公开(公告)号：US20110045166A1

公开(公告)日：2011-02-24

申请号：US12859927

申请日：2010-08-20

申请人： Satoshi Shimmura ,  Tetsuo Fukuoka ,  Takahiro Kitano

发明人： Satoshi Shimmura ,  Tetsuo Fukuoka ,  Takahiro Kitano

IPC分类号： C23C16/52 ,  C23C16/22

CPC分类号： C23C16/24 ,  C23C16/4485

摘要： The hydrophobicizing apparatus includes a vaporizing surface forming member of which surface is located in a vaporizing room; a vaporizing surface heating unit that heats the vaporizing surface forming member; a liquid chemical supply port that supplies a liquid chemical for a hydrophobicizing process on the surface of the vaporizing surface forming member; a gas inlet port that introduces a carrier gas into the vaporizing room; an outlet port that supplies a hydrophobicizing gas vaporized in the vaporizing room; and a processing chamber that performs the hydrophobicizing process on a substrate accommodated therein by the hydrophobicizing gas supplied through the outlet port. With this configuration, the hydrophobicizing gas of a high concentration can be supplied onto the substrate. Further, since the stored liquid chemical is not in contact with the carrier gas when a process is not being performed, degradation of the liquid chemical is suppressed.

摘要翻译： 疏水化装置包括表面位于蒸发室内的蒸发表面形成构件; 蒸发表面加热单元，其加热蒸发表面形成构件; 在蒸发表面形成构件的表面上提供用于疏水化处理的液体化学品的液体化学物质供给口; 将载气引入蒸发室的气体入口; 提供在蒸发室中蒸发的疏水化气体的出口; 以及处理室，其通过由出口供给的疏水化气体在容纳在其中的基板上进行疏水化处理。 利用这种结构，能够将高浓度的疏水化气体供给到基板上。 此外，由于当不进行处理时，储存的液体化学品不与载气接触，所以抑制了液体化学物质的劣化。

公开(公告)号：US07740410B2

公开(公告)日：2010-06-22

申请号：US11631514

申请日：2005-07-13

申请人： Takanori Nishi ,  Takahiro Kitano ,  Katsuya Okumura

发明人： Takanori Nishi ,  Takahiro Kitano ,  Katsuya Okumura

IPC分类号： G03B5/00 ,  G03B13/00

CPC分类号： G03F7/3021 ,  G03F7/26 ,  G03F7/38 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67178

摘要： A developing apparatus has a substrate holder to hold a substrate, a heater which is provided in a substrate holder, and heats a substrate on a substrate holder for processing a resist film by PEB, a cooler to cool a substrate on a substrate holder, a developing solution nozzle to supply a developing solution to a substrate on a substrate holder, and a controller to control a heater, a cooler and a developing nozzle.

摘要翻译： 显影装置具有用于保持基板的基板保持器，设置在基板保持器中的加热器，并且加热用于通过PEB处理抗蚀剂膜的基板保持器上的基板，冷却器以冷却基板保持器上的基板， 显影溶液喷嘴将显影液供给到基板保持器上的基板，以及控制器，用于控制加热器，冷却器和显影喷嘴。

公开(公告)号：US07510611B2

公开(公告)日：2009-03-31

申请号：US11091760

申请日：2005-03-29

申请人： Tomohide Minami ,  Shinichi Sugimoto ,  Takahiro Kitano ,  Jun Ookura ,  Hiroaki Kurishima

发明人： Tomohide Minami ,  Shinichi Sugimoto ,  Takahiro Kitano ,  Jun Ookura ,  Hiroaki Kurishima

IPC分类号： B05B3/00 ,  B05C11/02 ,  B05C11/00 ,  B08B3/00

CPC分类号： H01L21/6715 ,  B05D1/005 ,  B05D1/02

摘要： A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.

公开(公告)号：US07435477B2

公开(公告)日：2008-10-14

申请号：US10509000

申请日：2004-02-09

申请人： Yoshifumi Adachi ,  Takahiro Kitano ,  Hirotama Fujimaru ,  Hiroyuki Ikeuchi ,  Katsuyuki Wada

发明人： Yoshifumi Adachi ,  Takahiro Kitano ,  Hirotama Fujimaru ,  Hiroyuki Ikeuchi ,  Katsuyuki Wada

IPC分类号： B32B5/16

CPC分类号： C08F220/06 ,  B01J20/26 ,  B01J20/261 ,  B01J20/267 ,  B01J20/28004 ,  B01J20/28016 ,  C08F222/1006 ,  Y10T428/2998 ,  Y10T428/31855 ,  Y10T428/3188

摘要： A particulate water absorbent contains a water absorbent resin as a main component, the water absorbent resin being a crosslinked polymer of a water-soluble unsaturated monomer. The water absorbent resin is particular in shape and contains particles of a particle size in a range of not less than 106 μm and less than 850 μm in an amount of not less than 90 mass percent with respect to the total mass of the water absorbent resin contained in the particulate water absorbent. The particulate water absorbent has a first salt concentration absorption index of not less than 0.60 as measured by a formula below when ion exchange water is used as an aqueous solution of a constant salt concentration: (salt concentration absorption index)=(absorbency against a pressure of 4.83 kPa with respect to the aqueous solution of a constant salt concentration)/(absorbency against no pressure with respect to the aqueous solution of a constant salt concentration).

摘要翻译： 颗粒状吸水剂含有吸水性树脂作为主要成分，吸水性树脂为水溶性不饱和单体的交联聚合物。 吸水性树脂特别是形状，并且相对于吸水性树脂的总质量，其粒径在不小于106μm和小于850μm的范围内，其量不小于90质量％ 包含在颗粒状吸水剂中。 当使用离子交换水作为恒盐浓度的水溶液时，颗粒状吸水剂的第一盐浓度吸收指数为不低于0.60;（盐浓度吸收指数）=（吸收压力 相对于恒盐浓度的水溶液为4.83kPa）/（相对于恒盐浓度的水溶液的无压吸收性）。

公开(公告)号：US20080182217A1

公开(公告)日：2008-07-31

申请号：US12020898

申请日：2008-01-28

申请人： Tetsuo Fukuoka ,  Takahiro Kitano ,  Kazuo Terada

发明人： Tetsuo Fukuoka ,  Takahiro Kitano ,  Kazuo Terada

IPC分类号： F27D15/02 ,  F27D3/00

CPC分类号： F27B17/0025 ,  H01L21/67109 ,  H01L21/67248

摘要： A heating device 1 includes a flat heating chamber 3 provided with a side opening. A substrate W is carried in a horizontal position through the side opening into the processing chamber 3, and is subjected to a heating process in the heating chamber 3. the heating chamber 3 is provided with heating plates 34 and 35 respectively provided with heating elements 34a and 35a, and a cooling mechanism 2 for cooling the heating plates 34 and 35. A controller 7 controls the cooling mechanism such that the heating plates 34 and 35 are cooled after the completion of the heating process for heating the substrate W and before a succeeding substrate W is carried into the heating chamber 3, and controls the heating elements 34a and 35a such that the heating plates 34 and 35 are heated at a processing temperature after the succeeding substrate has been carried into the heating chamber 3.

摘要翻译： 加热装置1包括具有侧开口的平坦加热室3。 基板W通过侧开口在水平位置被运送到处理室3中，并且在加热室3中进行加热处理。 加热室3设置有分别设有加热元件31a和35a的加热板34和35，以及用于冷却加热板34和35的冷却机构2。 控制器7控制冷却机构，使得加热板34和35在完成用于加热基板W的加热过程之后并且在将下一个基板W运送到加热室3之前被冷却，并且控制加热元件34a 和35a，使得加热板34和35在后续基板被运送到加热室3之后的加工温度下被加热。

公开(公告)号：US20070181928A1

公开(公告)日：2007-08-09

申请号：US11508141

申请日：2006-08-23

申请人： Yoshiki Yamanishi ,  Muneo Harada ,  Takahiro Kitano ,  Tatsuzo Kawaguchi ,  Yoshihiro Hirota ,  Kinji Yamada ,  Tomotaka Shinoda ,  Katsuya Okumura ,  Shuichi Kawano

发明人： Yoshiki Yamanishi ,  Muneo Harada ,  Takahiro Kitano ,  Tatsuzo Kawaguchi ,  Yoshihiro Hirota ,  Kinji Yamada ,  Tomotaka Shinoda ,  Katsuya Okumura ,  Shuichi Kawano

IPC分类号： H01L29/94

CPC分类号： H01L23/50 ,  H01G4/228 ,  H01G4/33 ,  H01L23/481 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01056 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H05K1/162 ,  H05K3/002 ,  H05K2201/09509 ,  H05K2201/096 ,  H05K2201/10378

摘要： A capacitor having a high quality and a manufacturing method of the same are provided. A capacitor has a lower electrode formed on an oxide film, a dielectric layer formed on the lower electrode, an upper electrode formed so as to face the lower electrode with the dielectric layer between, and an upper electrode formed so as to cover the upper electrode, an opening portion of the upper electrode and an opening portion of the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to pattern the dielectric layer by using the upper electrode as a mask, and provide a capacitor having a high-quality dielectric layer by preventing impurity diffusion into the dielectric layer. By forming the upper electrode on the dielectric layer, it is possible to prevent the dielectric layer from being exposed to etching liquid, liquid developer, etc.

摘要翻译： 提供了具有高质量的电容器及其制造方法。 电容器具有形成在氧化膜上的下电极，形成在下电极上的电介质层，形成为与电极之间介电层相对的下电极的上电极和形成为覆盖上电极的上电极 ，上电极的开口部分和电介质层的开口部分。 通过在电介质层上形成上电极，可以通过使用上电极作为掩模对电介质层进行图案化，并且通过防止杂质扩散到电介质层中来提供具有高质量电介质层的电容器。 通过在电介质层上形成上部电极，可以防止电介质层暴露于蚀刻液体，液体显影剂等

公开(公告)号：US20070170170A1

公开(公告)日：2007-07-26

申请号：US11642827

申请日：2006-12-21

申请人： Noboyuki Sata ,  Takahiro Kitano ,  Tetsuo Fukuoka ,  Toshiyuki Matsumoto ,  Tomohide Minami

发明人： Noboyuki Sata ,  Takahiro Kitano ,  Tetsuo Fukuoka ,  Toshiyuki Matsumoto ,  Tomohide Minami

IPC分类号： H05B1/02

CPC分类号： H05B1/0233 ,  H01L21/67248

摘要： This invention provides a wafer-type temperature sensor capable of eliminating the need for an A/D converter, adapting itself to automation and improving the heat resistance to measure temperature distribution of the upper surface of a wafer, a temperature measuring device using the sensor, a thermal processor having a temperature measurement function and a temperature measurement method. The wafer-type temperature sensor comprises a wafer and a plurality of temperature sensors arranged in regions which are formed by segmenting the upper surface of the wafer into a plurality of regions. Each of the temperature sensors includes an oscillation circuit for oscillating a frequency signal corresponding to the temperature of its own region within a frequency band that is different for every region in response to input of power supply voltage.

摘要翻译： 本发明提供一种晶片式温度传感器，其能够消除对A / D转换器的需要，适应自动化和提高耐热性，以测量晶片上表面的温度分布，使用该传感器的温度测量装置， 具有温度测量功能和温度测量方法的热处理器。 晶片型温度传感器包括晶片和多个温度传感器，其布置在通过将晶片的上表面分割成多个区域而形成的区域中。 每个温度传感器包括振荡电路，用于响应于电源电压的输入，在与每个区域不同的频带内振荡对应于其自身区域的温度的频率信号。

公开(公告)号：US20070126041A1

公开(公告)日：2007-06-07

申请号：US11508204

申请日：2006-08-23

申请人： Tomotaka Shinoda ,  Kinji Yamada ,  Takahiro Kitano ,  Yoshiki Yamanishi ,  Muneo Harada ,  Tatsuzo Kawaguchi ,  Yoshihiro Hirota ,  Katsuya Okumura ,  Shuichi Kawano

发明人： Tomotaka Shinoda ,  Kinji Yamada ,  Takahiro Kitano ,  Yoshiki Yamanishi ,  Muneo Harada ,  Tatsuzo Kawaguchi ,  Yoshihiro Hirota ,  Katsuya Okumura ,  Shuichi Kawano

IPC分类号： H01L29/94 ,  H01L21/00

CPC分类号： H01L28/65 ,  H01L27/11507 ,  H01L28/55 ,  Y10T29/435

摘要： A dielectric film capacitor includes a lower electrode having an opening and formed of a material including platinum, a dielectric film provided over the lower electrode and including an oxide having an ABOx crystal structure, and an upper electrode provided over the dielectric film. The planar area of the lower electrode is 50% or more of the area of a formation region of the dielectric film. A dielectric film capacitor includes a lower electrode formed of a material including platinum and having a thickness of 10 to 100 nm, a dielectric film provided over the lower electrode and including an oxide having an ABOx crystal structure, and an upper electrode provided over the dielectric film.

摘要翻译： 电介质膜电容器包括具有开口并由包括铂的材料形成的下电极，设置在下电极上并包括具有ABOx晶体结构的氧化物的电介质膜和设置在电介质膜上的上电极。 下部电极的平面面积为电介质膜的形成区域的面积的50％以上。 电介质膜电容器包括由包括铂的材料形成的厚度为10至100nm的下电极，设置在下电极上并包括具有ABOx晶体结构的氧化物的电介质膜，以及设置在电介质上的上电极 电影。

公开(公告)号：US07223945B2

公开(公告)日：2007-05-29

申请号：US11352340

申请日：2006-02-13

申请人： Hiroshi Shinya ,  Takahiro Kitano

发明人： Hiroshi Shinya ,  Takahiro Kitano

IPC分类号： H05B1/02

CPC分类号： H01L21/67253 ,  H01L21/67098 ,  H01L21/67248

摘要： With respect to a substrate on which a resist solution is applied, the inplane uniformity of the quality of a resist film is improved in a heating processing carried out before exposure, and the yields of products are improved. A substrate on which a resist solution is applied is mounted on a heating plate in a processing vessel. Then, a purge gas is supplied into the processing vessel, and heating is started. Above the mounting position of the substrate, a thickness detecting sensor for monitoring the thickness of the resist film formed on the surface of the substrate is provided. When the thickness becomes a predetermined value or less, a control part cause a lift pin to upwardly move so as to increase the distance between the substrate and the heating plate. Thus, the heating value applied to the substrate decreases, and thereafter, only the solvent is volatilized without having a bad influence on a polymer in the resist film.

摘要翻译： 对于其上施加抗蚀剂溶液的基板，在曝光之前进行的加热处理中抗蚀剂膜的质量的面内均匀性得到改善，并且产品的收率得到改善。 将其上施加有抗蚀剂溶液的基板安装在处理容器中的加热板上。 然后，向处理容器供给净化气体，开始加热。 在基板的安装位置之上，设置有用于监测形成在基板的表面上的抗蚀剂膜的厚度的厚度检测传感器。 当厚度变为预定值或更小时，控制部分使升降销向上移动，以增加基板和加热板之间的距离。 因此，施加到基板的加热值降低，此后仅溶剂挥发而对抗蚀剂膜中的聚合物没有不利影响。

公开(公告)号：US20070106013A1

公开(公告)日：2007-05-10

申请号：US10562140

申请日：2004-06-23

申请人： Yoshifumi Adachi ,  Takahiro Kitano ,  Shinichi Fujino ,  Katsuyuki Wada ,  Kazushi Torii ,  Taku Iwamura ,  Sayaka Machida

发明人： Yoshifumi Adachi ,  Takahiro Kitano ,  Shinichi Fujino ,  Katsuyuki Wada ,  Kazushi Torii ,  Taku Iwamura ,  Sayaka Machida

IPC分类号： C09D5/02

CPC分类号： A61L15/60 ,  A61F2013/530686 ,  A61F2013/530744

摘要： The production method of a water absorbent resin composition including a particulate water absorbent resin, wherein: 95 wt % or more of particles whose particle diameter is less than 850 μm and not less, than 106 μm are contained, and a weight average particle diameter of the particles is less than 500 μm and not less than 300 μm and a logarithmic standard deviation (σξ) of a particle size distribution is 0.45 or less, and a water-soluble component of the water absorbent composition is 35 wt % or less, and a multivalent metal component is contained, and an extraction rate of the multivalent metal component is 5.0 wt % or more and less than 100 wt %, thereby providing the water absorbent resin composition, free from any coagulation of particles in high humidity, which has superior absorbent property in terms of an absorbency and a diffusing absorbency under pressure.

摘要翻译： 含有颗粒状吸水性树脂的吸水性树脂组合物的制造方法，其中含有95重量％以上的粒径小于850μm，不小于106μm的颗粒，重量平均粒径为 粒子小于500μm且不小于300μm，粒度分布的对数标准偏差（sigmaxi）为0.45以下，吸水性组合物的水溶性成分为35重量％以下， 含有多价金属成分，多价金属成分的提取率为5.0重量％以上且小于100重量％，因此提供了在高湿度下没有任何凝结的高吸湿性树脂组合物，其具有优异的 就吸收性而言，在压力下的扩散吸收性。