摘要:
There is provided a resonator having a piezoelectric ceramic resonator which has excellent free-fall resistance. The resonator comprises a piezoelectric ceramic resonator 2 with a vibrating electrode formed, and a substrate 3 which supports the piezoelectric ceramic resonator 2, wherein the piezoelectric ceramic resonator 2 satisfies the condition of U≧0.88×H+20.28, wherein U=maximum elastic energy (kJ/m3) per unit volume, and H=drop height (m) (H>1). The present invention can be applied to a resonator 1, wherein the substrate 3 has terminal electrodes 31, 32, and the piezoelectric ceramic resonator 2 is in electrical continuity with the vibrating electrode and is supported on the substrate 3 at both ends via a conductive stator 4.
摘要:
A motor driving circuit for controlling a current amount flowing through a motor coil includes: a comparator configured to output a comparison signal indicating a comparison result between a set current amount and a current amount based on an inputted set current signal according to the set current amount and a current signal according to the current amount flowing through the motor coil; a current control signal update circuit configured to update a current control signal for controlling the current amount flowing through the motor coil in a stepwise manner so that the current amount flowing through the motor coil is changed to the set current amount in a stepwise manner, based on the comparison signal outputted from the comparator; and a driving circuit configured to drive the motor coil based on the current control signal outputted from the current control signal update circuit.
摘要:
A method of manufacturing a resin molding according to the present invention is made by joining first and second resin molded parts. The method includes molding a concave portion when molding the first part, molding a convex portion which has a through-hole in a central portion thereof when molding the second part, mating the concave portion with the convex portion so that a cavity being in communication with one end of the through-hole is configured between the concave and convex portions, holding, with a jig, the first and second parts which the cavity is configured therebetween, connecting a tip of an injection nozzle for injecting a molten resin into the cavity with the other end of the through-hole, and filling the molten resin into the through-hole and the cavity from the injection nozzle so that the concave and convex portions are integrally joined by the resin.
摘要:
An optical disc recording/reproduction apparatus for recording and/or reproducing a data by applying a beam from an optical head unit through a substrate onto/from a recording layer of the optical disc through, wherein the substrate of the optical disc is 0.3 mm or below; the optical head unit comprises: an objective lens for converging an incident beam and emitting the beam toward the optical disc; a forward lens for converging the beam introduced through the objective lens and applying the beam to the optical disc; a lens holder where the objective lens and the forward lens are fixed; and an actuator for driving the objective lens and the forward lens as a unitary block and controlling at least focusing, the objective lens and the forward lens having a total numerical aperture of 0.8 or above.
摘要:
The invention is directed to improvement of reliability of a semiconductor device having penetrating electrodes by preventing a protection film and an insulation film peeling. A peeling prevention layer for preventing an insulation film and a protection layer peeling is formed in corner portions of the semiconductor device. The peeling prevention layer can increase its peeling prevention effect more when formed in a vacant space of the semiconductor device other than the corner portions, for example, between ball-shaped conductive terminals. In a cross section of the semiconductor device, the peeling prevention layer is formed on the insulation film on the back surface of the semiconductor substrate, and the protection layer formed of a solder resist or the like is formed covering the insulation film and the peeling prevention layer. The peeling prevention layer has a lamination structure of a barrier seed layer and a copper layer formed thereon when formed by an electrolytic plating method.
摘要:
A spark plug including: an insulator having an axial hole; a center electrode disposed in a tip end side of the axial hole of the insulator; a metal shell surrounding the insulator, a first ground electrode having one end bonded to the metal shell; a noble metal tip joined to an inner side face of another end portion of the first ground electrode body disposed opposite a tip end face of the center electrode; and a second ground electrode having one end bonded to the metal shell, and another end face disposed opposite a side peripheral face of said insulator to form a second discharge gap, wherein following relationships are satisfied as defined herein: 0.12≦S≦1.15, 0.3≦t≦1.5, A+0.7(F−A)≦1.8M, and −03≦L/H.
摘要翻译:一种火花塞,包括:具有轴向孔的绝缘体; 设置在绝缘体的轴向孔的前端侧的中心电极; 环绕绝缘体的金属壳,具有一端与金属壳结合的第一接地电极; 与所述第一接地电极体的与所述中心电极的前端面相对配置的另一端部的内侧面接合的贵金属端头; 以及第二接地电极,其一端接合到所述金属壳体,以及另一个端面,与所述绝缘体的侧面相对设置以形成第二放电间隙,其中满足以下定义的以下关系:0.12 <= S <= 1.15 ,0.3 <= t <= 1.5,A + 0.7(FA)<= 1.8M,-03 <= L / H。
摘要:
A method of remanufacturing a cartridge detachably mountable in an electrophotographic image-forming apparatus body and composed of styrene-based resin compositions at least in part, characterized by including the steps of: (1) dividing the cartridge into at least two parts; and (2) bonding at least one of the divided parts with another one of the divided parts and/or a component other than the divided parts by use of a terpene solvent.
摘要:
The invention is directed to a semiconductor device having a penetrating electrode and a manufacturing method thereof in which reliability and a yield of the semiconductor device are enhanced. A semiconductor substrate is etched to form a via hole from a back surface of the semiconductor substrate to a pad electrode. This etching is performed under an etching condition such that an opening diameter of the via hole at its bottom is larger than a width of the pad electrode. Next, a second insulation film is formed on the back surface of the semiconductor substrate including in the via hole 16, exposing the pad electrode at the bottom of the via hole. Next, a penetrating electrode and a wiring layer are formed, being electrically connected with the pad electrode exposed at the bottom of the via hole 16. Furthermore, a protection layer and a conductive terminal are formed. Finally, the semiconductor substrate is cut and separated in semiconductor dies by dicing.
摘要:
An intake system cover for a vehicle is mounted in an engine compartment to cover a reservoir tank that stores coolant for an engine. The intake system cover for the vehicle is formed with a light introduction opening for introducing light to be directed toward a liquid level gauge at a side of the reservoir tank. The visibility of the liquid level of the reservoir tank at the liquid level gauge is improved.
摘要:
A resin molding is made by integrally joining a first resin molded part configured a concave portion and a second resin molded part configured a convex portion so that the concave portion and the convex portion are mated together. The resin molding includes a cavity that is in communication with the convex portion and the concave portion when the convex and concave portions are mated into each other, and a joining resin filled into the cavity. The first and second molded parts and the joining resin are composed of the same resin or similar resins.