Abstract:
An agitation apparatus (100) has a substantially cylindrically shaped agitation vessel (102); a rotation shaft (150) provided along the central axis of the agitation vessel (102); a substantially cylindrically shaped agitation member (104) having an outer diameter smaller than the inner diameter of the agitation vessel (102) and being fitted to the rotation shaft (150) so as to rotate concentrically with an inner circumferential surface of the agitation vessel (102); and a plurality of through holes (162, 164) formed through the agitation member (104) in radial directions of the agitation member. In the agitation apparatus (100), a gap between the inner circumferential surface of the agitation vessel (102) and the outer circumferential surface of the agitation member (104) is partially varied along a vertical direction of the agitation member (104). For example, the gap between the inner circumferential surface of the agitation vessel (102) and the outer circumferential surface of the agitation member (104) is wider at a lower portion (S2) of the agitation member (104) than at an upper portion (S1) of the agitation member (104).
Abstract:
In this AG-AND type flash memory, a layered bit line configuration where a memory array is divided into a plurality of sub blocks, new main bit lines are allocated so as to correspond to each sub block, and a main bit line is selectively connected to a global bit line in an upper layer via a switch is adopted, so that charge sharing write-in is carried out between two main bit lines. Accordingly, write-in of data into the flash memory can be carried out with low power consumption, and the threshold voltage can be controlled with precision.
Abstract:
In this AG-AND type flash memory, a layered bit line configuration where a memory array is divided into a plurality of sub blocks, new main bit lines are allocated so as to correspond to each sub block, and a main bit line is selectively connected to a global bit line in an upper layer via a switch is adopted, so that charge sharing write-in is carried out between two main bit lines. Accordingly, write-in of data into the flash memory can be carried out with low power consumption, and the threshold voltage can be controlled with precision.
Abstract:
In this AG-AND type flash memory, a layered bit line configuration where a memory array is divided into a plurality of sub blocks, new main bit lines are allocated so as to correspond to each sub block, and a main bit line is selectively connected to a global bit line in an upper layer via a switch is adopted, so that charge sharing write-in is carried out between two main bit lines. Accordingly, write-in of data into the flash memory can be carried out with low power consumption, and the threshold voltage can be controlled with precision.
Abstract:
Using charges accumulated in a capacitance element connected to a drain side node of a memory cell, data is written in accordance with source side injection method. The capacitance value of the capacitance element is changed in accordance with the value of write data. A non-volatile semiconductor memory device allowing writing of multi-valued data at high speed with high precision is achieved.
Abstract:
A monitor circuit for monitoring external potential EXTVDD and variable delay circuit determine the time interval in which signal ZODACT is being at the L level according to the potential level of external potential EXTVDD, and thus the supplying time of external potential EXTVDD can be dynamically changed. When external potential EXTVDD is at the upper limit of specification of product, the supplying time is short, thereby preventing overcharge of memory cells or bit lines. When external potential EXTVDD is at the lower limit of specification of product, the supplying time becomes longer, thereby ensuring a sufficient over-driving time interval. It is possible to ensure the reliability of the memory cells and perform the reading operation throughout the entire range of the specification of product of external potential EXTVDD. Therefore, it is possible to provide a semiconductor memory device capable of performing a reading operation at high speeds while ensuring the reliability.
Abstract:
A monitor circuit for monitoring external potential EXTVDD and variable delay circuit determine the time interval in which signal ZODACT is being at the L level according to the potential level of external potential EXTVDD, and thus the supplying time of external potential EXTVDD can be dynamically changed. When external potential EXTVDD is at the upper limit of specification of product, the supplying time is short, thereby preventing overcharge of memory cells or bit lines. When external potential EXTVDD is at the lower limit of specification of product, the supplying time becomes longer, thereby ensuring a sufficient over-driving time interval. It is possible to ensure the reliability of the memory cells and perform the reading operation throughout the entire range of the specification of product of external potential EXTVDD. Therefore, it is possible to provide a semiconductor memory device capable of performing a reading operation at high speeds while ensuring the reliability.
Abstract:
A chip type capacitor which has improved bond strength between an anode lead wire and an anode terminal and enhanced reliability, and a method for preparing the chip type capacitor and an anode terminal. The chip type capacitor has a solid electrolytic capacitor element including an element body having an anode body, a dielectric and a cathode body, and an anode lead wire partially extending from the anode body of the element body. An anode terminal is electrically connected to the portion of the anode lead wire extending from the anode body. This extending portion of the anode lead wire has about 75% or more of its periphery, in the direction substantially perpendicular to the extending direction of the anode lead wire, covered with solidified matter resulting from solidification of a melt, thereby bonding the anode terminal and the anode lead wire to each other.
Abstract:
A semiconductor device according to the present invention has a configuration that a resistance section is connected to only one of a current-mirror section forming a voltage conversion circuit and an output section. With this configuration, it is possible to determine the temperature dependency of an output voltage according to S factors of transistors forming one of the current-mirror section and the output section and a resistance value of the resistance section, and to suppress manufacturing irregularities caused by irregularities of the transistors between the two sections and those among a plurality of resistance materials.
Abstract:
A repeater receives an internal clock distributed from a DLL circuit irrespective of a data reading operation and outputs a DLL clock to a data output circuit and a data strobe signal output circuit in response to an internal signal only in the data reading operation. The data strobe signal output circuit receives the internal clock and the DLL clock, generates a data strobe signal in synchronization with the internal clock, and outputs the generated data strobe signal in synchronization with the DLL clock. As a result, a semiconductor memory device attains further reduction of power consumption during active-standby and a secure supply of the internal clock to a prescribed circuit.