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    High density multi-component packages
    52.
    发明授权
    High density multi-component packages 有权

    公开(公告)号：US10757810B2

    公开(公告)日：2020-08-25

    申请号：US16195346

    申请日：2018-11-19

    Applicant: KEMET Electronics Corporation

    Inventor： John Bultitude ,  Galen Miller ,  John E. McConnell

    IPC: H05K1/18 ,  H05K3/30 ,  H01L23/498 ,  H05K3/34

    Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

    ESD Suppression Using Light Emissions
    54.
    发明申请
    ESD Suppression Using Light Emissions 审中-公开

    公开(公告)号：US20200028356A1

    公开(公告)日：2020-01-23

    申请号：US16513349

    申请日：2019-07-16

    Applicant: KEMET Electronics Corporation

    Inventor： John Bultitude ,  Lonnie G. Jones ,  Iain D. Kinnon ,  Nathan A. Reed ,  Jeffrey W. Bell

    IPC: H02H9/04

    Abstract: A protected electric circuit, and method of protecting a protected circuit is provided. The circuit comprises at least one sensitive device wherein the sensitive device operates at a device voltage and has a maximum voltage capability. At least one light emitting diode electrically connected with the sensitive device wherein the light emitting diode has a first trigger voltage wherein the first trigger voltage is above the device voltage and below the maximum voltage capability. When any said extraneous energy above the first trigger energy is experienced the light emitting diode emits photons thereby converting at least some of the extraneous energy to photon energy.

    High Density Multi-Component Packages
    57.
    发明申请
    High Density Multi-Component Packages 审中-公开

    公开(公告)号：US20190082539A1

    公开(公告)日：2019-03-14

    申请号：US15699654

    申请日：2017-09-08

    Applicant: KEMET Electronics Corporation

    Inventor： John Bultitude ,  Galen W. Miller ,  John McConnell

    IPC: H05K1/18 ,  H05K3/30 ,  H01L23/498

    Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

    Electronic Component Structures with Reduced Microphonic Noise
    58.
    发明申请
    Electronic Component Structures with Reduced Microphonic Noise 审中-公开
    具有降低话筒噪声的电子元件结构

    公开(公告)号：US20170025223A1

    公开(公告)日：2017-01-26

    申请号：US15285210

    申请日：2016-10-04

    Applicant: KEMET Electronics Corporation

    Inventor： John Bultitude ,  John E. McConnell ,  Galen W. Miller

    IPC: H01G4/30 ,  H01G4/228

    CPC classification number: H01G4/30 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2101/40 ,  B23K2101/42 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/232 ,  H01G4/2325 ,  H01G4/38 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00

    Abstract: An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

    Abstract translation: 描述了一种电子器件，其中电子器件包括具有第一导电金属层和第二导电金属层的衬底。 第一麦克风噪声降低结构与第一导电金属层电接触，其中第一麦克风噪声降低层包括柔性非金属层和减震导体中的至少一个，包括具有空间的偏移安装突片 其间耦合有至少一个应力消除部分。 包括第一极性的第一外部终端和第二极性的第二外部终端的电子部件与电子设备成一体，并且第一麦克风噪声降低结构和第一外部端接通过瞬态液相烧结粘合剂粘合。

    Discharge capacitor
    59.
    发明授权
    Discharge capacitor 有权
    放电电容

    公开(公告)号：US09142353B2

    公开(公告)日：2015-09-22

    申请号：US14263130

    申请日：2014-04-28

    Applicant: Kemet Electronics Corporation

    Inventor： John Bultitude ,  Mark R. Laps ,  Lonnie G. Jones

    IPC: H01G4/30 ,  H01G2/14 ,  H03H7/01 ,  H01G4/005 ,  H01G4/232

    CPC classification number: H01G2/14 ,  H01G4/005 ,  H01G4/232 ,  H01G4/30 ,  H03H7/0115

    Abstract: A discharge capacitor for use in electronic circuits is described. The discharge capacitor has first internal electrodes in electrical contact with a first external termination and second internal electrodes parallel to and interleaved with the first internal electrodes wherein the second internal electrodes are in electrical contact with a second external termination. A dielectric is between the first internal electrodes and adjacent second internal electrodes. A first discharge gap is between at least one first internal electrode of said first internal electrodes and said second external termination.

    Abstract translation: 描述了用于电子电路的放电电容器。 放电电容器具有与第一外部端子电连接的第一内部电极和与第一内部电极平行并交错的第二内部电极，其中第二内部电极与第二外部端子电接触。 电介质位于第一内部电极和相邻的第二内部电极之间。 第一放电间隙在所述第一内部电极的至少一个第一内部电极和所述第二外部端子之间。

    Integrated EMI filter and surge protection component
    60.
    发明授权
    Integrated EMI filter and surge protection component 有权
    集成EMI滤波器和浪涌保护元件

    公开(公告)号：US08947852B2

    公开(公告)日：2015-02-03

    申请号：US13905247

    申请日：2013-05-30

    Applicant: Kemet Electronics Corporation

    Inventor： Lonnie G. Jones ,  John Bultitude ,  Mark R. Laps ,  James R. Magee ,  Jeffrey W. Bell

    IPC: H01G4/02 ,  H01G5/013 ,  H02H7/00 ,  H01G4/30 ,  H01C1/14 ,  H01C7/12 ,  H01G2/14 ,  H01G4/005

    CPC classification number: H02H7/00 ,  H01C1/14 ,  H01C7/12 ,  H01G2/14 ,  H01G4/005 ,  H01G4/30

    Abstract: An improved electronic component is described. The electronic component has a capacitor with first planer internal electrodes in electrical contact with a first termination and second planer internal electrodes in electrical contact with a second termination. A dielectric is between the first planer electrodes and the second planer internal electrodes. The electronic component further comprises at least one of: an inductor comprising a conductive trace wherein said conductive trace is between the first termination and a third termination; and an overvoltage protection component comprising: a third internal electrode contained within the dielectric and wherein the third internal electrode is electrically connected to the first termination; a fourth internal electrode contained within the ceramic and electrically connected to a fourth termination; and a gap between the third internal electrode and the fourth internal electrode.

    Abstract translation: 描述了改进的电子部件。 电子部件具有电容器，其具有与第一端接电接触的第一平面内部电极和与第二端接电接触的第二平面内部电极。 电介质位于第一平面电极和第二平面内部电极之间。 电子部件还包括以下至少一个：包括导电迹线的电感器，其中所述导电迹线在第一端接和第三端接之间; 以及过电压保护部件，包括：包含在所述电介质内的第三内部电极，并且其中所述第三内部电极电连接到所述第一端子; 第四内部电极，其包含在陶瓷内并电连接到第四端子; 以及第三内部电极和第四内部电极之间的间隙。

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