摘要:
The invention discloses a MAMR head that has the STO stack placed at the trailing side of the write element, with both STO and write element completely self-aligned in the cross track direction. A method for defining both the MP and the STO stack geometries in a single step is also described.
摘要:
The method and system provide a perpendicular magnetic recording (PMR) head having an air bearing surface (ABS). The PMR head includes first and second poles each having front and back gap regions, a first nonmagnetic insertion layer between the back gap regions, a magnetic pole layer with a front terminating at the ABS, a write gap, shield(s), a second nonmagnetic insertion layer between the second pole back gap region and the shield(s), and coil(s) between the shield(s) and the first pole. The magnetic pole layer terminates between the ABS and the second pole back gap region and has pole angle(s) of at least thirty and not more than fifty degrees. At least part of the magnetic pole layer resides on the second pole. Part of the shield(s) are adjacent to the write gap. Another part of the shield(s) is coupled with the second pole back gap region.
摘要:
An evaporative condenser radiating module for steam exhaust of a steam turbine comprises tube bundles and steam-water separating chambers. A steam-water separating chamber (4) between a section A and a section B, a section A downflow cooling section tube bundle (3), a section B downflow cooling section tube bundle (5), and a counter flow cooling section tube bundle (8) are disposes at the left side of a central steam-water separating chamber (7). An upper sealed space (10) of the steam-water separating chamber (4) between the section A and the section B is in communication with the central steam-water separating chamber (7) through the counter flow cooling section tube bundle (8). A lower sealed space of the steam-water separating chamber (4) between the section A and the section B is in communication with the central steam-water separating chamber (7) through the section B downflow cooling section tube bundle (5). A sealed section A steam entering chamber (2) is arranged on the left side of the steam-water separating chamber (4) between the section A and the section B. The section A downflow cooling section tube bundle (3) is arranged between the section A steam entering chamber (2) and the lower sealed space of the steam-water separating chamber (4) between the section A and the section B. The right side of the central steam-water separating chamber (7) is provided with tube bundles and steam-water separating chambers totally structurally identical with those arranged on the left side of the central steam-water separating chamber (7).
摘要:
Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.
摘要:
A bond wire feed system has a wire tensioning unit with a chamber that has a wire inlet aperture and a wire outlet aperture. The wire inlet and outlet apertures have centers that are aligned with a central axis of the chamber. A clamp is positioned to receive a bond wire provided from the wire outlet aperture. The clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber. The jaws are also movable along the central axis of the wire in order to pull the wire through the wire tensioning unit.
摘要:
A bond wire feed system has a wire tensioning unit with a chamber that has a wire inlet aperture and a wire outlet aperture. The wire inlet and outlet apertures have centers that are aligned with a central axis of the chamber. A clamp is positioned to receive a bond wire provided from the wire outlet aperture. The clamp has at least two jaws movable relative to each other and arranged to grip the wire to align a central axis of the wire with the central axis of the chamber. The jaws are also movable along the central axis of the wire in order to pull the wire through the wire tensioning unit.
摘要:
Tooling for molding a packaged semiconductor device includes a clamping plate, a cavity bar, and an attachment mechanism. The cavity bar has a mold half that has a mold cavity for molding the packaged semiconductor device. The mold half has teeth and a space between pairs of adjacent teeth. The teeth and the spaces support bending of leads of a lead frame of the packaged semiconductor device. The attachment mechanism affixes the cavity bar to the clamping plate and permits the cavity bar to slide relative to the clamping plate. This sliding of the cavity bar enables proper alignment with a mating cavity bar to reduce the likelihood of resin bleed.
摘要:
A semiconductor die is packaged by providing a die assembly that includes a semiconductor die with an active surface and an opposite mounting surface with an attached thermally conductive substrate. The die assembly is mounted on a first surface of a lead frame die flag so that the thermally conductive substrate is sandwiched between the die flag and the semiconductor die. Bonding pads of the die are electrically connected with bond wires to lead frame lead fingers. A mold compound then encapsulates the semiconductor die, bond wires, and thermally conductive substrate. A second surface of the die flag is exposed through the mold compound.
摘要:
A method of fabricating a perpendicular magnetic recording (PMR) head with a multi-level tapered write pole which creates an efficient channeling of magnetic flux to the pole tip. A tapered bottom yoke is first formed in an etched substrate and a write pole is formed on the tapered bottom yoke. The write pole comprises a main pole with a tapered tip. A tapered top yoke is then formed on the write pole and symmetrically positioned relative to the bottom yoke. The edge of each yoke is recessed from the ABS of the tapered tip, giving the write pole a stepped profile. The tapered tip can be two sloped surfaces that are symmetric about a mid-plane of the main pole or a single sloped edge on the leading side or the trailing side of the pole.
摘要:
A no-lead type semiconductor package has a mold cap that forms a mold body. The corners of the mold body are reinforced with mold columns such that the corners have rounded protrusions and do not form 90° angles. The mold columns prevent the corner pads from peeling.