摘要:
A manufacturing method of a reactor includes: assembling an assembly constituted by a coil and a bobbin by inserting the bobbin, which includes a tube portion and a flange portion, through the coil so that a tip of the tube portion protrudes from the coil; forming a cavity by installing the assembly in a first die so that a portion of a coil lateral face comes into contact with a cavity face of the first die, and closing a second die so that the second die is opposed to the first die; and extending first press rods from a cavity face of the second die toward the bobbin in the cavity, and injecting a resin into the cavity while pressing both ends of the bobbin in an axial direction of the coil from an opposite side to the portion of the coil lateral face.
摘要:
A plastic screw grommet includes a head portion provided with a screwing hole for a tapping screw, and a leg portion expanded or prevented from deflecting by screwing the tapping screw. A hole diameter of the screwing hole is made smaller than an outer diameter of the above-mentioned tapping screw and larger than a root diameter of the tapping screw. Also, a projecting portion for filling a screw groove of the tapping screw to be screwed is formed in an inner face of the screwing hole.
摘要:
A boat propulsion engine includes a buoyant member (20) disposed on a case body that houses a drive shaft (47) in order to lift the stern. The buoyant member has a lower surface (32) that slopes downward in the rearward direction.
摘要:
A semiconductor optical module M is disclosed, where it includes a stem 2 that installing electronic components 1, a lead pin 3, a circular cap 10, and a lens 5 assembled within the cap 10; and has a flange 12 for welding in an end of the cap 10 opposite to the stem 2, the flange radially extending outward. When the cap 10 is welded to the housing A, the cap 10 may be abutted as setting the welding line b nearly equal to the right angle with respect to the flange 12 of the cap, which increases the welding strength. Because the flange does not form any walls of the cap, the loss of the air-tightness due to the welding may be prevented. Moreover, because the flange radially extends outward at the end of the cap, which is apart from the lens 5, the lens may be secured against the damage.
摘要:
In a boat-propelling machine for attachment to a boat hull (200), an outer wall unit (4) is fixedly provided on a body of the machine for covering part of a cylindrical structural body (60) that is formed of metal alloy and positioned so as to be at least above a draft line during planning of the boat, and a lift force generation device (20) is provided on the outer vertical wall unit.
摘要:
A boat propulsion engine (1) comprises a main body (4) that extends substantially vertically in relation to a hull (Si), a lift generator (20) disposed in a rear portion of the main body (4), and supporting bodies (24) that support the lift generator (20) on the main body (4). The lift generator (20) has a surface (21g, 21h) that extends transversely relative to the main body (4) and that is located behind at least the main body (4). The supporting bodies (24) extend backward from the main body (4) to the lift generator (20) in a single vertical direction relative to a surface (21g, 21h) of the lift generator (20).
摘要:
An optical module 1 comprises a first optical element F1, a first light receiving subassembly PD1, a second optical element F2, a second light receiving subassembly PD2, a light emitting subassembly LD3 for generating light, and a light transmitting part 3 optically coupled to the first optical element. The light emitting subassembly LD3, the first optical element F1, the second optical element F2 and the first light receiving subassembly PD1 are arranged along a predetermined plane S1. The light emitting subassembly LD3, the first optical element F1, the second optical element F2, and the second light receiving subassembly PD2 are arranged along another predetermined plane S2. The predetermined plane S1 intersects at a predetermined angle with the other predetermined plane S2.
摘要:
A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.
摘要:
The inventor found that the lightwave of a semiconductor laser includes, in addition to the laser oscillation lightwave, a weak, continuous noise component having a different wavelength (here, referred to as natural emission lightwave). The inventor also found that in the wavelength division multiplexing communication optical system in which signal lightwaves having a plurality of wavelengths are combined to transmit over a single optical fiber so as to be separated at the other end to receive with a plurality of light-receiving devices, the natural emission lightwave causes crosstalk. A natural emission lightwave-blocking filter that reflects a natural emission lightwave is placed on the optical path between the semiconductor laser and the optical fiber. The natural emission lightwave-blocking filter blocks the natural emission lightwave, preventing the crosstalk.
摘要:
An optical semiconductor apparatus has an eyelet having a through hole, an insulating member provided in the through hole, a semiconductor optical element, and a submount on which the semiconductor optical element is mounted. The insulating member supports a plurality of lead terminals. The submount has a first portion supported by the eyelet, a second portion supported by the eyelet, and a third portion disposed between the first portion and the second portion and located above the insulating member. The semiconductor optical element is provided on the third portion of the submount.