公开(公告)号：US09052354B2

公开(公告)日：2015-06-09

申请号：US13392352

申请日：2010-08-26

申请人： Hideki Takenaga ,  Eiji Iwami ,  Tomoyuki Sawada ,  Hiroaki Tsujimoto ,  Keisuke Yoshikawa ,  Suguru Fukui

发明人： Hideki Takenaga ,  Eiji Iwami ,  Tomoyuki Sawada ,  Hiroaki Tsujimoto ,  Keisuke Yoshikawa ,  Suguru Fukui

IPC分类号： G01R33/02 ,  G01R33/09 ,  H01L43/06

摘要： A magnetic field sensor includes: a magnetic thin film; a feeder comprising an input and output terminals configured to supply element current to the magnetic thin film; and a detector configured to detect a voltage between ends of the magnetic thin film in a direction perpendicular to a direction of the element current. The magnetic thin film is Rained symmetric about the direction of the element current.

公开(公告)号：US08560090B2

公开(公告)日：2013-10-15

申请号：US12659786

申请日：2010-03-22

申请人： Tomoaki Sasaki ,  Kei Miura ,  Keisuke Yoshikawa

发明人： Tomoaki Sasaki ,  Kei Miura ,  Keisuke Yoshikawa

IPC分类号： G06F19/00

CPC分类号： G05B19/10 ,  G05B2219/23039

摘要： There is provided a monitor and control apparatus capable of enlarging a volume of a body, while ensuring a space for routing signal lines between a rear face of the body and a bottom surface of a mounting hole. The body 5 has a rear face including: a first face having terminal sections protruded; and a second face protruded backwardly relative to the first face by a stepped portion. An internal space of the body on the second face side is enlarged backwardly more than that on the first face side. The stepped portion is formed in the middle of the rear face of the body in the horizontal direction, which defines a right-half portion as the first face, and a left-half portion as the second face.

摘要翻译： 提供了一种能够放大身体体积的监视和控制装置，同时确保用于在身体的后表面和安装孔的底表面之间路由信号线的空间。 主体5具有后表面，其包括：具有突出的端子部的第一面; 以及通过阶梯部分相对于第一面向后突出的第二面。 第二面侧的身体的内部空间比第一面侧的内部空间多一些。 台阶部形成在主体的背面的水平方向的中间，其限定作为第一面的右半部分和作为第二面的左半部分。

公开(公告)号：US07943427B2

公开(公告)日：2011-05-17

申请号：US11632131

申请日：2005-07-13

申请人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

发明人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/4828 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2221/68377 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/85205 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/20752 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/20305 ,  H01L2924/00012

摘要： A substrate B for use in production of a semiconductor device is used, which substrate includes an adhesive sheet 50 having a base layer 51 and an adhesive layer 52, and a plurality of independently provided electrically conductive portions 20. A semiconductor element having electrodes 11 formed thereon is firmly fixed onto the substrate B, and upper portions of the plurality of electrically conductive portions 20 and the electrodes 11 of the semiconductor element 10 are electrically connected by using wires 30. The semiconductor element 10, wires 30 and electrically conductive portions 20 are sealed by using a sealing resin 40. Each of the electrically conductive portions 20 has overhanging portions 20a, and a side face 60a of the electrically conductive portion 20 is roughened, thus enhancing the joining strength between each electrically conductive portion 20 and the sealing resin 40.

摘要翻译： 使用用于制造半导体器件的基板B，该基板包括具有基底层51和粘合层52的粘合片50以及多个独立设置的导电部分20.具有形成电极11的半导体元件 其上牢固地固定在基板B上，并且多个导电部分20的上部和半导体元件10的电极11通过使用导线30电连接。半导体元件10，导线30和导电部分20是 通过使用密封树脂40密封。每个导电部分20具有突出部分20a，并且导电部分20的侧面60a被粗糙化，从而增强每个导电部分20和密封树脂40之间的接合强度 。

公开(公告)号：US20120229131A1

公开(公告)日：2012-09-13

申请号：US13392352

申请日：2010-08-26

申请人： Hideki Takenaga ,  Eiji Iwami ,  Tomoyuki Sawada ,  Hiroaki Tsujimoto ,  Keisuke Yoshikawa ,  Suguru Fukui

发明人： Hideki Takenaga ,  Eiji Iwami ,  Tomoyuki Sawada ,  Hiroaki Tsujimoto ,  Keisuke Yoshikawa ,  Suguru Fukui

IPC分类号： G01R33/05 ,  G01R21/00

CPC分类号： G01R33/09 ,  H01L43/06

摘要： A magnetic field sensor includes: a magnetic thin film; a feeder comprising an input and output terminals configured to supply element current to the magnetic thin film; and a detector configured to detect a voltage between ends of the magnetic thin film in a direction perpendicular to a direction of the element current. The magnetic thin film is Rained symmetric about the direction of the element current.

摘要翻译： 磁场传感器包括：磁性薄膜; 馈电器，其包括被配置为向所述磁性薄膜供应元件电流的输入和输出端子; 以及检测器，被配置为在与元件电流的方向垂直的方向上检测磁性薄膜的端部之间的电压。 磁性薄膜相对于元件电流的方向呈下降对称。

公开(公告)号：US08018044B2

公开(公告)日：2011-09-13

申请号：US11632348

申请日：2005-07-13

申请人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

发明人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

IPC分类号： H01L23/48

CPC分类号： H01L21/568 ,  H01L21/4828 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/62 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： A semiconductor device P includes a die pad 20, a semiconductor element 30 which is loaded on the die pad 20, and a sealing resin 40. A plurality of electrically conductive portions 10 each having a layered structure including a metal foil 1 comprising copper or a copper alloy, and electrically conductive portion plating layers 2 provided at both upper and lower ends of the metal foil 1 are arranged around the die pad 20. The die pad 20 has a lower die pad plating layer 2b, and the semiconductor element 30 is loaded on the die pad 20 comprising such a die pad plating layer 2b. Electrodes 30a provided on the semiconductor element 30 are electrically connected with top ends of the electrically conductive portions 10 via wires 3, respectively. The lower electrically conductive portion plating layers 2 of the electrically conductive portions 10 and the die pad plating layer 2b of the die pad 20 are exposed outside from the sealing resin 40 on their back faces.

摘要翻译： 半导体器件P包括管芯焊盘20，负载在管芯焊盘20上的半导体元件30和密封树脂40.多个导电部分10，每个导电部分10具有包括铜或金属箔的金属箔1的层状结构 铜合金和设置在金属箔1的上端和下端的导电部分电镀层2布置在管芯焊盘20周围。管芯焊盘20具有下焊盘镀层2b，并且半导体元件30被加载 在包括这种裸片焊盘镀层2b的芯片焊盘20上。 设置在半导体元件30上的电极30a分别经由导线3与导电部10的顶端电连接。 导电部分10的下部导电部分电镀层2和芯片焊盘20的芯片焊盘镀层2b在其背面从密封树脂40的外部露出。

公开(公告)号：US20100182262A1

公开(公告)日：2010-07-22

申请号：US12656213

申请日：2010-01-21

申请人： Keisuke Yoshikawa ,  Tomoaki Sasaki ,  Katsuhiko Kimura ,  Kei Miura ,  Akihiro Hiroishi ,  Satoshi Kitamura ,  Yulchiro Naoi ,  Mototsugu Kawamata ,  Yuichi Yoshimura

发明人： Keisuke Yoshikawa ,  Tomoaki Sasaki ,  Katsuhiko Kimura ,  Kei Miura ,  Akihiro Hiroishi ,  Satoshi Kitamura ,  Yulchiro Naoi ,  Mototsugu Kawamata ,  Yuichi Yoshimura

IPC分类号： G06F3/041 ,  G09G5/00

CPC分类号： G09G3/2096 ,  G06F1/1601 ,  G09G3/3406 ,  G09G2330/028 ,  H05K5/0017

摘要： In a monitoring and control device for use in a remote monitoring and control system, a device housing has a socket located behind a display panel and an external storage medium including a rewritable memory is removably mounted in the socket. The device housing is attached in an attachment hole formed in a wall in a state that the external storage medium is mounted in the socket. A control unit performs a setting operation for a graphic image displayed on the display panel and for the load control in accordance with setting information stored in the external storage medium. The external storage medium is inserted in the socket through an insertion slot formed in a side portion of the device housing, at least a portion of the insertion slot being received in the attachment hole in a state that the device housing is attached to the wall.

摘要翻译： 在用于远程监视和控制系统的监视和控制装置中，设备壳体具有位于显示面板后面的插座，并且包括可重写存储器的外部存储介质可移除地安装在插座中。 在外部存储介质安装在插座中的状态下，将装置壳体安装在形成在壁上的安装孔中。 控制单元根据存储在外部存储介质中的设置信息执行对显示面板上显示的图形图像的设置操作和负载控制。 外部存储介质通过形成在设备壳体的侧部中的插槽插入插座中，插入槽的至少一部分以装置壳体附接到壁的状态被容纳在附接孔中。

公开(公告)号：US07268191B2

公开(公告)日：2007-09-11

申请号：US11000905

申请日：2004-12-02

申请人： Eiji Toyoda ,  Takeshi Okada ,  Keisuke Yoshikawa ,  Takuya Eto ,  Kazuhiro Ikemura ,  Shinya Akizuki ,  Tsuyoshi Ishizaka ,  Takahiro Uchida ,  Kei Toyota

发明人： Eiji Toyoda ,  Takeshi Okada ,  Keisuke Yoshikawa ,  Takuya Eto ,  Kazuhiro Ikemura ,  Shinya Akizuki ,  Tsuyoshi Ishizaka ,  Takahiro Uchida ,  Kei Toyota

IPC分类号： C08L63/00 ,  C08L63/02 ,  C08L63/04 ,  H01L23/29

CPC分类号： C08L61/06 ,  C08G59/621 ,  C08G59/688 ,  C08L61/04 ,  C08L63/00 ,  H01L23/293 ,  H01L2224/45144 ,  H01L2224/48091 ,  C08L2666/22 ,  C08L2666/16 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.

摘要翻译： 一种半导体封装用环氧树脂组合物的制造方法，其不产生空穴生成等，可靠性优异。 一种半导体封装用环氧树脂组合物的制造方法，其含有以下成分（A）〜（C）：（A）环氧树脂，（B）酚醛树脂，（C）硬化促进剂， 预先在1.333〜66.65kPa的减压下和100〜230℃的加热条件下预先含有成分（A）〜（C）的成分中除了成分（A）以外的成分的全部或一部分 然后将组分（A）和其余组分与所得混合物混合。

公开(公告)号：US07262514B2

公开(公告)日：2007-08-28

申请号：US11115307

申请日：2005-04-27

申请人： Keisuke Yoshikawa ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Kazuhiro Ikemura

发明人： Keisuke Yoshikawa ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Kazuhiro Ikemura

IPC分类号： H01L23/29

CPC分类号： H01L21/568 ,  C08G59/621 ,  C08G59/688 ,  C09J163/00 ,  H01L23/293 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T428/1073 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： An epoxy resin composition for semiconductor encapsulation in producing surface mount lead-less thin semiconductor devices. The epoxy resin composition for surface mount lead-less semiconductor device encapsulation which device comprising an encapsulating resin layer and, encapsulated therein, a substrate, a semiconductor element mounted on the substrate, two or more conductive parts disposed around the semiconductor element, and wires which electrically connect electrodes of the semiconductor element to the conductive parts, wherein the bottom face of the substrate and the bottom face of each conductive part are exposed without being encapsulated in the encapsulating resin layer, and the epoxy resin composition used for forming the encapsulating resin layer has the following properties (α) and (β): (α) a melt viscosity of 2-10 Pa.s at 175° C.; and (β) a flexural strength of cured state of 130 MPa or higher at ordinary temperature.

摘要翻译： 一种用于半导体封装的环氧树脂组合物，用于生产表面安装无铅薄型半导体器件。 用于表面安装的无铅半导体器件封装的环氧树脂组合物，其包括封装树脂层，并且封装在其中的衬底，安装在衬底上的半导体元件，设置在半导体元件周围的两个或更多个导电部件，以及电线 将半导体元件的电极电连接到导电部分，其中基板的底面和每个导电部分的底面暴露而不被封装在封装树脂层中，并且用于形成封装树脂层的环氧树脂组合物 具有以下性质（α）和（β）：（α）在175℃下的熔体粘度为2-10Pa.s; 和（β）常温下固化状态的弯曲强度为130MPa以上。

公开(公告)号：US06452056B1

公开(公告)日：2002-09-17

申请号：US09763130

申请日：2001-02-20

申请人： Tsuneo Kawanobe ,  Osamu Takazawa ,  Keisuke Yoshikawa ,  Hiroyuki Watanabe

发明人： Tsuneo Kawanobe ,  Osamu Takazawa ,  Keisuke Yoshikawa ,  Hiroyuki Watanabe

IPC分类号： C07C2710

CPC分类号： C07C209/48 ,  C07C29/09 ,  C07C211/29 ,  C07C33/46

摘要： A fluorine-containing benzonitrile derivative (formula 1) is subjected to a reduction reaction to obtain a fluorine-containing benzylamine derivative (formula 2), and the amino group in said fluorine-containing benzylamine derivative is replaced with a hydroxyl group to obtain a fluorine-containing benzyl alcohol derivative (formula 3): wherein X is a halogen atom, when m is an integer of 2 or more, each X may be the same or different, and m is an integer of from 0 to 4.

摘要翻译： 对含氟苄腈衍生物（式1）进行还原反应，得到含氟苄胺衍生物（式2），所述含氟苄胺衍生物中的氨基被羟基置换，得到氟 （式3）：其中X为卤素原子，当m为2以上的整数时，各X可以相同也可以不同，m为0〜4的整数。

公开(公告)号：US20110291303A1

公开(公告)日：2011-12-01

申请号：US13207096

申请日：2011-08-10

申请人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

发明人： Chikao Ikenaga ,  Kentarou Seki ,  Kazuhito Hosokawa ,  Takuji Okeyui ,  Keisuke Yoshikawa ,  Kazuhiro Ikemura

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L21/568 ,  H01L21/4828 ,  H01L21/4832 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L23/62 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/83 ,  H01L24/85 ,  H01L2221/68377 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83385 ,  H01L2224/838 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/10253 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2924/20752 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512

摘要： A semiconductor device includes a die pad, a semiconductor element which is loaded on the die pad, and a sealing resin. A plurality of electrically conductive portions each having a layered structure including a metal foil comprising copper or a copper alloy, and electrically conductive portion plating layers provided at both upper and lower ends of the metal foil are arranged around the die pad. The die pad has a lower die pad plating layer, and the semiconductor element is loaded on the die pad comprising such a die pad plating layer. Electrodes provided on the semiconductor element are electrically connected with top ends of the electrically conductive portions via wires, respectively. The lower electrically conductive portion plating layers of the electrically conductive portions and the die pad plating layer of the die pad are exposed outside from the sealing resin on their back faces.

摘要翻译： 半导体器件包括管芯焊盘，负载在管芯焊盘上的半导体元件和密封树脂。 多个导电部分，每个导电部分具有包括铜或铜合金的金属箔的层状结构，以及设置在金属箔的上端和下端的导电部分镀层围绕芯片焊盘。 芯片焊盘具有下模板镀层，半导体元件被装载在包括这样的芯片焊盘镀层的芯片焊盘上。 设置在半导体元件上的电极分别通过导线与导电部分的顶端电连接。 导电部分的下部导电部分电镀层和芯片焊盘的芯片焊盘镀层在其背面上从密封树脂的外部露出。