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    Thermal management device for multiple heat producing devices
    1.
    发明授权
    Thermal management device for multiple heat producing devices 有权
    多个发热装置的热管理装置

    公开(公告)号：US07362583B2

    公开(公告)日：2008-04-22

    申请号：US11306505

    申请日：2005-12-30

    申请人： Gamal Refai-Ahmed ,  Robert A. Wiley ,  Jim E. Loro

    发明人： Gamal Refai-Ahmed ,  Robert A. Wiley ,  Jim E. Loro

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/367 ,  H01L23/4006 ,  H01L2023/4056 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal spreader is mountable to the circuit substrate to thermally couple with the second heat generating component. Additionally, the second thermal spreader is adapted to couple to the first thermal spreader to thermally couple the first thermal spreader to the first heat generating component when the second thermal spreader is mounted to the circuit substrate. The thermal management device also includes a bias device that is coupled to the first thermal spreader and the second thermal spreader and is adapted to maintain the thermal coupling between the first thermal spreader and the first heat generating component when the second thermal spreader is mounted to the circuit substrate.

    摘要翻译： 一种用于具有至少第一发热部件和至少第二发热部件的电路基板的热管理装置，所述热管理装置包括第一散热器和第二散热器。 第二散热器可安装到电路基板上以与第二发热部件热耦合。 另外，当第二散热器安装到电路基板上时，第二散热器适于联接到第一散热器，以将第一散热器热耦合到第一发热部件。 热管理装置还包括偏置装置，该偏置装置联接到第一散热器和第二散热器，并且适于在第二散热器安装到第一散热器时保持第一散热器和第一发热部件之间的热耦合 电路基板。

    Thermal management device for multiple heat producing devices
    2.
    发明授权
    Thermal management device for multiple heat producing devices 有权
    多个发热装置的热管理装置

    公开(公告)号：US07760508B2

    公开(公告)日：2010-07-20

    申请号：US12100501

    申请日：2008-04-10

    申请人： Gamal Refai-Ahmed ,  Robert A. Wiley ,  Jim E. Loro

    发明人： Gamal Refai-Ahmed ,  Robert A. Wiley ,  Jim E. Loro

    IPC分类号： H05K7/20 ,  F28F7/00 ,  H01L23/34

    CPC分类号： H01L23/367 ,  H01L23/4006 ,  H01L2023/4056 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal spreader is mountable to the circuit substrate to thermally couple with the second heat generating component. Additionally, the second thermal spreader is adapted to couple to the first thermal spreader to thermally couple the first thermal spreader to the first heat generating component when the second thermal spreader is mounted to the circuit substrate. The thermal management device also includes a bias device that is coupled to the first thermal spreader and the second thermal spreader and is adapted to maintain the thermal coupling between the first thermal spreader and the first heat generating component when the second thermal spreader is mounted to the circuit substrate.

    摘要翻译： 一种用于具有至少第一发热部件和至少第二发热部件的电路基板的热管理装置，所述热管理装置包括第一散热器和第二散热器。 第二散热器可安装到电路基板上以与第二发热部件热耦合。 另外，当第二散热器安装到电路基板上时，第二散热器适于联接到第一散热器，以将第一散热器热耦合到第一发热部件。 热管理装置还包括偏置装置，该偏置装置联接到第一散热器和第二散热器，并且适于在第二散热器安装到第一散热器时保持第一散热器和第一发热部件之间的热耦合 电路基板。

    THERMAL MANAGEMENT DEVICE FOR MULTIPLE HEAT PRODUCING DEVICES
    3.
    发明申请
    THERMAL MANAGEMENT DEVICE FOR MULTIPLE HEAT PRODUCING DEVICES 有权
    多个热生产设备的热管理装置

    公开(公告)号：US20080192441A1

    公开(公告)日：2008-08-14

    申请号：US12100501

    申请日：2008-04-10

    申请人： Gamal Refai-Ahmed ,  Robert A. Wiley ,  Jim E. Loro

    发明人： Gamal Refai-Ahmed ,  Robert A. Wiley ,  Jim E. Loro

    IPC分类号： H05K7/20

    CPC分类号： H01L23/367 ,  H01L23/4006 ,  H01L2023/4056 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A thermal management device for a circuit substrate having at least a first heat generating component and at least a second heat generating component, the thermal management device includes a first thermal spreader and a second thermal spreader. The second thermal spreader is mountable to the circuit substrate to thermally couple with the second heat generating component. Additionally, the second thermal spreader is adapted to couple to the first thermal spreader to thermally couple the first thermal spreader to the first heat generating component when the second thermal spreader is mounted to the circuit substrate. The thermal management device also includes a bias device that is coupled to the first thermal spreader and the second thermal spreader and is adapted to maintain the thermal coupling between the first thermal spreader and the first heat generating component when the second thermal spreader is mounted to the circuit substrate.

    摘要翻译： 一种用于具有至少第一发热部件和至少第二发热部件的电路基板的热管理装置，所述热管理装置包括第一散热器和第二散热器。 第二散热器可安装到电路基板上以与第二发热部件热耦合。 另外，当第二散热器安装到电路基板上时，第二散热器适于联接到第一散热器，以将第一散热器热耦合到第一发热部件。 热管理装置还包括偏置装置，该偏置装置联接到第一散热器和第二散热器，并且适于在第二散热器安装到第一散热器时保持第一散热器和第一发热部件之间的热耦合 电路基板。

    Thermal management apparatus
    4.
    发明授权
    Thermal management apparatus 有权
    热管理装置

    公开(公告)号：US07283364B2

    公开(公告)日：2007-10-16

    申请号：US10999269

    申请日：2004-11-29

    申请人： Gamal Refai-Ahmed ,  Xiaohua H. Sun ,  Nima Osqueizadeh ,  Salim Lakhani ,  Jim E. Loro ,  A. Mei Lan Shepherd-Murray ,  Ross Lau

    发明人： Gamal Refai-Ahmed ,  Xiaohua H. Sun ,  Nima Osqueizadeh ,  Salim Lakhani ,  Jim E. Loro ,  A. Mei Lan Shepherd-Murray ,  Ross Lau

    IPC分类号： H05K7/20 ,  H01L23/34

    CPC分类号： G06F1/20 ,  H01L23/4006 ,  H01L23/467 ,  H01L2023/405 ,  H01L2023/4062 ,  H01L2023/4081 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.

    摘要翻译： 本公开涉及一种用于管理安装到诸如电子或光学部件的电路基板的部件的温度的热管理装置。 该装置包括散热结构，其包括从散热结构的表面延伸的至少一个突起。 还包括载体结构并与散热结构接合。 载体结构包括容纳至少一个突起的孔。 另外，该装置包括至少一个偏置结构，其被配置为允许散热结构相对于载体结构的移动，并且提供倾向于将散热结构和载体结构移动到一起的偏置力。

    Transient thermal modeling of multisource power devices
    7.
    发明授权
    Transient thermal modeling of multisource power devices 有权
    多源功率器件的瞬态热建模

    公开(公告)号：US08635044B2

    公开(公告)日：2014-01-21

    申请号：US13095406

    申请日：2011-04-27

    申请人： Maxat Touzelbaev ,  Yizhang Yang ,  Gamal Refai-Ahmed

    发明人： Maxat Touzelbaev ,  Yizhang Yang ,  Gamal Refai-Ahmed

    IPC分类号： G01K13/00

    CPC分类号： G01K7/42

    摘要： Embodiments of systems and methods for improved measurement of transient thermal responses in electronic systems are described herein. Embodiments of the disclosure use the known thermal transfer function of an electronic system to generate an equivalent resistor-capacitor (RC) network having a dynamic response that is identical to a given power excitation as the actual electronic system would have to that power excitation. Using the analogy between thermal and electrical systems, a Foster RC network is constructed, comprising a plurality of RC stages in which resistors and capacitors are connected in parallel. Subsequently, the analog thermal RC network is converted into an infinite impulse response (IIR) digital filter, whose coefficients can be obtained the Z-transform of the analog thermal RC network. This IIR digital filter establishes the recursive relationship between temperature output at the current time step and measured power input at the previous time step. Using this IIR digital filter, temperature response subject to arbitrary time-dependent power can be calculated in very small amount of time compared with prior art methods.

    摘要翻译： 本文描述了用于改进电子系统中瞬态热响应测量的系统和方法的实施例。 本公开的实施例使用电子系统的已知热传递函数来产生具有与给定功率激励相同的动态响应的等效电阻器 - 电容器（RC）网络，因为实际电子系统将具有该功率激励。 使用热电系统之间的类比，构建了Foster RC网络，其包括多个RC级，其中电阻器和电容器并联连接。 随后，模拟热RC网络被转换成无限脉冲响应（IIR）数字滤波器，其系数可以获得模拟热RC网络的Z变换。 该IIR数字滤波器建立了当前时间步长的温度输出与前一时间步长的测量功率输入之间的递归关系。 使用该IIR数字滤波器，与现有技术方法相比，可以以非常小的时间量计算受任意时间依赖功率的温度响应。