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公开(公告)号：US4327422A
公开(公告)日：1982-04-27
申请号：US169791
申请日：1980-07-17
申请人： Ryoji Imazeki , Masayuki Hattori
发明人： Ryoji Imazeki , Masayuki Hattori
CPC分类号： G11C19/085 , G06F1/26 , H02H3/247
摘要： A power source device for a bubble memory unit, wherein there is supplied a first DC voltage E.sub.c which is applied to control circuitry for controlling the reading and writing of data, a second DC voltage signal E.sub.d which is applied to drive circuitry for driving a bubble memory element, and a memory signal M.sub.e which enables data to be written in or read from the bubble memory element, the signals E.sub.c, E.sub.d and M.sub.e being made to rise and fall according to a prescribed sequence as a commercial power supply is connected and disconnected. The power source device includes first and second DC power source circuits, a comparator circuit for comparing the magnitude of the first DC voltage E.sub.c with a reference level V.sub.M having a value greater than an allowable lower limit value, and a delay circuit. The second DC power source circuit is actuated following a prescribed time delay which begins when the value of signal E.sub.c surpasses the reference level V.sub.M at the time that the commercial power supply is connected, and the memory enable signal M.sub.e is produced after the second DC power source circuit has been actuated. The memory enable signal M.sub.e is made to vanish when the magnitude of signal E.sub.c drops below the reference potential V.sub.m at the time that the commercial power supply is disconnected, the second DC power source circuit being rendered non-operational following a prescribed time delay.
摘要翻译： 一种用于气泡存储单元的电源装置，其中提供了施加到用于控制数据的读取和写入的控制电路的第一DC电压Ec，施加到用于驱动气泡的驱动电路的第二DC电压信号Ed 存储器元件和存储器信号Me，其使得能够将数据写入或从气泡存储元件读取，使得根据作为商用电源的规定顺序使信号Ec，Ed和Me上升和下降的信号被连接和断开 。 电源装置包括第一和第二DC电源电路，比较电路，用于将第一DC电压Ec的大小与具有大于允许下限值的参考电平VM进行比较;以及延迟电路。 第二直流电源电路按照在商用电源连接时信号Ec的值超过参考电平VM开始的规定的时间延迟来启动，并且在第二直流电源之后产生存储器使能信号Me 源电路已被启动。 当商用电源断开时，当信号Ec的大小下降到参考电位Vm以下时，使存储器使能信号Me消失，第二直流电源电路在规定的时间延迟之后变得不可操作。
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公开(公告)号：US4001010A
公开(公告)日：1977-01-04
申请号：US500684
申请日：1974-08-26
CPC分类号： C21B13/0073 , C21B13/0086 , Y02P10/122 , Y02P10/136
摘要： Method and apparatus for processing reduced iron in which granular iron oxide charged into a vertical furnace is reduced by a reducing gas comprising mainly carbon monoxide and hydrogen, a substantial portion of the waste gas generated in the reduction process being regenerated in a recirculating system. The reduced iron which has been reduced in the vertical furnace is continuously discharged at a temperature above 500.degree. C under isolation from the exterior atmosphere and is received in a plurality of air tight, sealable component adjusting receptacles. The reduced iron received in the receptacles is subjected to component adjustment at a temperature ranging from 700.degree. to 1100.degree. C by using the regenerated reducing gas and, thereafter, it is discharged from the receptacles under isolation from the exterior atmosphere so as to be received in air tight sealable cooling receptacles thereby cooling the same to a temperature lower than 100.degree. C, the reduced iron being thereafter discharged from the receptacles.
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公开(公告)号：US08406366B2
公开(公告)日：2013-03-26
申请号：US12662669
申请日：2010-04-28
IPC分类号： H04L7/00
摘要： Disclosed herein is a synchronization circuit including: a first phase-locked loop circuit; a second phase-locked loop circuit; a first output circuit; a second output circuit; a first detection circuit; a second detection circuit; and a control circuit.
摘要翻译： 这里公开了一种同步电路，包括：第一锁相环电路; 第二锁相环电路; 第一输出电路; 第二输出电路; 第一检测电路; 第二检测电路; 和控制电路。
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54.发明授权公开(公告)号：US08279956B2
公开(公告)日：2012-10-02
申请号：US12568783
申请日：2009-09-29
IPC分类号： H04K1/10
CPC分类号： H04L27/2656 , H04L27/2665
摘要： Disclosed herein is an information processing apparatus including: a demodulation FFT processing section configured to carry out an FFT process on a demodulation-related signal extracted by making use of a demodulation FFT window from every symbol of a received OFDM signal and output the frequency-domain signal; a control FFT processing section configured to carry out a process equivalent to an FFT process on a control-related signal extracted by making use of a control FFT window from every symbol of the received OFDM signal and output the frequency-domain signal; a transmission-line information estimation section; an equalization section; a reception-quality computation/comparison section; and an FFT-window position control section configured to control the demodulation FFT window to be used by the demodulation FFT processing section and the control FFT window to be used by the control FFT processing section on the basis of a comparison result produced by the reception-quality computation/comparison section.
摘要翻译： 这里公开了一种信息处理装置，包括：解调FFT处理部，被配置为对通过使用来自接收的OFDM信号的每个符号的解调FFT窗口提取的解调相关信号执行FFT处理，并输出频域 信号; 控制FFT处理部，被配置为执行与通过利用来自所接收的OFDM信号的每个符号的控制FFT窗口提取的控制相关信号上的FFT处理相当的处理，并输出频域信号; 传输线信息估计部; 均衡部分 接收质量计算/比较部分; FFT窗口位置控制部分，被配置为基于由接收模式产生的比较结果来控制由解调FFT处理部分使用的解调FFT窗口和要由控制FFT处理部件使用的控制FFT窗口， 质量计算/比较部分。
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公开(公告)号：US20090181540A1
公开(公告)日：2009-07-16
申请号：US12405327
申请日：2009-03-17
申请人： Hirotaka Shida , Masayuki Hattori
发明人： Hirotaka Shida , Masayuki Hattori
IPC分类号： H01L21/304
CPC分类号： C09G1/02 , H01L21/3212
摘要： A chemical mechanical polishing method, including: chemically and mechanically polishing a polishing target surface by continuously performing a first polishing step and a second polishing step having a polishing rate lower than a polishing rate of the first polishing step, a chemical mechanical polishing aqueous dispersion used in the first polishing step and the second polishing step being a mixture of an aqueous dispersion and an aqueous solution, and the polishing rate being changed between the first polishing step and the second polishing step by changing a mixing ratio of the aqueous dispersion and the aqueous solution.
摘要翻译： 一种化学机械抛光方法，包括：通过连续进行第一抛光步骤和抛光速率低于第一抛光步骤的抛光速率的抛光速率的化学机械抛光水分散体，使用化学机械抛光水分散体，化学和机械抛光抛光目标表面 在第一抛光步骤和第二抛光步骤是水分散体和水溶液的混合物，并且抛光速率在第一抛光步骤和第二抛光步骤之间通过改变水分散体和水性分散体的混合比而改变 解。
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公开(公告)号：US07560384B2
公开(公告)日：2009-07-14
申请号：US11358224
申请日：2006-02-22
申请人： Hirotaka Shida , Masayuki Hattori
发明人： Hirotaka Shida , Masayuki Hattori
IPC分类号： H01L21/302
CPC分类号： C09G1/02 , H01L21/3212
摘要： A chemical mechanical polishing method, including: chemically and mechanically polishing a polishing target surface by continuously performing a first polishing step and a second polishing step having a polishing rate lower than a polishing rate of the first polishing step, a chemical mechanical polishing aqueous dispersion used in the first polishing step and the second polishing step being a mixture of an aqueous dispersion and an aqueous solution, and the polishing rate being changed between the first polishing step and the second polishing step by changing a mixing ratio of the aqueous dispersion and the aqueous solution.
摘要翻译： 一种化学机械抛光方法，包括：通过连续进行第一抛光步骤和抛光速率低于第一抛光步骤的抛光速率的抛光速率的化学机械抛光水分散体，使用化学机械抛光水分散体，化学和机械抛光抛光目标表面 在第一抛光步骤和第二抛光步骤是水分散体和水溶液的混合物，并且抛光速率在第一抛光步骤和第二抛光步骤之间通过改变水分散体和水性分散体的混合比而改变 解。
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公开(公告)号：US20080075186A1
公开(公告)日：2008-03-27
申请号：US11900636
申请日：2007-09-11
IPC分类号： H04L27/28
CPC分类号： H04L25/0234 , H04L25/0216 , H04L25/022 , H04L25/0222 , H04L25/025 , H04L25/03159 , H04L27/2647 , H04L2025/03414
摘要： An OFDM receiver may include OFDM-signal receiving means for receiving an orthogonal frequency division multiplexing (OFDM) signal; channel-characteristic estimating means for estimating a channel characteristic using pilot signals in the OFDM signal received by the OFDM-signal receiving means; and transmission-distortion compensating means for applying, on the basis of the channel characteristic estimated by the channel-characteristic estimating means, processing for compensating for transmission distortion to the OFDM signal received by the OFDM-signal receiving means. The channel-characteristic estimating means may include plural kinds of time-direction-channel estimating means used for the estimation of a channel characteristic, and switching control means for switching these estimating means according to a state of a channel.
摘要翻译： OFDM接收机可以包括用于接收正交频分复用（OFDM）信号的OFDM信号接收装置; 信道特性估计装置，用于使用由OFDM信号接收装置接收的OFDM信号中的导频信号来估计信道特性; 以及发送失真补偿装置，用于根据由信道特性估计装置估计的信道特性，应用用于补偿由OFDM信号接收装置接收的OFDM信号的发送失真的处理。 信道特性估计装置可以包括用于估计信道特性的多种时间 - 方向信道估计装置，以及根据信道状态切换这些估计装置的切换控制装置。
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58.发明申请Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices 审中-公开用于化学机械抛光的水分散体，用于制备水性分散体的试剂盒，化学机械抛光工艺以及用于制备半导体器件的方法公开(公告)号：US20070049180A1
公开(公告)日：2007-03-01
申请号：US11508893
申请日：2006-08-24
申请人： Hirotaka Shida , Akihiro Takemura , Masayuki Hattori , Gaku Minamihaba , Dai Fukushima , Nobuyuki Kurashima , Susumu Yamamoto , Yoshikuni Tateyama , Hiroyuki Yano
发明人： Hirotaka Shida , Akihiro Takemura , Masayuki Hattori , Gaku Minamihaba , Dai Fukushima , Nobuyuki Kurashima , Susumu Yamamoto , Yoshikuni Tateyama , Hiroyuki Yano
IPC分类号： B24B7/30
CPC分类号： C09G1/02 , B24B37/044 , H01L21/3212 , H01L21/76835 , H01L21/7684
摘要： An aqueous dispersion for chemical mechanical polishing contains water, a polyvinylpyrrolidone having a weight-average molecular weight exceeding 200,000, an oxidant, a protective film-forming agent and abrasive grains, the protective film-forming agent containing a first metal compound-forming agent which forms a water-insoluble metal compound, and a second metal compound-forming agent which forms a water-soluble metal compound. The aqueous dispersion is capable of uniformly and stably polishing a metal film at low friction without causing defects in a metal film and an insulating film.
摘要翻译： 用于化学机械抛光的水性分散体含有水，重均分子量超过200,000的聚乙烯吡咯烷酮，氧化剂，保护性成膜剂和磨料颗粒，所述保护性成膜剂含有第一金属化合物形成剂，所述第一金属化合物形成剂 形成水不溶性金属化合物和形成水溶性金属化合物的第二金属化合物形成剂。 水分散体能够以低摩擦力均匀且稳定地抛光金属膜，而不会在金属膜和绝缘膜中产生缺陷。
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公开(公告)号：US07163448B2
公开(公告)日：2007-01-16
申请号：US10833089
申请日：2004-04-28
申请人： Masayuki Hattori , Nobuo Kawahashi
发明人： Masayuki Hattori , Nobuo Kawahashi
IPC分类号： B24B1/00
CPC分类号： H01L21/31053 , H01L21/76229
摘要： A chemical/mechanical polishing method for polishing an object to be polished with an irregular surface, having a substrate with convexities and concavities, a stopper layer formed on the convexities of the substrate, and an embedded insulating layer formed to cover the concavities of the substrate and the stopper layer, wherein the method is characterized comprising a first polishing step of flattening the embedded insulating layer using a slurry (A) which can maintain the polishing speed at 500 Å/min or less and a second polishing step of further polishing the embedded insulating layer to cause the stopper layer on the convexities to be exposed using a slurry (B) which can maintain the polishing speed at 600 Å/min or more. The method is useful for flattening wafers during shallow trench isolation (STI) in manufacturing semiconductor devices.
摘要翻译： 一种用不规则表面抛光待抛光物体的化学/机械抛光方法，具有凸起和凹凸的基底，形成在基底的凸部上的阻挡层和形成为覆盖基底的凹部的嵌入绝缘层 和阻挡层，其特征在于，该方法的特征在于包括使用能够将抛光速度保持在500埃/分钟以下的浆料（A）来平坦化嵌入绝缘层的第一抛光步骤和进一步抛光嵌入的第二抛光步骤 使得能够使抛光速度保持在600 / min以上的浆料（B）使凸部上的阻挡层露出。 该方法在制造半导体器件中的浅沟槽隔离（STI）期间对于平坦化晶片是有用的。
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60.发明申请公开(公告)号：US20060010781A1
公开(公告)日：2006-01-19
申请号：US11180619
申请日：2005-07-14
CPC分类号： H01L21/31053 , C09G1/02
摘要： A chemical mechanical polishing aqueous dispersion comprises abrasives in a concentration of not more than 1.5% by mass, wherein the abrasives comprise ceria and have an average dispersed particle diameter of not less than 1.0 μm. A chemical mechanical polishing method comprises polishing an insulating film by the use of the chemical mechanical polishing aqueous dispersion. By the use of the chemical mechanical polishing aqueous dispersion, occurrence of polishing scratches can be suppressed without lowering a removal rate.
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