公开(公告)号：US20100116997A1

公开(公告)日：2010-05-13

申请号：US12692902

申请日：2010-01-25

申请人： Katsuhisa Homma ,  Shinetsu Fujieda

发明人： Katsuhisa Homma ,  Shinetsu Fujieda

IPC分类号： G01T1/20 ,  H01L31/0232

CPC分类号： H01L27/1446 ,  G01T1/2002 ,  H01L27/14625 ,  H01L27/14663

摘要： A radiation detector characterized by includes a photoelectric conversion element, a scintillation layer which converts radioactive rays to fluorescence, the scintillation layer being formed on the photoelectric conversion element, and a reflective film formed on the scintillation layer, the reflective film containing light-scattering particles for reflecting the fluorescence from the scintillation layer and a binder material binding the light-scattering particles, and having depletion portions without being filled with the binder material, the depletion portions being formed in a periphery of the light-scattering particles.

摘要翻译： 一种辐射探测器，其特征在于包括光电转换元件，将放射线转换为荧光的闪烁层，形成在光电转换元件上的闪烁层和形成在闪烁层上的反射膜，反射膜含有光散射粒子 用于反射来自闪烁层的荧光和粘合光散射颗粒的粘合剂材料，并且在不填充粘合剂材料的情况下具有耗尽部分，所述耗尽部分形成在光散射颗粒的周围。

公开(公告)号：US07138435B2

公开(公告)日：2006-11-21

申请号：US09964581

申请日：2001-09-28

申请人： Yumiko Oyasato ,  Cao Minh Thai ,  Shioko Saya ,  Shinetsu Fujieda ,  Tomiaki Furuya

发明人： Yumiko Oyasato ,  Cao Minh Thai ,  Shioko Saya ,  Shinetsu Fujieda ,  Tomiaki Furuya

IPC分类号： C08J11/04

CPC分类号： B29B17/0404 ,  B29B2017/0464 ,  B29K2101/10 ,  B29L2031/286 ,  C08J11/28 ,  Y02W30/625 ,  Y02W30/706

摘要： A method of decomposing a thermosetting resin by a decomposer comprising the steps of: pre-heating the thermosetting resin up to a pre-heating temperature T0; kneading the pre-heated thermosetting resin together with a decomposer, and concurrently heating a mixture comprising the thermosetting resin and the decomposer up to a kneading temperature T1, thereby allowing a reaction to take place between the decomposer and the thermosetting resin to obtain a kneaded matter wherein the decomposer becomes consumed; and heating the kneaded matter to a maximum temperature T2 to thereby decompose the thermosetting resin; wherein the preheating temperature T0 is not higher than the boiling temperature of the decomposer; the kneading temperature T1 is not lower than the pre-heating temperature T0 but is lower than the thermal decomposition temperature of the thermosetting resin; the maximum temperature T2 is lower than the decomposition temperature of the thermosetting resin; and the pre-heating of the thermosetting resin is performed under the following conditions of temperature T0 and time t: 100° C.≦T0

摘要翻译： 一种通过分解器分解热固性树脂的方法，包括以下步骤：将热固性树脂预热至预热温度T 0; 将预热的热固性树脂与分解器一起捏合，同时将包含热固性树脂和分解剂的混合物加热至捏合温度T 1，从而使分解剂和热固性树脂之间发生反应，得到捏合的 其中分解器被消耗的物质; 并将捏合物加热到最高温度T 2，从而分解热固性树脂; 其中预热温度T 0不高于分解器的沸腾温度; 捏合温度T 1不低于预热温度T 0，但低于热固性树脂的热分解温度; 最高温度T 2低于热固性树脂的分解温度; 并且在温度T 0和时间t的以下条件下进行热固性树脂的预热：<？in-line-formula description =“In-line Formulas”end =“lead”≥> 100℃。 = T0 <260°C <？in-line-formula description =“In-line Formulas”end =“tail”？> <？in-line-formula description =“In-line Formulas”end =“lead”？ > 0.5分钟<= t <= 7分钟<？in-line-formula description =“In-line Formulas”end =“tail”？>

公开(公告)号：US20050048347A1

公开(公告)日：2005-03-03

申请号：US10879213

申请日：2004-06-30

申请人： Masahiro Takashita ,  Yoshihiko Nakano ,  Shinetsu Fujieda

发明人： Masahiro Takashita ,  Yoshihiko Nakano ,  Shinetsu Fujieda

IPC分类号： H01M8/02 ,  H01B1/24

CPC分类号： H01M8/0204 ,  H01M8/0221 ,  H01M8/0226

摘要： The present invention provides a separator for fuel cell, containing an inorganic filler and a thermosetting resin, and having glass transition temperature of 20° C. or less and 100° C. or more, coefficient of thermal expansion at 20° C. of 0.4×10−5/° C. or more and 4×10−5/° C. or less, and bending modulus of elasticity at 20° C. of 5 GPa or more and 30 GPa or less.

摘要翻译： 本发明提供一种燃料电池用隔板，其含有无机填料和热固性树脂，玻璃化转变温度为20℃以下且100℃以上，20℃时的热膨胀系数为0.4 x 10 -5℃/℃以上4×10 -5 /℃以下，20℃下的弯曲弹性模量为5GPa以上且30GPa以下。

公开(公告)号：US5912320A

公开(公告)日：1999-06-15

申请号：US939661

申请日：1997-09-29

申请人： Yasuyuki Hotta ,  Shinetsu Fujieda ,  Tetsuo Okuyama

发明人： Yasuyuki Hotta ,  Shinetsu Fujieda ,  Tetsuo Okuyama

IPC分类号： C08K3/00 ,  C08K5/5435 ,  C08L45/00 ,  C08L81/02 ,  H01L23/29 ,  H01L23/31 ,  C08G75/00

CPC分类号： H01L23/293 ,  C08K5/5435 ,  C08L81/02 ,  H01L2224/13 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/12044 ,  Y10T428/31609 ,  Y10T428/31612

摘要： A polyphenylene sulfide resin composition, which comprises, in addition to a polyphenylene sulfide resin and an inorganic filler, at least one whisker selected from the group consisting of titania whisker and aluminum borate whisker.

摘要翻译： 一种聚苯硫醚树脂组合物，其除了聚苯硫醚树脂和无机填料之外还包含至少一种选自二氧化钛晶须和硼酸铝晶须的晶须。

公开(公告)号：US5637667A

公开(公告)日：1997-06-10

申请号：US451065

申请日：1995-05-25

申请人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Shuzi Hayase ,  Yoshihiko Nakano ,  Akira Yoshizumi ,  Ken Uchida

发明人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Shuzi Hayase ,  Yoshihiko Nakano ,  Akira Yoshizumi ,  Ken Uchida

IPC分类号： C08G77/60 ,  C08L63/00 ,  C08L79/08 ,  C08L83/16 ,  C08L101/00 ,  C08G77/04

CPC分类号： C08L63/00 ,  C08G77/60 ,  C08L101/00 ,  C08L79/085 ,  C08L83/16

摘要： A thermosetting resin composition, containing (A) a thermosetting resin; (B) a curing agent for the thermosetting resin; (C) a polysilane copolymer; and (D) an inorganic filler; wherein the polyailane copolymer (C) is added in amount of about 0.1 to 10% by weight based on the total amount of the resin composition.

摘要翻译： 一种热固性树脂组合物，其含有（A）热固性树脂; （B）热固性树脂用固化剂; （C）聚硅烷共聚物; 和（D）无机填料; 其中所述聚烯烃共聚物（C）的添加量相对于树脂组合物的总量为约0.1〜10重量％。

公开(公告)号：US5438113A

公开(公告)日：1995-08-01

申请号：US40267

申请日：1993-03-30

申请人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Shuzi Hayase ,  Yoshihiko Nakano ,  Akira Yoshizumi ,  Ken Uchida

发明人： Hiroshi Shimozawa ,  Shinetsu Fujieda ,  Shuzi Hayase ,  Yoshihiko Nakano ,  Akira Yoshizumi ,  Ken Uchida

IPC分类号： C08G77/60 ,  C08L63/00 ,  C08L79/08 ,  C08L83/16 ,  C08L101/00 ,  C08G77/04

CPC分类号： C08L63/00 ,  C08G77/60 ,  C08L101/00 ,  C08L79/085 ,  C08L83/16

摘要： A thermosetting resin composition containing a silane compound a) having at least one phenolic hydroxyl group, and an organic compound b) having at least two functional groups capable of reaction with the phenolic hydroxyl group of the silane compound, wherein the silane compound a) is added in an amount of more than 10 parts by weight relative to 100 parts by weight of the organic compound b).

摘要翻译： 含有具有至少一个酚羟基的硅烷化合物a）和具有至少两个能够与硅烷化合物的酚羟基反应的官能团的有机化合物b）的热固性树脂组合物，其中硅烷化合物a）为 相对于100重量份的有机化合物b），加入量大于10重量份。

公开(公告)号：US4916174A

公开(公告)日：1990-04-10

申请号：US243719

申请日：1988-09-13

申请人： Akira Yoshizumi ,  Shinetsu Fujieda ,  Ken Uchida ,  Naoko Kihara ,  Kazuhiro Sawai ,  Tsutomu Nagata ,  Shinji Murakami ,  Shigeyuki Kouchiyama

发明人： Akira Yoshizumi ,  Shinetsu Fujieda ,  Ken Uchida ,  Naoko Kihara ,  Kazuhiro Sawai ,  Tsutomu Nagata ,  Shinji Murakami ,  Shigeyuki Kouchiyama

IPC分类号： C08L61/10 ,  C08L9/00 ,  C08L51/04 ,  C08L55/02 ,  C08L61/04 ,  C08L61/06 ,  C08L63/00 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08L61/06 ,  C08L63/00

摘要： A rubber-modified phenolic resin composition contains a novolak-type phenolic resin in which at least one modifying agent selected from the group consisting of an ABS resin and an MBS resin is homogeneously dispersed. The composition has good impact resistance and thermal shock resistance. The composition is prepared by adding at least one modifying agent described above to a novolak-type phenolic resin which is heated and melted at its softening point or more, so that the modifying agent is homogeneous dispersed in the resin. The resin composition is suitably used as a curing agent for an epoxy resin encapsulant for sealing electronic devices.

公开(公告)号：US4719255A

公开(公告)日：1988-01-12

申请号：US760770

申请日：1985-07-31

申请人： Akira Yoshizumi ,  Hisayuki Hirai ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Michiya Higashi

发明人： Akira Yoshizumi ,  Hisayuki Hirai ,  Kazutaka Matsumoto ,  Shinetsu Fujieda ,  Michiya Higashi

IPC分类号： C08L63/00 ,  H01B3/40

CPC分类号： H01B3/40 ,  C08L63/00

摘要： An epoxy resin composition for encapsulation of semiconductor device comprises the components (a), (b), (c) and at least one of the components (d) and (e) as shown below:(a) 100 parts by weight of an epoxy resin having at least 2 epoxy groups in one molecule;(b) 8 to 65 parts by weight of a novolak type phenolic resin with an ortho ratio less than 50%;(c) 1.2 to 40 parts by weight of a polyvinyl acetal compound;(d) 0.8 to 30 parts by weight of a silicone oil; and(e) 4 to 80 parts by weight of a rubber-modified phenolic resin.The described epoxy resins composition for encapsulation of semiconductor devices can retain its high glass transition temperature in the cured product and also has low modulus of elasticity, as well as excellent humidity resistance and thermal shock resistance.

摘要翻译： 用于半导体器件封装的环氧树脂组合物包括如下所示的组分（a），（b），（c）和组分（d）和（e）中的至少一种：（a）100重量份的 一个分子中具有至少2个环氧基团的环氧树脂; （b）8〜65重量份邻位比小于50％的酚醛清漆型酚醛树脂; （c）1.2〜40重量份的聚乙烯醇缩醛化合物; （d）0.8〜30重量份的硅油; 和（e）4至80重量份的橡胶改性酚醛树脂。 所述用于半导体器件封装的环氧树脂组合物可以在固化产物中保持其高的玻璃化转变温度，并且还具有低的弹性模量以及优异的耐湿性和耐热冲击性。