摘要:
A semiconductor storage device includes a voltage supply circuit generating a voltage of 5V, a voltage polarity inversion circuit generating a voltage of −5V, a select-and-connect circuit supplying the voltages of 5V and −5V to a memory cell array, a 5 V voltage level detection circuit detecting the voltage derived from the voltage supply circuit, and a −5 V voltage level detection circuit detecting the voltage derived from the voltage polarity inversion circuit. Absolute values of the voltages detected by the voltage level detection circuits are lower than ever before. This allows a gate insulation film to be thinner. A memory-function film is formed on both sides of a gate electrode in the semiconductor storage device. This also make the gate insulation film thinner. The thin gate insulation film suppresses the short-channel effect, so that each memory element of the memory cell array is miniaturized.
摘要:
The present invention provides a semiconductor storage device having: a first conductivity type region formed in a semiconductor layer; a second conductivity type region formed in the semiconductor layer in contact with the first conductivity type region; a memory functional element disposed on the semiconductor layer across the boundary of the first and second conductivity type regions; and an electrode provided in contact with the memory functional element and on the first conductivity type region via an insulation film, and a portable electronic apparatus comprising the semiconductor storage device. The present invention can fully cope with scale-down and high-integration by constituting a selectable memory cell substantially of one device.
摘要:
A semiconductor storage device includes a memory cell array 21 in which a plurality of memory elements are arranged and a program verify circuit 30. The memory element 1, 33 includes a gate electrode 104 formed on a semiconductor layer 102 via a gate insulator 103, a channel region arranged below the gate electrode 104, diffusion regions 107a, 107b that are located on opposite sides of the channel region and have a conductive type opposite to that of the channel region, and memory function bodies 109 that are located on opposite sides of the gate electrode 104 and have a function of retaining electric charge. A program load register 32 of the program verify circuit 30 eliminates a state that a memory element 33 which has initially been verified as having been correctly programmed needs to be further programmed.
摘要:
Characteristic fluctuation of a reference cell due to read disturb is prevented. A memory cell 27m and a reference cell 27r respectively have memory function bodies that are formed on both sides of a gate electrode and have a function to retain electric charge or polarization. The memory cell 27m can store independent information pieces in memory function bodies 27mr and 27ml located on both sides of the gate electrode and the independent information pieces are read therefrom. On the other hand, in the reference cell 27r, only the information piece stored in a memory function body 27rl located on one side of the gate electrode is referred to in a sense amplifier 22.
摘要:
A method of verifying programming of a nonvolatile memory cell to a desired state, the method comprising the steps of: selecting first and second references respectively corresponding to first and second voltages; applying a programming voltage to the memory cell; sensing a threshold voltage level of the memory cell; and comparing the sensed threshold voltage level with the first and second references and, in the case where the threshold voltage level is higher than the first reference and lower than the second reference, indicating that the memory cell is programmed into the desired state, wherein the nonvolatile memory cell includes a gate electrode formed on a semiconductor layer via a gate insulating film, a channel region formed below the gate electrode, a source and a drain as diffusion regions formed on both sides of the channel region and having a conductive type opposite to that of the channel region, and memory functional units formed on both sides of the gate electrode and having the function of retaining charges.
摘要:
A semiconductor memory device includes a memory cell array in which plural memory cells are arranged, a memory operation circuit, connected to the memory cell array, for executing a memory operation on the memory cell array, and a command controller, connected to the memory operation circuit, for receiving a command from the outside and generating a predetermined control signal to the memory operation circuit on the basis of the received command to control execution of the memory operation by the memory operation circuit. The memory cell includes a gate electrode formed over a semiconductor layer via a gate insulating film, a channel region disposed below the gate electrode, diffusion regions disposed on both sides of the channel region and having a conductive type opposite to that of the channel region, and memory functional units formed on both sides of the gate electrode and having the function of retaining charges.
摘要:
A semiconductor storage device has a single gate electrode formed on a semiconductor substrate through a gate insulation film. First and second memory function bodies formed on both sides of the gate electrode. A P-type channel region is formed in a surface of the substrate on the side of the gate electrode. N-type first and second diffusion regions are formed on both sides of the channel region. The channel region is composed of an offset region located under the first and second memory function bodies and a gate electrode beneath region located under the gate electrode. The concentration of a dopant which imparts a P-type conductivity to the offset region is effectively lower than the concentration of a dopant which imparts the P-type conductivity to the gate electrode beneath region. This makes it possible to provide the semiconductor storage device which is easily shrunk in scale.
摘要:
A semiconductor memory device has a malfunction prevention device and a nonvolatile memory.The nonvolatile memory is a memory cell including: a gate electrode formed on a semiconductor layer via a gate insulating film; a channel region disposed below the gate electrode; diffusion regions disposed on both sides of the channel region and having a conductive type opposite to that of the channel region; and memory functional units formed on both sides of the gate electrode and having a function of retaining charges.
摘要:
A semiconductor device 1910 comprises a semiconductor substrate 100 including an isolation region 101 and an active region 102, a gate electrode 104 provided on the active region 102 via a gate insulating film 103, part of a side of the gate electrode 104 being covered with a gate electrode side wall insulating film 105, and a source region 106 and a drain region 106 provided on opposite sides of the gate electrode 104 via the gate electrode side wall insulating film 105. At least one of the source region 106 and the drain region 106 has a second surface for contacting a contact conductor. The second surface is tilted with respect to a first surface A-A′. An angle between the second surface and a surface of the isolation region is 80 degrees or less.
摘要:
A semiconductor device with dynamic threshold transistors includes a complex element isolation region composed of a shallow element isolation region made of shallow trench isolation and deep element isolation regions provided on both sides of the shallow element isolation region. Since the shallow element isolation region is made of the shallow trench isolation, bird's beak in the shallow element isolation region is small. This prevents off leakage failure due to stress caused by the bird's beak. The deep element isolation region has an approximately constant width which allows the complex element isolation region to be wide.