接构件的另一端接触。

    Downward type MEMS switch and method for fabricating the same
    52.
    发明授权
    Downward type MEMS switch and method for fabricating the same 有权
    向下型MEMS开关及其制造方法

    公开(公告)号：US08018308B2

    公开(公告)日：2011-09-13

    申请号：US11581435

    申请日：2006-10-17

    申请人： Sang-wook Kwon ,  Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Dong-kyun Kim ,  Jung-han Choi ,  Young-tack Houng ,  Che-heung Kim

    发明人： Sang-wook Kwon ,  Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Dong-kyun Kim ,  Jung-han Choi ,  Young-tack Houng ,  Che-heung Kim

    IPC分类号： H01H51/22

    CPC分类号： H01H1/0036 ,  H01H2057/006 ,  H01P1/127

    摘要： A downward type micro electro mechanical system (EMS) switch and a method of fabricating the same is provided. The downward type MEMS switch includes first and second cavities formed in a substrate, first and second actuators formed on upper portions of the first and second cavities, first and second fixing lines formed on an upper surface of the substrate and not overlapped with the first and second cavities, and a contact pad which is spaced apart at a predetermined distance from surfaces of the first fixing line and the second fixing line but which can be contacted with the first fixing line and the second fixing line when the first actuator and the second actuator are driven. The contact pad, which is actuated downward by piezoelectricity, is fabricated as it shares a layer with a RF signal line, after the RF signal line is fabricated.

    摘要翻译： 提供了向下型的微机电系统（EMS）开关及其制造方法。 向下型MEMS开关包括形成在基板中的第一和第二空腔，形成在第一和第二空腔的上部的第一和第二致动器，形成在基板的上表面上的第一和第二固定线， 第二空腔和接触垫，其间距第一固定线和第二固定线的表面隔开预定距离，但是当第一致动器和第二致动器能够与第一固定线和第二固定线接触时 被驱动。 在RF信号线被制造之后，通过压电性向下致动的接触垫被制造成与RF信号线共享一层。

    Piezoelectric RF MEMS device and method of fabricating the same
    53.
    发明授权
    Piezoelectric RF MEMS device and method of fabricating the same 失效
    压电RF MEMS器件及其制造方法

    公开(公告)号：US07545081B2

    公开(公告)日：2009-06-09

    申请号：US11594813

    申请日：2006-11-09

    申请人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Chang-seung Lee ,  Young-tack Houng ,  Che-heung Kim

    发明人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Chang-seung Lee ,  Young-tack Houng ,  Che-heung Kim

    IPC分类号： H01L41/08

    CPC分类号： H01H57/00 ,  H01L41/094 ,  H01L41/314 ,  H01L41/33

    摘要： A piezoelectric RF micro electro mechanical system (MEMS) device and a method of fabricating the same are provided, in which the RF MEMS device is driven upward at a low voltage based on a piezoelectric effect. The piezoelectric RF MEMS device includes an upper substrate provided with an RF output signal line, a piezoelectric actuator positioned below the RF output signal line, and a lower substrate provided with a cavity so that one end of the piezoelectric actuator is fixed to the lower substrate and its other end is movably spaced apart from the upper and lower substrates, wherein the piezoelectric actuator is provided with an RF input signal line thereon, and a contact pad is provided to connect the RF output signal line with the RF input signal line when the piezoelectric actuator is driven upward. A method of fabricating a piezoelectric RF MEMS device includes providing an upper substrate including an RF output signal line, providing a lower substrate including a piezoelectric actuator having an RF input signal line corresponding to the RF output signal line, and assembling the upper substrate and the lower substrate.

    摘要翻译： 提供了一种压电RF微机电系统（MEMS）器件及其制造方法，其中基于压电效应，RF MEMS器件以低电压向上驱动。 压电RF MEMS器件包括：设置有RF输出信号线的上基板，位于RF输出信号线下方的压电致动器;以及设置有空腔的下基板，使得压电致动器的一端固定到下基板 并且其另一端与上基板和下基板可移动地间隔开，其中压电致动器在其上设置有RF输入信号线，并且提供接触焊盘以将RF输出信号线与RF输入信号线连接， 压电致动器被向上驱动。 制造压电RF MEMS器件的方法包括提供包括RF输出信号线的上基板，提供包括具有对应于RF输出信号线的RF输入信号线的压电致动器的下基板，以及组装上基板和 下基板。

    Method of manufacturing MEMS device package
    54.
    发明授权
    Method of manufacturing MEMS device package 有权
    制造MEMS器件封装的方法

    公开(公告)号：US07537952B2

    公开(公告)日：2009-05-26

    申请号：US11802231

    申请日：2007-05-21

    申请人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

    发明人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

    IPC分类号： H01L21/00

    CPC分类号： B81B7/007

    摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device and electrically connected to the MEMS active device; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are electrically connected to the internal electrode pads through the via holes. The internal electrode pads and the sealing pads are formed from an identical material such as Au and thus the device substrate and the closure substrate are bonded to each other with direct bonding such as Au—Au direct bonding via the sealing pads.

    摘要翻译： 提供了微机电系统（MEMS）装置封装及其制造方法。 MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧并电连接到MEMS有源器件; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 以及形成在封闭基板的​​顶表面上的外部电极焊盘，使得外部电极焊盘通过通孔电连接到内部电极焊盘。 内部电极焊盘和密封焊盘由相同的材料例如Au形成，因此器件基板和封闭基板通过诸如通过密封焊盘的Au-Au直接接合的直接接合彼此接合。

    RF duplexer
    55.
    发明授权
    RF duplexer 有权
    射频双工器

    公开(公告)号：US07253704B2

    公开(公告)日：2007-08-07

    申请号：US10996045

    申请日：2004-11-24

    申请人： Yun-kwon Park ,  Jong-seok Kim ,  In-sang Song ,  Duck-hwan Kim

    发明人： Yun-kwon Park ,  Jong-seok Kim ,  In-sang Song ,  Duck-hwan Kim

    IPC分类号： H03H9/70 ,  H03H3/007

    CPC分类号： H03H9/706 ,  H03H9/0571

    摘要： A compact and high-performance RF duplexer and fabrication method thereof, the RF duplexer includes a first filter and a second filter suspended over the substrate connected in series and in parallel and having a plurality of resonators, for passing signals of different frequency bands. A plurality of inductors are connected in series with the parallel resonators of the first and second filters and formed on the substrate. A phase shifter is formed on the substrate for preventing a signal interference between the first and second filters, and a supporter supports the first and second filters and has a plurality of bumps at certain parts on the substrate to electrically connect terminals of the first and second filter with terminals of the substrate. Accordingly, the size of the duplexer is reduced by forming the tuning inductors around the bumps of the PCB.

    摘要翻译： 一种紧凑且高性能的RF双工器及其制造方法，RF双工器包括悬挂在基板上串联并联并具有多个谐振器的第一滤波器和第二滤波器，用于传递不同频带的信号。 多个电感器与第一和第二滤波器的并联谐振器串联连接，并形成在基板上。 在基板上形成有用于防止第一和第二滤光器之间的信号干涉的移相器，并且支撑件支撑第一和第二滤光器，并且在基板上的某些部分具有多个凸块以电连接第一和第二滤光器的端子 过滤器与基板的端子。 因此，通过在PCB的凸块周围形成调谐电感来减小双工器的尺寸。

    Micro-optical switching device, image display apparatus including micro-optical switching device, and method of manufacturing micro-optical switching device
    58.
    发明授权
    Micro-optical switching device, image display apparatus including micro-optical switching device, and method of manufacturing micro-optical switching device 有权
    微光开关装置，包括微光开关装置的图像显示装置和微光开关装置的制造方法

    公开(公告)号：US09164278B2

    公开(公告)日：2015-10-20

    申请号：US13461387

    申请日：2012-05-01

    申请人： Dong-sik Shim ,  Jong-seok Kim ,  Yong-seop Yoon ,  Hyung Choi ,  Woon-bae Kim

    发明人： Dong-sik Shim ,  Jong-seok Kim ,  Yong-seop Yoon ,  Hyung Choi ,  Woon-bae Kim

    IPC分类号： G02B26/02 ,  G02B26/08

    CPC分类号： G02B26/0841

    摘要： A micro-optical switching device, an image display apparatus including the micro-optical switching device, and a method of manufacturing the micro-optical switching device are provided. The micro-optical switching device includes a substrate; a first electrode disposed on the substrate and including a first opening array, wherein the first opening array includes a plurality of openings; and a second electrode disposed spaced apart from the first electrode and including a second opening array including a plurality of openings, wherein the plurality of openings of the second opening array do not overlap with the plurality of openings of the first opening array.

    摘要翻译： 提供一种微型光开关装置，包括该微型光开关装置的图像显示装置以及该微型光开关装置的制造方法。 微光开关装置包括：基板; 第一电极，其设置在所述基板上并且包括第一开口阵列，其中所述第一开口阵列包括多个开口; 以及第二电极，与第一电极间隔开并且包括包括多个开口的第二开口阵列，其中第二开口阵列的多个开口不与第一开口阵列的多个开口重叠。

    Thermal inkjet print head
    60.
    发明授权
    Thermal inkjet print head 失效
    热喷墨打印头

    公开(公告)号：US08066356B2

    公开(公告)日：2011-11-29

    申请号：US12209775

    申请日：2008-09-12

    申请人： Moon-chul Lee ,  Yong-seop Yoon ,  Yong-won Jeong ,  Dong-sik Shim ,  Sung-joon Park ,  Jong-seok Kim

    发明人： Moon-chul Lee ,  Yong-seop Yoon ,  Yong-won Jeong ,  Dong-sik Shim ,  Sung-joon Park ,  Jong-seok Kim

    IPC分类号： B41J2/05 ,  B41J2/04

    CPC分类号： B41J2/1404 ,  B41J2/14129 ,  B41J2/17563 ,  B41J2002/14403

    摘要： A thermal inkjet printhead is provided including a substrate, and a chamber layer, which is stacked on the substrate. The chamber layer includes an ink chamber that is filled with ink supplied from an ink feed hole. The printhead includes a heater inside the ink chamber that heats the ink, an island, which is formed on the substrate at an ink inlet port of the ink chamber, and a nozzle layer, which is stacked on the chamber layer, including a nozzle for ejecting the ink. The walls of the ink chamber and the island that face each other are symmetrical with respect to the center of the nozzle.

    摘要翻译： 提供一种热喷墨打印头，包括基板和层叠在基板上的室层。 室层包括填充有从供墨孔供应的油墨的油墨室。 打印头包括在油墨室内加热油墨的加热器，在油墨室的墨水入口处形成在基板上的岛和层叠在室层上的喷嘴层，其包括用于 喷墨。 相对于喷嘴的中心，墨水室和彼此面对的岛的壁是对称的。