公开(公告)号：US20100230805A1

公开(公告)日：2010-09-16

申请号：US12404819

申请日：2009-03-16

申请人： Gamal Refai-Ahmed

发明人： Gamal Refai-Ahmed

IPC分类号： H01L23/34 ,  H01L21/50

CPC分类号： H01L23/36 ,  H01L23/10 ,  H01L23/38 ,  H01L23/42 ,  H01L23/427 ,  H01L24/48 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2225/06506 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor device includes first and second stacked semiconductor dies on a substrate. A lid having a plurality of fins extending downwardly into the cavity is mounted on the substrate to encapsulate the semiconductor dies. At least some of the fins are longer than other ones of said fins. The lid is attached to the substrate, with the longer fins extending downwardly above a region of the substrate not occupied by the first die. The shorter fins extend downwardly above a region of said first die not covered by said second die. A thermal interface material fills the remainder of the cavity and is in thermal communication with both dies, the substrate and the fins. The lid may be molded from metal. The lid may be bonded to the topmost die, using a thermal bonding material that may be liquid metal, or the like.

摘要翻译： 半导体器件在衬底上包括第一和第二层叠半导体管芯。 具有向下延伸到空腔中的多个翅片的盖子安装在基板上以封装半导体管芯。 鳍中的至少一些比其他翅片长。 盖子附接到基板上，较长的翼片向下延伸到基板的不被第一模具占据的区域之上。 较短的翅片向下延伸到不被所述第二模具覆盖的所述第一模具的区域之上。 热界面材料填充空腔的其余部分并与两个模具，基板和翅片热连通。 盖可以由金属模制。 可以使用可以是液态金属的热粘合材料等将盖子结合到最上面的模具。

公开(公告)号：US20090140417A1

公开(公告)日：2009-06-04

申请号：US11948124

申请日：2007-11-30

申请人： Gamal Refai-Ahmed

发明人： Gamal Refai-Ahmed

IPC分类号： H01L23/373 ,  H01L21/58

CPC分类号： H01L23/427 ,  H01L23/3732 ,  H01L23/38 ,  H01L24/13 ,  H01L24/16 ,  H01L24/30 ,  H01L24/33 ,  H01L2224/73253 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311

摘要： Various semiconductor chip thermal management systems and methods are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate and coupling a diamond heat spreader that has a thermoelectric cooler to the semiconductor chip. A vapor chamber is coupled to the diamond heat spreader.

摘要翻译： 公开了各种半导体芯片热管理系统和方法。 在一个方面，提供了一种制造方法，其包括将半导体芯片耦合到基板并将具有热电冷却器的金刚石散热器耦合到半导体芯片。 蒸气室耦合到金刚石散热器。

公开(公告)号：US07362583B2

公开(公告)日：2008-04-22

申请号：US11306505

申请日：2005-12-30

申请人： Gamal Refai-Ahmed ,  Robert A. Wiley ,  Jim E. Loro

发明人： Gamal Refai-Ahmed ,  Robert A. Wiley ,  Jim E. Loro

IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

CPC分类号： H01L23/367 ,  H01L23/4006 ,  H01L2023/4056 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal spreader is mountable to the circuit substrate to thermally couple with the second heat generating component. Additionally, the second thermal spreader is adapted to couple to the first thermal spreader to thermally couple the first thermal spreader to the first heat generating component when the second thermal spreader is mounted to the circuit substrate. The thermal management device also includes a bias device that is coupled to the first thermal spreader and the second thermal spreader and is adapted to maintain the thermal coupling between the first thermal spreader and the first heat generating component when the second thermal spreader is mounted to the circuit substrate.

摘要翻译： 一种用于具有至少第一发热部件和至少第二发热部件的电路基板的热管理装置，所述热管理装置包括第一散热器和第二散热器。 第二散热器可安装到电路基板上以与第二发热部件热耦合。 另外，当第二散热器安装到电路基板上时，第二散热器适于联接到第一散热器，以将第一散热器热耦合到第一发热部件。 热管理装置还包括偏置装置，该偏置装置联接到第一散热器和第二散热器，并且适于在第二散热器安装到第一散热器时保持第一散热器和第一发热部件之间的热耦合 电路基板。

公开(公告)号：US20080043438A1

公开(公告)日：2008-02-21

申请号：US11465421

申请日：2006-08-17

申请人： Gamal Refai-Ahmed

发明人： Gamal Refai-Ahmed

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2215/06 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In an embodiment, the vapor configuration is modified to include fins that define a cross-flow heat exchanger there the vapor from the vapor chamber serves as the fluid in the vertical cross-flow in the heat exchanger and natural or forced cooling air serves as the horizontal cross-flow for the heat exchanger.

摘要翻译： 本公开涉及使用各种传热方法的传热热管理装置，以从电路组件或任何其他实施例中冷却发热部件，其中发热部件可以在功能和操作上耦合。 在一个实施例中，蒸气构造被修改为包括限定交叉流动热交换器的翅片，其中来自蒸气室的蒸汽用作热交换器中的垂直横流中的流体，并且天然或强制冷却空气用作 热交换器的水平横流。

公开(公告)号：US20080043437A1

公开(公告)日：2008-02-21

申请号：US11465406

申请日：2006-08-17

申请人： Gamal Refai-Ahmed

发明人： Gamal Refai-Ahmed

IPC分类号： H05K7/20

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/0266 ,  F28D15/0275 ,  F28F2215/06 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/00

摘要： The present disclosure relates to heat transfer thermal management device utilizing varied methods of heat transfer to cool a heat generating component from a circuit assembly or any other embodiment where a heat generating component can be functionally and operatively coupled. In a proposed embodiment, at least one heat pipe is used to transfer heat from the condensation portion of a vapor chamber to cool a bottom portion of a finned heat dissipation space and transfer the heat to a colder location on the heat fins. In another proposed embodiment, the water vapor chamber is placed in a heat sink and is adapted to thermally connect to at least one heat pipe.

摘要翻译： 本公开涉及使用各种传热方法的传热热管理装置，以从电路组件或任何其他实施例中冷却发热部件，其中发热部件可以在功能和操作上耦合。 在所提出的实施例中，使用至少一个热管来传递来自蒸气室的冷凝部分的热量以冷却翅片散热空间的底部，并将热量传递到散热片上较冷的位置。 在另一个提出的实施例中，水蒸汽室被放置在散热器中并且适于热连接到至少一个热管。

公开(公告)号：US20070153483A1

公开(公告)日：2007-07-05

申请号：US11306505

申请日：2005-12-30

申请人： Gamal Refai-Ahmed ,  Robert Wiley ,  Jim Loro

发明人： Gamal Refai-Ahmed ,  Robert Wiley ,  Jim Loro

IPC分类号： H05K7/20

CPC分类号： H01L23/367 ,  H01L23/4006 ,  H01L2023/4056 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal spreader is mountable to the circuit substrate to thermally couple with the second heat generating component. Additionally, the second thermal spreader is adapted to couple to the first thermal spreader to thermally couple the first thermal spreader to the first heat generating component when the second thermal spreader is mounted to the circuit substrate. The thermal management device also includes a bias device that is coupled to the first thermal spreader and the second thermal spreader and is adapted to maintain the thermal coupling between the first thermal spreader and the first heat generating component when the second thermal spreader is mounted to the circuit substrate.

摘要翻译： 一种用于具有至少第一发热部件和至少第二发热部件的电路基板的热管理装置，所述热管理装置包括第一散热器和第二散热器。 第二散热器可安装到电路基板上以与第二发热部件热耦合。 另外，当第二散热器安装到电路基板上时，第二散热器适于联接到第一散热器，以将第一散热器热耦合到第一发热部件。 热管理装置还包括偏置装置，该偏置装置联接到第一散热器和第二散热器，并且适于在第二散热器安装到第一散热器时保持第一散热器和第一发热部件之间的热耦合 电路基板。

公开(公告)号：US20060114657A1

公开(公告)日：2006-06-01

申请号：US10999269

申请日：2004-11-29

申请人： Gamal Refai-Ahmed ,  Xiaohua Sun ,  Nima Osqueizadeh ,  Salim Lakhani ,  Jim Loro ,  A. Mei Lan Shepherd-Murray ,  Ross Lau

发明人： Gamal Refai-Ahmed ,  Xiaohua Sun ,  Nima Osqueizadeh ,  Salim Lakhani ,  Jim Loro ,  A. Mei Lan Shepherd-Murray ,  Ross Lau

IPC分类号： H05K7/20

CPC分类号： G06F1/20 ,  H01L23/4006 ,  H01L23/467 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.

摘要翻译： 本公开涉及一种用于管理安装到诸如电子或光学部件的电路基板的部件的温度的热管理装置。 该装置包括散热结构，其包括从散热结构的表面延伸的至少一个突起。 还包括载体结构并与散热结构接合。 载体结构包括容纳至少一个突起的孔。 另外，该装置包括至少一个偏置结构，其被配置为允许散热结构相对于载体结构的移动，并且提供倾向于将散热结构和载体结构移动到一起的偏置力。

公开(公告)号：US20050185961A1

公开(公告)日：2005-08-25

申请号：US11110604

申请日：2005-04-20

申请人： Ketan Bhalla ,  Andre Lortie ,  Kyle Edginton ,  James Moser ,  Gamal Refai-Ahmed ,  Marc Nadeau ,  Ross Saunders ,  Lee Choong

发明人： Ketan Bhalla ,  Andre Lortie ,  Kyle Edginton ,  James Moser ,  Gamal Refai-Ahmed ,  Marc Nadeau ,  Ross Saunders ,  Lee Choong

IPC分类号： H04J3/04 ,  H04J3/16 ,  H04J14/02 ,  H04Q11/00 ,  H04Q11/04 ,  H04J4/00

CPC分类号： H04J14/02 ,  H04J3/04 ,  H04J3/1611 ,  H04J2203/0025 ,  H04J2203/0026 ,  H04Q11/0071

摘要： A field reconfigurable muxponder for use in an optical transport system. The muxponder includes one or more tributary cards, where each tributary card is adapted to receive an optical data signal and conditions the optical data signal into an intermediate data signal constituted in accordance with a tributary interface format. In this way, the muxponder is able to aggregate optical data signals having different protocols and/or different data rates. The muxponder further includes a chassis that is adapted to receive a predefined number of tributary cards and outputs an optical system signal independently from the availability of the optical data signals from the tributary cards. The tributary cards and the chassis integrally form one line card.

摘要翻译： 一种用于光传输系统的现场可重配置复用应答器。 复用器包括一个或多个辅助卡，其中每个支路卡适于接收光学数据信号，并将光学数据信号调节成根据支流接口格式构成的中间数据信号。 以这种方式，复用器能够聚合具有不同协议和/或不同数据速率的光数据信号。 复用器还包括适于接收预定数量的辅助卡并且独立于来自辅助卡的光学数据信号的可用性而输出光学系统信号的机箱。 支流卡和底盘一体形成一张线卡。

公开(公告)号：US08868944B2

公开(公告)日：2014-10-21

申请号：US12754758

申请日：2010-04-06

申请人： Gamal Refai-Ahmed ,  Stanley Ossias ,  Maxat Touzelbaev

发明人： Gamal Refai-Ahmed ,  Stanley Ossias ,  Maxat Touzelbaev

IPC分类号： G06F1/32 ,  H05K7/20 ,  G06F1/20

CPC分类号： G06F1/206 ,  G06F1/3203 ,  G06F1/324 ,  G06F1/3296 ,  H05K7/20836 ,  Y02D10/126 ,  Y02D10/16 ,  Y02D10/172

摘要： Various computing center control and cooling apparatus and methods are disclosed. In one aspect, a method of controlling plural processors of a computing system is provided. The method includes monitoring activity levels of the plural processors over a time interval to determine plural activity level scores. The plural activity level scores are compared with predetermined processor activity level scores corresponding to preselected processor operating modes to determine a recommended operating mode for each of the plural processors. Each of the plural processors is instructed to operate in one of the recommended operating modes.

摘要翻译： 公开了各种计算中心控制和冷却装置和方法。 一方面，提供一种控制计算系统的多个处理器的方法。 该方法包括在一段时间间隔内监视多个处理器的活动级别，以确定多个活动级别得分。 将多个活动水平分数与对应于预选处理器操作模式的预定处理器活动水平评分进行比较，以确定多个处理器中的每一个的推荐操作模式。 指示多个处理器中的每一个以推荐的操作模式之一进行操作。

公开(公告)号：US08804331B2

公开(公告)日：2014-08-12

申请号：US13310372

申请日：2011-12-02

申请人： Gamal Refai-Ahmed

发明人： Gamal Refai-Ahmed

IPC分类号： H05K7/20

CPC分类号： H01L23/3672 ,  G06F1/203 ,  H01L23/3737 ,  H01L23/4006 ,  H01L23/42 ,  H01L2924/0002 ,  H05K1/0203 ,  H01L2924/00

摘要： Various computing devices and methods of thermally managing the same are disclosed. In one aspect, a method of thermally managing a computing device is provided where the computing device includes a housing that has a wall adapted to contact a body part of a user, a circuit board in the housing, and a semiconductor chip coupled to the circuit board. The method includes placing a first heat spreader in thermal contact with the semiconductor chip and the circuit board but separated from the wall by a gap.

摘要翻译： 公开了各种计算装置及其热管理方法。 在一个方面，提供了一种热管理计算设备的方法，其中所述计算设备包括壳体，所述壳体具有适于接触用户的身体部分的壁，所述壳体中的电路板以及耦合到所述电路的半导体芯片 板。 该方法包括将第一散热器放置在与半导体芯片和电路板热接触的位置，但是与壁隔开间隔开。