公开(公告)号：US08928016B2

公开(公告)日：2015-01-06

申请号：US12900102

申请日：2010-10-07

申请人： Sun Kyung Kim

发明人： Sun Kyung Kim

IPC分类号： H01L33/30 ,  H01L33/48 ,  H01L33/20

CPC分类号： H01L33/20 ,  H01L2224/48091 ,  H01L2933/0083 ,  H01L2924/00014

摘要： A light emitting device includes a light emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer between the first conductive type semiconductor layer and the second conductive type semiconductor layer, and a light extraction structure that extracts light from the light emitting structure. The light extraction structure includes at least a first light extraction zone and a second light extraction zone, where a period and/or size of first concave and/or convex structures of the first light extraction zone is different from a period and/or size of second concave and/or convex structures of the second light extraction zone.

摘要翻译： 发光器件包括在第一导电类型半导体层和第二导电类型半导体层之间包括第一导电类型半导体层，第二导电类型半导体层和有源层的发光结构，以及提取 来自发光结构的光。 光提取结构至少包括第一光提取区和第二光提取区，其中第一光提取区的第一凹和/或凸结构的周期和/或尺寸不同于第一光提取区的周期和/或尺寸 第二光提取区的第二凹和/或凸结构。

公开(公告)号：US08916891B2

公开(公告)日：2014-12-23

申请号：US12908939

申请日：2010-10-21

申请人： Sun Kyung Kim

发明人： Sun Kyung Kim

IPC分类号： H01L33/00 ,  H01L33/40 ,  H01L33/20

CPC分类号： H01L33/20 ,  H01L33/405 ,  H01L2224/48091 ,  H01L2924/00014

摘要： A light emitting device includes a first light extraction structure including a reflective layer and a pattern; an ohmic layer on the first light extraction structure; a second conductive type semiconductor layer on the ohmic layer; an active layer on the second conductive type semiconductor layer; and a first conductive type semiconductor layer on the active layer, wherein the pattern has a refractive index that is higher than that of air and lower than that of the second conductive type semiconductor layer.

摘要翻译： 发光器件包括：第一光提取结构，包括反射层和图案; 第一光提取结构上的欧姆层; 欧姆层上的第二导电型半导体层; 在第二导电类型半导体层上的有源层; 以及有源层上的第一导电型半导体层，其中，图案的折射率高于空气的折射率，低于第二导电型半导体层的折射率。

公开(公告)号：US08748927B2

公开(公告)日：2014-06-10

申请号：US13855135

申请日：2013-04-02

申请人： Sun Kyung Kim

发明人： Sun Kyung Kim

IPC分类号： H01L33/60

CPC分类号： H01L33/60 ,  H01L33/105 ,  H01L33/20 ,  H01L33/387 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes an electrode layer, a current density adjusting pattern on the electrode layer, and a light emitting structure on the electrode layer and the current density adjusting pattern. The light emitting structure includes a second conductive semiconductor layer, an active layer on the second conductive semiconductor layer, and a first conductive semiconductor layer on the active layer. The first conductive semiconductor layer includes an upper portion including a column pattern or a hole pattern serving as a structure of a resonant cavity and a lower portion having a thickness less than a thickness of the upper portion.

摘要翻译： 公开了一种发光器件，发光器件封装和照明系统。 发光器件包括电极层，电极层上的电流密度调节图案，以及电极层上的发光结构和电流密度调节图案。 发光结构包括第二导电半导体层，第二导电半导体层上的有源层和有源层上的第一导电半导体层。 第一导电半导体层包括上部，其包括柱状图案或用作谐振腔的结构的孔图案和具有小于上部厚度的厚度的下部。

公开(公告)号：US08575635B2

公开(公告)日：2013-11-05

申请号：US13112022

申请日：2011-05-20

申请人： Jong Hak Won ,  Sun Kyung Kim ,  Kyoung Woo Jo ,  Joong Seo Park

发明人： Jong Hak Won ,  Sun Kyung Kim ,  Kyoung Woo Jo ,  Joong Seo Park

IPC分类号： H01L33/00

CPC分类号： H01L33/0066 ,  H01L21/0237 ,  H01L21/02538 ,  H01L21/02639 ,  H01L21/02642 ,  H01L21/02647 ,  H01L33/0079 ,  H01L33/10 ,  H01L33/22 ,  H01L33/44 ,  H01L33/46 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, the light emitting structure being disposed on the substrate, a nonmetal pattern disposed between the substrate and the active layer, the nonmetal pattern being spaced from the substrate, and an air gap disposed on a side surface of the nonmetal pattern.

摘要翻译： 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括衬底，包括第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构，发光结构设置在衬底上，非金属图案设置在衬底和 所述有源层，所述非金属图案与所述基板间隔开，以及设置在所述非金属图案的侧表面上的气隙。

公开(公告)号：US08431945B2

公开(公告)日：2013-04-30

申请号：US13092275

申请日：2011-04-22

申请人： Hyun Min Choi ,  Sun Kyung Kim ,  Woon Kyung Choi

发明人： Hyun Min Choi ,  Sun Kyung Kim ,  Woon Kyung Choi

IPC分类号： H01L33/00 ,  H01L21/00

CPC分类号： H01L33/46 ,  H01L33/22 ,  H01L33/382 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Disclosed are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer on, a light transmissive substrate having a refractive index lower than a refractive index of a compound semiconductor layer, and a mirror structure layer having a structure in which a first mirror layer having a first refractive index and a second mirror layer having a second refractive index different from the first refractive index are alternately stacked on each other. The first mirror layer has a thickness of W·λ/(4·n1·m), and the second mirror layer has a thickness of W·λ/(4·n2·m) in which the W represents a weight constant in a range of about 1.05 to about 1.25.

摘要翻译： 公开了一种发光器件，发光器件封装和照明系统。 发光器件包括在其上具有折射率低于化合物半导体层的折射率的透光基板上的第一导电半导体层，有源层和第二导电半导体层的发光结构，以及反射镜 具有其中具有第一折射率的第一镜层和具有不同于第一折射率的第二折射率的第二镜层的结构的结构层彼此交替堆叠。 第一镜层的厚度为W·λ/（4·n1·m），第二镜层的厚度为W·λ/（4·n2·m），其中W表示重量常数 范围为约1.05至约1.25。

公开(公告)号：US20110291070A1

公开(公告)日：2011-12-01

申请号：US13112022

申请日：2011-05-20

申请人： Jong Hak WON ,  Sun Kyung Kim ,  Kyoung Woo Jo ,  Joong Seo Park

发明人： Jong Hak WON ,  Sun Kyung Kim ,  Kyoung Woo Jo ,  Joong Seo Park

IPC分类号： H01L33/06

CPC分类号： H01L33/0066 ,  H01L21/0237 ,  H01L21/02538 ,  H01L21/02639 ,  H01L21/02642 ,  H01L21/02647 ,  H01L33/0079 ,  H01L33/10 ,  H01L33/22 ,  H01L33/44 ,  H01L33/46 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a substrate, a light emitting structure comprising a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, the light emitting structure being disposed on the substrate, a nonmetal pattern disposed between the substrate and the active layer, the nonmetal pattern being spaced from the substrate, and an air gap disposed on a side surface of the nonmetal pattern.

摘要翻译： 提供了一种发光器件，发光器件封装和照明系统。 发光器件包括衬底，包括第一导电类型半导体层，有源层和第二导电类型半导体层的发光结构，发光结构设置在衬底上，非金属图案设置在衬底和 所述有源层，所述非金属图案与所述基板间隔开，以及设置在所述非金属图案的侧表面上的气隙。

公开(公告)号：US20110227111A1

公开(公告)日：2011-09-22

申请号：US13031825

申请日：2011-02-22

申请人： Hyun Min CHOI ,  Sun Kyung Kim ,  Woon Kyung Choi

发明人： Hyun Min CHOI ,  Sun Kyung Kim ,  Woon Kyung Choi

IPC分类号： H01L33/46 ,  B82Y20/00

CPC分类号： H01L33/405 ,  H01L33/42 ,  H01L33/46 ,  H01L2224/48091 ,  H01L2924/00014

摘要： Provided are a light emitting device and a light emitting device package. The light emitting device includes a transparent substrate, a light emitting structure, and a first reflection layer. The light emitting structure includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer that are disposed on a top surface of the substrate. The first reflection layer is disposed on a bottom surface of the substrate. The bottom surface of the substrate has a surface roughness of about 1 nm to about 15 nm in root mean square (RMS) value.

摘要翻译： 提供了一种发光器件和发光器件封装。 发光器件包括透明衬底，发光结构和第一反射层。 发光结构包括设置在基板的顶表面上的第一导电类型半导体层，有源层和第二导电类型半导体层。 第一反射层设置在基板的底面上。 基板的底表面的均方根（RMS）值具有约1nm至约15nm的表面粗糙度。

公开(公告)号：US20110198645A1

公开(公告)日：2011-08-18

申请号：US13022255

申请日：2011-02-07

申请人： Kyoung Woo Jo ,  Sun Kyung Kim

发明人： Kyoung Woo Jo ,  Sun Kyung Kim

IPC分类号： H01L33/58

CPC分类号： H01L33/58 ,  H01L33/0095 ,  H01L33/405 ,  H01L33/44 ,  H01L33/50 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2924/01055 ,  H01L2924/01068 ,  H01L2924/01322 ,  H01L2924/12032 ,  H01L2933/0083 ,  H01L2924/00014 ,  H01L2924/00

摘要： Disclosed are a light emitting device, a method of manufacturing the same and a light emitting device package. The light emitting device of the embodiment includes a light emitting structure including a first conductive semiconductor layer, a second conductive semiconductor layer and an active layer between the first and second conductive semiconductor layers; a fluorescent layer on the light emitting structure; and a light extracting structure on the fluorescent layer. The light extracting structure extracts light, which is generated in the light emitting structure and incident into an interfacial surface between the fluorescent layer and the light extracting structure, to an outside of the light emitting structure.

摘要翻译： 公开了发光器件，其制造方法和发光器件封装。 本实施例的发光器件包括发光结构，其包括第一导电半导体层，第二导电半导体层和在第一和第二导电半导体层之间的有源层; 在发光结构上的荧光层; 以及荧光层上的光提取结构。 光提取结构提取在发光结构中产生并入射到荧光层和光提取结构之间的界面的光到发光结构的外部。

公开(公告)号：US20110068355A1

公开(公告)日：2011-03-24

申请号：US12793781

申请日：2010-06-04

申请人： Sun Kyung Kim ,  Jin Wook Lee

发明人： Sun Kyung Kim ,  Jin Wook Lee

IPC分类号： H01L33/02 ,  H01L33/30 ,  H01L33/42

CPC分类号： H01L33/38 ,  H01L33/42 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A light emitting device and a light emitting device package including the same are provided. The light emitting device may include a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer, a first electrode on the light emitting structure, the first electrode including a pattern, and a pad electrode on the first electrode.

摘要翻译： 提供一种发光器件和包括该发光器件的发光器件封装。 发光器件可以包括发光结构，其包括第一导电类型半导体层，有源层和第二导电类型半导体层，发光结构上的第一电极，包括图案的第一电极和焊盘电极 在第一个电极上。

公开(公告)号：US07755097B2

公开(公告)日：2010-07-13

申请号：US11948828

申请日：2007-11-30

申请人： Sun Kyung Kim

发明人： Sun Kyung Kim

IPC分类号： H01L33/00

CPC分类号： H01L33/20 ,  H01L33/44 ,  H01L33/50 ,  H01L33/505 ,  H01L33/58 ,  H01L2933/0083

摘要： A light emitting device having a light extraction structure, which is capable of achieving an enhancement in light extraction efficiency and reliability, and a method for manufacturing the same. The light emitting device includes a semiconductor layer having a multi-layered structure including a light emission layer; and a light extraction structure formed on the semiconductor layer in a pattern having unit structures. Further, the wall of each of the unit structures is sloped at an angle of −45° to +45° from a virtual vertical line being parallel to a main light emitting direction of the light emitting device.

摘要翻译： 具有能够提高光提取效率和可靠性的具有光提取结构的发光器件及其制造方法。 发光器件包括具有包括发光层的多层结构的半导体层; 以及以具有单位结构的图案形成在所述半导体层上的光提取结构。 此外，每个单元结构的壁与平行于发光器件的主发光方向的虚拟垂直线成-45°至+45°的角度倾斜。