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公开(公告)号：US07845860B2
公开(公告)日：2010-12-07
申请号：US12254490
申请日：2008-10-20
CPC分类号： G02B6/43 , G02B6/02042 , G02B6/4249
摘要： A method for connecting a photonic crystal fiber having a plurality of cores connected to an optical device. An end of the photonic crystal fiber may be placed on a surface of an optical device having a plurality of coupling pads. A first core of the end of the photonic crystal fiber may be positioned over a first coupling pad on the optical device to enable a threshold amount of a coherent beam of light to propagate through the first core and first coupling pad. A second core of the end of the photonic crystal fiber is aligned to a second coupling pad on the optical device to enable a threshold amount of another coherent beam of light to propagate through the second core and second coupling pad. The end of the photonic crystal fiber may be adhered to the surface of the optical device while the position of the first and the second cores relative to the first and the second coupling pads, respectively, is maintained.
摘要翻译： 一种用于连接具有连接到光学装置的多个芯的光子晶体光纤的方法。 光子晶体光纤的端部可以放置在具有多个耦合焊盘的光学器件的表面上。 光子晶体光纤的端部的第一核心可以位于光学器件上的第一耦合焊盘上方，以使阈值量的相干光束能够传播通过第一芯体和第一耦合焊盘。 光子晶体光纤的端部的第二核心与光学器件上的第二耦合焊盘对准，以使另一相干光束的阈值能够传播通过第二芯片和第二耦合焊盘。 光子晶体光纤的端部可以粘附到光学器件的表面，同时保持第一和第二芯部相对于第一和第二耦合焊盘的位置。
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公开(公告)号：US07833842B2
公开(公告)日：2010-11-16
申请号：US12630076
申请日：2009-12-03
IPC分类号： H01L21/82
CPC分类号： H01L29/0665 , B82Y10/00 , G11C2213/81 , H01H1/0094 , H01L27/285 , H01L29/0673 , H01L29/0676 , H01L51/0591 , H01L51/0595
摘要： Embodiments of the present invention are directed to mixed-scale electronic interfaces, included in integrated circuits and other electronic devices, that provide for dense electrical interconnection between microscale features of a predominantly microscale or submicroscale layer and nanoscale features of a predominantly nanoscale layer. A method is provided for fabricating a nanoscale/microscale interface having a microscale layer and a predominantly nanoscale layer.
摘要翻译： 本发明的实施例涉及包括在集成电路和其他电子设备中的混合比例电子接口，其提供主要是微米级或亚微米级的微尺度特征之间的密集电互连以及主要为纳米尺度层的纳米尺度特征。 提供了一种用于制造具有微米级和主要为纳米尺度层的纳米尺度/微米界面的方法。
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53.发明授权Three-dimensional crossbar array systems and methods for writing information to and reading information stored in three-dimensional crossbar array junctions 有权用于将信息写入和读取存储在三维交叉列阵列结点中的信息的三维交叉列阵列系统和方法公开(公告)号：US07763978B2
公开(公告)日：2010-07-27
申请号：US11729228
申请日：2007-03-28
申请人： Wei Wu , R. Stanley Williams , Warren Robinett , Gregory S. Snider , Zhaoning Yu , Shih-Yuan Wang , Duncan Stewart
发明人： Wei Wu , R. Stanley Williams , Warren Robinett , Gregory S. Snider , Zhaoning Yu , Shih-Yuan Wang , Duncan Stewart
CPC分类号： H01L27/101 , B82Y10/00 , G11C13/00 , G11C13/0023 , G11C13/0033 , G11C2213/71 , G11C2213/79 , G11C2213/81 , H01L2924/0002 , Y10S977/762 , H01L2924/00
摘要： Various embodiments of the present invention are directed to three-dimensional crossbar arrays. In one aspect of the present invention, a three-dimensional crossbar array includes a plurality of crossbar arrays, a first demultiplexer, a second demultiplexer, and a third demultiplexer. Each crossbar array includes a first layer of nanowires, a second layer of nanowires overlaying the first layer of nanowires, and a third layer of nanowires overlaying the second layer of nanowires. The first demultiplexer is configured to address nanowires in the first layer of nanowires of each crossbar array, the second demultiplexer is configured to address nanowires in the second layer of nanowires of each crossbar array, and the third demultiplexer is configured to supply a signal to the nanowires in the third layer of nanowires of each crossbar array.
摘要翻译： 本发明的各种实施例涉及三维横杆阵列。 在本发明的一个方面，三维交叉开关阵列包括多个交叉开关阵列，第一解复用器，第二解复用器和第三解复用器。 每个横杆阵列包括第一纳米线层，覆盖第一纳米线层的第二纳米线层和覆盖第二纳米线层的第三层纳米线。 第一解复用器被配置为寻址每个交叉列阵列的纳米线的第一层中的纳米线，第二解复用器被配置为寻址每个交叉列阵列的第二纳米线层中的纳米线，并且第三解复用器被配置为向 纳米线在每个交叉列阵列的第三层纳米线中。
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公开(公告)号：US07763552B2
公开(公告)日：2010-07-27
申请号：US11413476
申请日：2006-04-28
申请人： William M. Tong , Duncan Stewart , R. Stanley Williams , Manish Sharma , Zhiyong Li , Gary A. Gibson
发明人： William M. Tong , Duncan Stewart , R. Stanley Williams , Manish Sharma , Zhiyong Li , Gary A. Gibson
IPC分类号： H01L21/768 , H01L21/62
CPC分类号： H01L21/76892 , H01L21/76823 , H01L23/5254 , H01L27/1052 , H01L2924/0002 , H01L2924/12044 , H01L2924/3011 , H01L2924/00
摘要： A method of forming an electrical interconnect, which includes a first electrode, an interlayer of a programmable material disposed over at least a portion of the first electrode, and a second electrode disposed over the programmable material at a non-zero angle relative to the first electrode. The interlayer includes a modified region having differing electrical properties than the rest of the interlayer, sandwiched at the junction of the first electrode and the second electrode. The interlayer may be exposed to a focused beam to form the modified region.
摘要翻译： 一种形成电互连的方法，包括第一电极，设置在第一电极的至少一部分上的可编程材料的中间层，以及设置在可编程材料上的第二电极，相对于第一电极以非零角度 电极。 中间层包括夹在第一电极和第二电极的接合处的与中间层的其余部分不同的电特性的改性区域。 中间层可以暴露于聚焦光束以形成改质区域。
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公开(公告)号：US20100081238A1
公开(公告)日：2010-04-01
申请号：US12630076
申请日：2009-12-03
IPC分类号： H01L21/77
CPC分类号： H01L29/0665 , B82Y10/00 , G11C2213/81 , H01H1/0094 , H01L27/285 , H01L29/0673 , H01L29/0676 , H01L51/0591 , H01L51/0595
摘要： Embodiments of the present invention are directed to mixed-scale electronic interfaces, included in integrated circuits and other electronic devices, that provide for dense electrical interconnection between microscale features of a predominantly microscale or submicroscale layer and nanoscale features of a predominantly nanoscale layer. A method is provided for fabricating a nanoscale/microscale interface having a microscale layer and a predominantly nanoscale layer.
摘要翻译： 本发明的实施例涉及包括在集成电路和其他电子设备中的混合比例电子接口，其提供主要是微米级或亚微米级的微尺度特征之间的密集电互连以及主要为纳米尺度层的纳米尺度特征。 提供了一种用于制造具有微米级和主要为纳米尺度层的纳米尺度/微米界面的方法。
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公开(公告)号：US20100027941A1
公开(公告)日：2010-02-04
申请号：US12263352
申请日：2008-10-31
申请人： Duncan Stewart , Paul Rosenberg , Michael Tan
发明人： Duncan Stewart , Paul Rosenberg , Michael Tan
IPC分类号： G02B6/38
CPC分类号： G02B6/3817 , G02B6/3882 , G02B6/3886 , G02B6/4292 , H01R13/629 , H01R13/6315
摘要： An electro-optical connector including a first connector end and a second connector end. The first connector end is coupled to a first electro-optical device. The second connector end coupled to a second electro-optical device. The second connector is flexibly coupled to a connector base so a second connector face can move flexibly with respect to a first connector face. A force mechanism on at least one connector end applies a force on an interface between the first connector end and the second connector end. The force is applied when the first connector face is within a predefined proximity of the second connector face. A mechanical guide on the connector end can align the first connector face with the second connector face when the force mechanism applies the force. The connector end for the force mechanism or the mechanical guide can be the first connector end or the second connector end.
摘要翻译： 一种电光连接器，包括第一连接器端和第二连接器端。 第一连接器端耦合到第一电光装置。 第二连接器端连接到第二电光装置。 第二连接器柔性地联接到连接器基座，使得第二连接器面可以相对于第一连接器面灵活地移动。 至少一个连接器端部上的力机构在第一连接器端部和第二连接器端部之间的界面上施加力。 当第一连接器面在第二连接器面的预定义接近范围内时施加力。 当力机构施加力时，连接器端上的机械引导件可将第一连接器面与第二连接器面对准。 用于力机构或机械引导件的连接器端可以是第一连接器端或第二连接器端。
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公开(公告)号：US20090245296A1
公开(公告)日：2009-10-01
申请号：US12263405
申请日：2008-10-31
申请人： Charles Santori , Duncan Stewart , Robert G. Walmsley , Sagi Mathai , Marco Fiorentino , David Fattal , Qianfan Xu , Raymond Beausoleil
发明人： Charles Santori , Duncan Stewart , Robert G. Walmsley , Sagi Mathai , Marco Fiorentino , David Fattal , Qianfan Xu , Raymond Beausoleil
CPC分类号： G02B6/12007 , G02F1/0147 , G02F1/3132 , G02F2203/15
摘要： An optical apparatus includes a substrate comprising a layer of thermally insulating material disposed thereon; an optical resonator disposed on the layer of thermally insulating material; and a trench in the thermally insulating material disposed around at least a portion of the optical resonator. The optical resonator is substantially thermally isolated from the substrate.
摘要翻译： 光学装置包括：基板，包括设置在其上的绝热材料层; 设置在绝热材料层上的光学谐振器; 以及设置在所述光学谐振器的至少一部分周围的绝热材料中的沟槽。 光学谐振器与衬底基本上热隔离。
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公开(公告)号：US07492803B2
公开(公告)日：2009-02-17
申请号：US11149511
申请日：2005-06-10
IPC分类号： H01S5/00
CPC分类号： G02B6/4202 , B82Y20/00 , G02B6/02314 , G02B6/02328 , G02B6/107 , G02B6/423 , H01S5/02284 , H01S5/026 , H01S5/1032 , H01S5/1042 , H01S5/105 , H01S5/183 , H01S5/341 , H01S5/3412 , H01S5/423 , Y10S977/951
摘要： A device comprising a single photon generator and a waveguide, wherein a single photon generated by the single photon generator is coupled to the waveguide.
摘要翻译： 一种包括单个光子发生器和波导的器件，其中由单个光子发生器产生的单个光子耦合到波导。
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公开(公告)号：US20090034905A1
公开(公告)日：2009-02-05
申请号：US11888015
申请日：2007-07-30
IPC分类号： G02B6/12
CPC分类号： H01S5/1075 , B82Y20/00 , G02B6/12007 , H01S5/026 , H01S5/0424 , H01S5/1032 , H01S5/1042 , H01S5/34306
摘要： Various embodiments of the present invention are related to microresonator systems and to methods of fabricating the microresonator systems. In one embodiment, a microresonator system comprises a substrate having a top surface layer and at least one waveguide embedded in the substrate and positioned adjacent to the top surface layer of the substrate. The microresonator system also includes a microresonator having a top layer, an intermediate layer, a bottom layer, a peripheral region, and a peripheral coating. The bottom layer of the microresonator is attached to and in electrical communication with the top surface layer of the substrate. The microresonator is positioned so that at least a portion of the peripheral region is located above the at least one waveguide. The peripheral coating covers at least a portion of the peripheral surface and has a relatively lower index of refraction than the top, intermediate, and bottom layers of the microresonator.
摘要翻译： 本发明的各种实施例涉及微谐振器系统和制造微谐振器系统的方法。 在一个实施例中，微谐振器系统包括具有顶表面层和嵌入在衬底中的至少一个波导并且邻近衬底的顶表面层定位的衬底的衬底。 微谐振器系统还包括具有顶层，中间层，底层，周边区域和外围涂层的微谐振器。 微谐振器的底层附着到衬底的顶表面层并与其电连通。 定位微谐振器使得周边区域的至少一部分位于至少一个波导的上方。 周边涂层覆盖周边表面的至少一部分，并且具有比微谐振器的顶层，中间层和底层更低的折射率。
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公开(公告)号：US20080268396A1
公开(公告)日：2008-10-30
申请号：US11796515
申请日：2007-04-26
IPC分类号： F27D19/00
CPC分类号： F27B17/0025 , F27D19/00 , H01L2924/0002 , H01L2924/00
摘要： In an embodiment, a microchip includes a plurality of heat-producing electronic devices and a plurality of heat-sensitive devices. A plurality of temperature control elements are spatially distributed relative to the heat-producing electronic devices and the heat-sensitive devices to enable active control of temperature to compensate for spatially non-uniform and temporally-varying heat emitted from the heat-producing electronic devices.
摘要翻译： 在一个实施例中，微芯片包括多个发热电子器件和多个热敏器件。 多个温度控制元件相对于发热电子器件和热敏器件在空间上分布，以使得能够主动控制温度来补偿从发热电子器件发射的空间不均匀和时间变化的热。
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