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    Method of manufacturing MEMS device package
    3.
    发明授权
    Method of manufacturing MEMS device package 有权
    制造MEMS器件封装的方法

    公开(公告)号：US07537952B2

    公开(公告)日：2009-05-26

    申请号：US11802231

    申请日：2007-05-21

    申请人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

    发明人： Jong-seok Kim ,  Yun-kwon Park ,  In-sang Song ,  Duck-hwan Kim ,  Kuang-woo Nam ,  Seok-chul Yun

    IPC分类号： H01L21/00

    CPC分类号： B81B7/007

    摘要： A micro electromechanical system (MEMS) device package and a method of manufacturing the same are provided. The MEMS device package includes: a device substrate with a MEMS active device being formed on the top surface thereof; internal electrode pads, each of which is positioned on the opposite side of the MEMS active device and electrically connected to the MEMS active device; sealing pads positioned outside of the internal electrode pads; a closure substrate joined to the device substrate through the sealing pads, the closure substrate having via holes formed at the areas where the internal electrode pads are positioned; and external electrode pads formed on the top surface of the closure substrate in such a way that the external electrode pads are electrically connected to the internal electrode pads through the via holes. The internal electrode pads and the sealing pads are formed from an identical material such as Au and thus the device substrate and the closure substrate are bonded to each other with direct bonding such as Au—Au direct bonding via the sealing pads.

    摘要翻译： 提供了微机电系统（MEMS）装置封装及其制造方法。 MEMS器件封装包括：在其顶表面上形成有MEMS有源器件的器件衬底; 内部电极焊盘，每个内部电极焊盘位于MEMS有源器件的相对侧并电连接到MEMS有源器件; 位于内部电极焊盘外部的密封垫; 通过所述密封垫连接到所述装置基板的封闭基板，所述封闭基板具有形成在所述内部电极焊盘定位的区域处的通孔; 以及形成在封闭基板的​​顶表面上的外部电极焊盘，使得外部电极焊盘通过通孔电连接到内部电极焊盘。 内部电极焊盘和密封焊盘由相同的材料例如Au形成，因此器件基板和封闭基板通过诸如通过密封焊盘的Au-Au直接接合的直接接合彼此接合。

    RF duplexer
    4.
    发明授权
    RF duplexer 有权
    射频双工器

    公开(公告)号：US07253704B2

    公开(公告)日：2007-08-07

    申请号：US10996045

    申请日：2004-11-24

    申请人： Yun-kwon Park ,  Jong-seok Kim ,  In-sang Song ,  Duck-hwan Kim

    发明人： Yun-kwon Park ,  Jong-seok Kim ,  In-sang Song ,  Duck-hwan Kim

    IPC分类号： H03H9/70 ,  H03H3/007

    CPC分类号： H03H9/706 ,  H03H9/0571

    摘要： A compact and high-performance RF duplexer and fabrication method thereof, the RF duplexer includes a first filter and a second filter suspended over the substrate connected in series and in parallel and having a plurality of resonators, for passing signals of different frequency bands. A plurality of inductors are connected in series with the parallel resonators of the first and second filters and formed on the substrate. A phase shifter is formed on the substrate for preventing a signal interference between the first and second filters, and a supporter supports the first and second filters and has a plurality of bumps at certain parts on the substrate to electrically connect terminals of the first and second filter with terminals of the substrate. Accordingly, the size of the duplexer is reduced by forming the tuning inductors around the bumps of the PCB.

    摘要翻译： 一种紧凑且高性能的RF双工器及其制造方法，RF双工器包括悬挂在基板上串联并联并具有多个谐振器的第一滤波器和第二滤波器，用于传递不同频带的信号。 多个电感器与第一和第二滤波器的并联谐振器串联连接，并形成在基板上。 在基板上形成有用于防止第一和第二滤光器之间的信号干涉的移相器，并且支撑件支撑第一和第二滤光器，并且在基板上的某些部分具有多个凸块以电连接第一和第二滤光器的端子 过滤器与基板的端子。 因此，通过在PCB的凸块周围形成调谐电感来减小双工器的尺寸。

    MEMS switch and method for manufacturing the same
    5.
    发明申请
    MEMS switch and method for manufacturing the same 失效
    MEMS开关及其制造方法

    公开(公告)号：US20070012654A1

    公开(公告)日：2007-01-18

    申请号：US11472312

    申请日：2006-06-22

    申请人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Yun-kwon Park ,  Hee-moon Jeong ,  Young-tack Hong ,  Che-heung Kim ,  Seok-chul Yun ,  Kuang-woo Nam

    发明人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Yun-kwon Park ,  Hee-moon Jeong ,  Young-tack Hong ,  Che-heung Kim ,  Seok-chul Yun ,  Kuang-woo Nam

    IPC分类号： C23F1/00 ,  H01B13/00

    CPC分类号： H01H61/02 ,  H01H61/063 ,  H01H2061/006

    摘要： A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.

    摘要翻译： MEMS开关包括在下基板的上表面上具有信号线的下基板; 在其上具有空腔的上基板，与下基板的上表面隔开一段距离，并且在上基板的下表面上具有膜层; 形成在膜层上的上基板的空腔中的双金属层; 形成在所述膜层的下表面上的加热层; 以及形成在所述加热层的下表面上的接触构件。 接触构件可以与信号线接触或分离。 制造MEMS开关的方法包括制备上基板和下基板并将其组合，使得具有信号线的表面面向具有接触构件的表面，并且上下基板分开一定距离。

    MEMS switch and method for manufacturing the same
    8.
    发明授权
    MEMS switch and method for manufacturing the same 失效
    MEMS开关及其制造方法

    公开(公告)号：US07619289B2

    公开(公告)日：2009-11-17

    申请号：US11472312

    申请日：2006-06-22

    申请人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Yun-kwon Park ,  Hee-moon Jeong ,  Young-tack Hong ,  Che-heung Kim ,  Seok-chul Yun ,  Kuang-woo Nam

    发明人： Jong-seok Kim ,  In-sang Song ,  Sang-hun Lee ,  Sang-wook Kwon ,  Duck-hwan Kim ,  Yun-kwon Park ,  Hee-moon Jeong ,  Young-tack Hong ,  Che-heung Kim ,  Seok-chul Yun ,  Kuang-woo Nam

    IPC分类号： H01L29/78

    CPC分类号： H01H61/02 ,  H01H61/063 ,  H01H2061/006

    摘要： A MEMS switch includes a lower substrate having a signal line on an upper surface of the lower substrate; an upper substrate, having a cavity therein, disposed apart from the upper surface of the lower substrate by a distance, and having a membrane layer on a lower surface of the upper substrate; a bimetal layer formed in the cavity of the upper substrate on the membrane layer; a heating layer formed on a lower surface of the membrane layer; and a contact member formed on a lower surface of the heating layer. The contact member can come into contact with or separate from the signal line. A method for manufacturing the MEMS switch includes preparing the upper and lower substrates and combining them so that a surface having the signal line faces a surface having the contact member and the upper and lower substrates are disposed apart by a distance.

    摘要翻译： MEMS开关包括在下基板的上表面上具有信号线的下基板; 在其上具有空腔的上基板，与下基板的上表面隔开一段距离，并且在上基板的下表面上具有膜层; 形成在膜层上的上基板的空腔中的双金属层; 形成在所述膜层的下表面上的加热层; 以及形成在所述加热层的下表面上的接触构件。 接触构件可以与信号线接触或分离。 制造MEMS开关的方法包括制备上基板和下基板并将其组合，使得具有信号线的表面面向具有接触构件的表面，并且上下基板分开一定距离。

    RF duplexer
    10.
    发明申请
    RF duplexer 有权
    射频双工器

    公开(公告)号：US20050195047A1

    公开(公告)日：2005-09-08

    申请号：US10996045

    申请日：2004-11-24

    申请人： Yun-kwon Park ,  Jong-seok Kim ,  In-sang Song ,  Duck-hwan Kim

    发明人： Yun-kwon Park ,  Jong-seok Kim ,  In-sang Song ,  Duck-hwan Kim

    IPC分类号： H01P1/20 ,  H03H9/70

    CPC分类号： H03H9/706 ,  H03H9/0571

    摘要： A compact and high-performance RF duplexer and fabrication method thereof, the RF duplexer includes a first filter and a second filter suspended over the substrate connected in series and in parallel and having a plurality of resonators, for passing signals of different frequency bands. A plurality of inductors are connected in series with the parallel resonators of the first and second filters and formed on the substrate. A phase shifter is formed on the substrate for preventing a signal interference between the first and second filters, and a supporter supports the first and second filters and has a plurality of bumps at certain parts on the substrate to electrically connect terminals of the first and second filter with terminals of the substrate. Accordingly, the size of the duplexer is reduced by forming the tuning inductors around the bumps of the PCB.

    摘要翻译： 一种紧凑且高性能的RF双工器及其制造方法，RF双工器包括悬挂在基板上串联并联并具有多个谐振器的第一滤波器和第二滤波器，用于传递不同频带的信号。 多个电感器与第一和第二滤波器的并联谐振器串联连接，并形成在基板上。 在基板上形成有用于防止第一和第二滤光器之间的信号干涉的移相器，并且支撑件支撑第一和第二滤光器，并且在基板上的某些部分具有多个凸块以电连接第一和第二滤光器的端子 过滤器与基板的端子。 因此，通过在PCB的凸块周围形成调谐电感来减小双工器的尺寸。