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公开(公告)号：US20230223424A1
公开(公告)日：2023-07-13
申请号：US18121598
申请日：2023-03-15
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Hyeon CHAE , Chung Hoon Lee , Seong Gyu Jang , Chang Yeon Kim , Ho Joon Lee
IPC: H01L27/15 , H01L33/50 , H01L33/10 , H01L33/30 , H01L25/075 , H01L33/40 , H01L33/60 , H01L33/42 , H01L33/08 , H01L27/12 , H01L33/00 , H01L25/16 , G09G3/32 , H01L33/38 , H01L33/22 , H01L33/24 , H01L29/45 , H01L33/46 , H01L33/58
CPC classification number: H01L27/156 , H01L33/504 , H01L33/10 , H01L33/30 , H01L25/0756 , H01L33/405 , H01L33/60 , H10K59/353 , H01L33/42 , H10K59/352 , H01L33/08 , H01L27/1214 , H01L33/0093 , H01L25/167 , G09G3/32 , H01L33/38 , H10K59/38 , H01L33/0008 , H01L33/22 , H10K59/35 , H01L33/385 , H10K2102/00 , H01L33/24 , H01L29/45 , H10K59/32 , H01L33/46 , H01L33/58
Abstract: A light emitting diode (LED) pixel for a display including a first LED stack having a first well layer, a second LED stack disposed on the first LED stack and having a second well layer, a third LED stack disposed on the second LED stack and having a third well layer, a first electrode disposed on the first LED stack and in ohmic contact with the first LED stack, a second electrode disposed on the second LED stack and in ohmic contact with a surface of the second LED stack, and a third electrode in ohmic contact with a surface of the third LED stack, in which the first well layer includes at least one base material different from that of the second well layer.
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公开(公告)号：US20230143510A1
公开(公告)日：2023-05-11
申请号：US18079789
申请日：2022-12-12
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jong Hyeon CHAE , Chung Hoon LEE , Chang Yeon KIM , Seong Gyu JANG , Ho Joon LEE , Jong Min JANG
IPC: H01L25/13 , H01L25/075 , H01L33/00 , H01L33/62
CPC classification number: H01L25/13 , H01L25/0756 , H01L33/62 , H01L33/0093 , H01L25/0753 , H01L33/38
Abstract: A light emitting device for a display including a transparent member laterally extending in a first direction and having a first region and a second region surrounding the first region, first to third light emission regions disposed on the transparent member, a support substrate, first to fourth electrode pads disposed between the transparent member and the support substrate, and vias electrically connecting the electrode pads to the light emission regions, respectively, in which the fourth electrode pad is electrically connected to at least one of the vias, each light emission region is disposed in the first region and does not overlap the second region in a second direction, and the fourth electrode pad overlaps one of the vias and one of the light emission regions in the second direction, and the one of the vias and the one of the light emission regions are separated from each other.
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公开(公告)号：US20230121389A1
公开(公告)日：2023-04-20
申请号：US18084488
申请日：2022-12-19
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Hyeon CHAE , Ho Joon LEE , Seong Gyu JANG
Abstract: A light emitting device for a display including a first LED sub-unit laterally extending along a first direction, a second LED sub-unit, and a third LED sub-unit, electrode pads each overlapping at least a portion of the first LED sub-unit along a vertical direction and electrically connected to at least one of the first, second, and third LED sub-units, a lower insulation layer having a first surface extending in the first direction, a molding member covering each of the first LED sub-unit, the second LED sub-unit, and the third LED sub-unit, and lead electrodes electrically connected to the electrode pads and extending along the first surface and a side surface of the lower insulation layer, in which a portion of an outer region of each of the lead electrodes is disposed inside the outer boundary of the molding member when viewed in a cross-section.
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公开(公告)号：US20230005892A1
公开(公告)日：2023-01-05
申请号：US17902893
申请日：2022-09-04
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seom Geun LEE , Seong Kyu JANG , Yong Woo RYU , Jong Hyeon CHAE
IPC: H01L25/075 , H01L33/62 , H01L33/42
Abstract: A light emitting module including a circuit board and a lighting emitting device thereon and including first, second, and third LED stacks each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the third LED stack, a second planarization layer on the first LED stack, a lower conductive material extending along sides of the first planarization layer, the second LED stack, the first bonding layer, and electrically connected to the first conductivity type semiconductor layers of each LED stack, respectively, and an upper conductive material between the circuit board and the lower conductive material, in which a width of an upper end of the upper conductive material is greater than a width of the corresponding upper conductive material.
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公开(公告)号：US20220393063A1
公开(公告)日：2022-12-08
申请号：US17847122
申请日：2022-06-22
Applicant: Seoul Viosys Co., Ltd.
Inventor： Chang Yeon KIM , Jong Hyeon CHAE , Chung Hoon LEE , Seong Gyu JANG , Jong Min JANG , Ho Joon LEE
Abstract: A light emitting chip including a light emitting structure including first, second, and third light emitting sub-units to emit light of a first color, a second color, and a third color and vertically stacked on each other, and having at least one mesa structure and at least one sidewall having a stepped structure; a plurality of vias electrically connected to the light emitting sub-units, each via has a top surface exposed from the light emitting structure and a bottom surface contacting the light emitting structure, a part of the bottom surfaces of the vias disposed on substantially the same level; and a first passivation layer covering at least a part of the light emitting structure, in which the first passivation layer has a bottom surface exposing the light emitting structure to permit light from the first, second, and third sub-units to be emitted from the light emitting chip.
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Patent Agency Ranking
公开(公告)号：US20210151421A1
公开(公告)日：2021-05-20
申请号：US17096289
申请日：2020-11-12
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Seom Geun LEE , Seong Kyu JANG , Yong Woo RYU , Jong Hyeon CHAE
IPC: H01L25/075 , H01L33/62 , H01L33/42
Abstract: A light emitting device including a first LED stack, a second LED stack, and a third LED stack each including first and second conductivity type semiconductor layers, a first bonding layer between the second and third LED stacks, a second bonding layer between the first and second LED stacks, a first planarization layer between the second bonding layer and the second LED stack, a second planarization layer disposed on the first LED stack, lower buried vias passing through the first planarization layer, the second LED stack, and the first bonding layer and electrically connected to the semiconductor layers of the third LED stack, respectively, and upper buried vias passing through the second planarization layer and the first LED stack, in which a width of an upper end of each of the lower buried vias and the upper buried vias is greater than a width of a corresponding through hole.
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公开(公告)号：US20210126044A1
公开(公告)日：2021-04-29
申请号：US17141071
申请日：2021-01-04
Applicant: Seoul Viosys Co., Ltd.
Inventor： Jong Hyeon CHAE , Seong Gyu JANG , Ho Joon LEE
IPC: H01L27/15 , H01L33/62 , H01L33/40 , H01L33/24 , G09G3/32 , G09G3/20 , H01L25/075 , G09G3/3225
Abstract: A light emitting stacked structure including a first epitaxial stack including a first n-type semiconductor layer, a first p-type semiconductor layer, and a first active layer disposed therebetween, a second epitaxial stack disposed on the first epitaxial stack and including a second n-type semiconductor layer, a second p-type semiconductor layer, and a second active layer disposed therebetween, a third epitaxial stack disposed on the second epitaxial layer and including a third n-type semiconductor layer, a third p-type semiconductor layer, and a third active layer disposed therebetween, and a shared electrode disposed between two adjacent epitaxial stacks facing each other, in which two semiconductor layers of the two adjacent epitaxial stacks with the shared electrode therebetween have a same polarity.
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58.发明申请公开(公告)号：US20200185363A1
公开(公告)日：2020-06-11
申请号：US16789877
申请日：2020-02-13
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Chang Yeon KIM , Jong Hyeon CHAE , Jong Min JANG , Ho Joon LEE , Seong Gyu JANG
Abstract: A light emitting device for a display including a first LED sub-unit, a second LED sub-unit disposed on the first LED sub-unit, a third LED sub-unit disposed on the second LED sub-unit, electrode pads disposed below the first LED sub-unit, and a filler disposed between the electrode pads, in which the electrode pads include a common electrode pad electrically connected in common to the first, second, and third LED sub-units, and first, second, and third electrode pads connected to the first, second, and third LED sub-units, respectively, the first, second, and third LED sub-units are independently drivable, light generated in the first LED sub-unit is configured to be emitted to the outside of the light emitting device through the second and third LED sub-units, and light generated in the second LED sub-unit is configured to be emitted to the outside through the third LED sub-unit.
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公开(公告)号：US20200091390A1
公开(公告)日：2020-03-19
申请号：US16561440
申请日：2019-09-05
Applicant: Seoul Viosys Co., Ltd.
Inventor： Seong Gyu JANG , Ho Joon LEE , Jong Hyeon CHAE
Abstract: A light emitting device including a first light emitting part including a first ohmic layer, a second light emitting part and including a second ohmic layer, a third light emitting part including first and second metal patterns respectively contacting semiconductor layers thereof, a first pad electrically coupled with the first ohmic layer, a second pad electrically coupled with the second ohmic layer, a third pad electrically coupled with the first metal pattern, a common pad electrically coupled with a semiconductor layer of the first and second light emitting parts and the second metal pattern, and a via structure electrically coupling the second metal pattern and the common pad between the second metal pattern and the common pad, in which the second metal pattern has a first portion contacting the first via structure and a second portion contacting the semiconductor layer of the third light emitting part.
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公开(公告)号：US20200066690A1
公开(公告)日：2020-02-27
申请号：US16673114
申请日：2019-11-04
Applicant: SEOUL VIOSYS CO., LTD.
Inventor： Jong Hyeon CHAE , Chang Yeon KIM , Seong Gyu JANG , Ho Joon LEE , Jong Min JANG , Dae Sung CHO
IPC: H01L25/075 , H01L33/50 , H01L33/08 , H01L33/38
Abstract: A light emitting device for a display including a plurality of pixel regions defined between at least one separation region disposed between the pixel regions, and a barrier disposed in the separation region, in which each of the pixel regions includes a first LED stack, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, and electrode pads electrically connected to the first, second, and third LED stacks, the electrode pads comprising a common electrode pad, a first electrode pad, a second electrode pad, and a third electrode pad, the common electrode pad is connected to the first, second, and third LED stacks, the first, second, and third electrode pads are connected to the first, second, and third LED stacks, respectively, and the first, second, and third LED stacks are configured to be independently driven using the electrode pads.
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