公开(公告)号：US11892157B2

公开(公告)日：2024-02-06

申请号：US17355798

申请日：2021-06-23

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: H01L33/00 ,  F21V7/00 ,  H01L33/56 ,  H01L33/50 ,  H01L33/46 ,  H01L25/075 ,  H01L33/60 ,  F21Y105/10 ,  F21Y115/10

CPC classification number: F21V7/0083 ,  H01L25/0753 ,  H01L33/0075 ,  H01L33/46 ,  H01L33/50 ,  H01L33/56 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/60

Abstract: A light-emitting device includes a base member, a plurality of light sources on or above an upper surface of the base member, and a reflector that comprises a plurality of surrounding portions. Each of the plurality of surrounding portions surrounds a respective one of the plurality of light sources in a plan view. Each of the plurality of surrounding portions has inclined lateral surfaces widened upward. Intervals between adjacent ones of the plurality of light sources are constant in the plan view. Upper peripheries of the inclined lateral surfaces of each of the plurality of surrounding portions define an opening having a substantially rectangular shape. The plurality of surrounding portions include a plurality of first surrounding portions and a plurality of second surrounding portions surrounding the plurality of first surrounding portions. An area of the opening of each of the plurality of second surrounding portions is smaller than an area of the opening of each of the plurality of first surrounding portions.

公开(公告)号：US11735690B2

公开(公告)日：2023-08-22

申请号：US17318819

申请日：2021-05-12

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: H01L33/20 ,  H01L25/075 ,  H01L33/46 ,  H01L33/62

CPC classification number: H01L33/20 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/62 ,  H01L2933/0091

Abstract: A light emitting device includes a wiring substrate, and light emitting elements. The light emitting elements are aligned in a first array, and each includes a sapphire substrate having a lower surface, a pair of first lateral surfaces slanted with respect to the lower surface, and a pair of second lateral surfaces perpendicular to the lower surface, with the pair of first lateral surfaces has an acute angle lateral surface and an obtuse angle lateral surface, and a semiconductor layered structure disposed on the sapphire substrate. In a plan view, a direction along which the second lateral surfaces of one of the light emitting elements in the first array extend forms an angle of 45° with respect to a direction along which the second lateral surfaces of an adjacent one of the light emitting elements in the first array extend.

公开(公告)号：US11649947B2

公开(公告)日：2023-05-16

申请号：US17353348

申请日：2021-06-21

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: F21V7/00 ,  F21K9/64 ,  H01L33/46 ,  H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  F21V9/30 ,  F21V17/00 ,  F21V3/00 ,  F21V3/02 ,  F21Y115/10 ,  F21Y105/16 ,  F21V13/12

CPC classification number: F21V7/0083 ,  F21K9/64 ,  F21V9/30 ,  F21V17/002 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/486 ,  H01L33/502 ,  H01L33/507 ,  H01L33/54 ,  H01L33/60 ,  H01L33/62 ,  F21V3/00 ,  F21V3/02 ,  F21V13/12 ,  F21Y2105/16 ,  F21Y2115/10

Abstract: A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (Wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10° to 50° from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/Wmax) of a radius of curvature (r) of the curved surface with respect to the maximum width (Wmax) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.

公开(公告)号：US11631789B2

公开(公告)日：2023-04-18

申请号：US17485506

申请日：2021-09-27

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/62 ,  H01L33/54 ,  H01L33/60

Abstract: A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A reflecting film provided on the sapphire substrate. A light-transmissive covering member is provided on the support surface. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member. A light reflecting layer is provided on a first region of the base such that a first reflectivity in the first region of the base being higher than a second reflectivity in a second region of the base, the second region overlapping with the light emitting element and being surrounded by the first region as viewed in the height direction.

公开(公告)号：US11201269B2

公开(公告)日：2021-12-14

申请号：US16932178

申请日：2020-07-17

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: H01L33/54 ,  H01L33/44 ,  H01L33/10 ,  F21V8/00 ,  H01L33/50 ,  H01L25/075

Abstract: A backlight includes: a light-emitting module including: a base member including a conductive pattern; a plurality of light-emitting devices, each of which is flip-chip bonded on the base member and electrically connected to the conductive pattern, and each of which includes: a light-emitting element, and a dielectric multi-layer film located on an upper surface of the light-emitting element; a plurality of light reflective members arranged between the plurality of light-emitting elements; a transparent laminate located above the plurality of light-emitting devices and including: a wavelength converting member adapted to absorb a portion of light from the light-emitting elements and to emit light of a wavelength that is different from an emission wavelength of the light-emitting elements, and a diffuser plate; and a reflective member facing a lateral surface of the transparent laminate.

公开(公告)号：US11067250B2

公开(公告)日：2021-07-20

申请号：US15855573

申请日：2017-12-27

Applicant: NICHIA CORPORATION

Inventor： Yuichi Yamada ,  Motokazu Yamada

IPC: F21V7/00 ,  F21K9/64 ,  H01L33/46 ,  H01L33/48 ,  H01L25/075 ,  H01L33/50 ,  H01L33/60 ,  H01L33/62 ,  H01L33/54 ,  F21V9/30 ,  F21V17/00 ,  F21V3/00 ,  F21V3/02 ,  F21Y115/10 ,  F21Y105/16 ,  F21V13/12

Abstract: A light emitting device includes: a base; a light emitting element; a light reflective film located on an upper surface of the light emitting element; and a encapsulant. A ratio of a maximum width (Wmax) of the encapsulant with respect to a maximum width of the light emitting element, in a side view, is 2 or more. An outer shape of a part of the encapsulant located within a range of elevation angles that is in a range of 10° to 50° from a center of a mounting region at an upper surface of the base on which the light emitting element is mounted is formed to have a curved surface. A ratio (r/Wmax) of a radius of curvature (r) of the curved surface with respect to the maximum width (Wmax) of the encapsulant, in a side view, is in a range of 0.25 to 0.50.

公开(公告)号：US11037911B2

公开(公告)日：2021-06-15

申请号：US16230591

申请日：2018-12-21

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/20 ,  H01L33/62

Abstract: A light emitting device includes a wiring substrate, light emitting elements, light-reflecting films, and a light diffusing member. The light emitting elements are mounted in a matrix on the wiring substrate. Each of the light emitting elements includes a sapphire substrate having a lower surface, first lateral surfaces inclined to the lower surface, and second lateral surfaces perpendicular to the lower surface, and a semiconductor layered structure disposed on the lower surface. The light-reflecting films are respectively disposed on the light emitting elements. The light diffusing member is disposed above the light emitting elements. At least a group of the light emitting elements is arranged such that, in every adjacent ones of the light emitting elements in at least one of a row direction and a column direction, the first lateral surface of the light emitting element faces the second lateral surface of the adjacent light emitting element.

公开(公告)号：US11031532B2

公开(公告)日：2021-06-08

申请号：US17019352

申请日：2020-09-14

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Yuichi Yamada

IPC: H01L33/54 ,  H01L33/50

Abstract: A light emitting device includes at least one LED package, and at least one light transmissive sealing member. Each of the at least one LED package includes a light emitting element, a wavelength converter, and a reflection member. The light emitting element is mounted on a mounting surface of a base and electrically connected to a conductor wiring. The wavelength converter is provided on an upper surface of the light emitting element. The reflection member covers a side surface and a lower surface of the light emitting element. Each of the at least one light transmissive sealing member includes a light diffusion material and covers each of the at least one LED package. Each of the at least one light transmissive sealing member has a projection shape with a substantially circular bottom surface facing the base and with a height in the light axis direction of the light emitting element.

公开(公告)号：US10784419B2

公开(公告)日：2020-09-22

申请号：US15160444

申请日：2016-05-20

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada ,  Tomonori Ozaki ,  Shinsaku Ikuta ,  Yuichi Yamada

IPC: H01L33/54 ,  H01L33/58 ,  H01L33/56 ,  H01L33/50 ,  H01L33/52

Abstract: A light emitting device includes a light emitting element; a sealing resin covering the light emitting element; and a light diffusing material contained in the sealing resin. When a difference in refractive index at 10° C. between the sealing resin and the light diffusing material is Δn1 and a difference in refractive index at 50° C. between the sealing resin and the light diffusing material is Δn2, a ratio of Δn2 to Δn1 is in a range of 95% to 105%.

公开(公告)号：US10727375B2

公开(公告)日：2020-07-28

申请号：US16457594

申请日：2019-06-28

Applicant: NICHIA CORPORATION

Inventor： Motokazu Yamada

IPC: H01L33/44 ,  H01L33/62 ,  H01L25/075 ,  H05K1/18 ,  H05K3/00 ,  F21V21/08 ,  F21S4/24 ,  H01L33/08 ,  H01L33/56 ,  F21Y103/10 ,  F21Y115/10 ,  H01L33/54 ,  F21Y101/00

Abstract: A light emitting device includes a flexible substrate, at least one light emitting element, and a cover member. The flexible substrate has a first surface and a second surface, and includes a flexible base member and wiring portions disposed on a first surface side. The cover member is arranged on the second surface of the flexible substrate and defines at least a part of a recess defining an air layer. The recess is positioned so that a total maximum thickness of the flexible substrate and the cover member in a region corresponding to a region on the first surface where the at least one light emitting element is arranged is smaller than a total maximum thickness of the flexible substrate and the cover member in a region other than the region corresponding to the region on the first surface where the at least one light emitting element is arranged.