公开(公告)号：US20050170612A1

公开(公告)日：2005-08-04

申请号：US11001575

申请日：2004-12-01

申请人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

发明人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

IPC分类号： C09J5/00 ,  C09J133/00 ,  C09J161/06 ,  H01L21/02 ,  H01L21/30 ,  H01L21/301 ,  H01L21/304 ,  H01L21/68 ,  H01L21/683 ,  H01L21/78

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/28

摘要： A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80° C. by using an oven. The thickness of the adhesive layer is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer. Next, a supporting plate is attached to the semiconductor wafer on which the adhesive layer of a desired thickness has been formed.

摘要翻译： 一种用于安装诸如半导体晶片的衬底的方法，其中当衬底变薄时可以防止裂纹或碎裂，包括将粘合剂液体施加到半导体晶片的电路（元件）形成表面上。 粘合剂液体进行预干燥，其流动性降低，并且可以保持其作为粘合剂层的形状。 对于预干燥，通过使用烘箱在80℃的温度下加热5分钟。 基于在半导体晶片的表面上形成的电路的凹凸来确定粘合剂层的厚度。 接下来，将支撑板安装到其上形成有所需厚度的粘合剂层的半导体晶片上。

公开(公告)号：US09299874B2

公开(公告)日：2016-03-29

申请号：US13878964

申请日：2011-10-12

申请人： Hidenori Miyamoto ,  Tadahiko Hirakawa ,  Koichi Misumi

发明人： Hidenori Miyamoto ,  Tadahiko Hirakawa ,  Koichi Misumi

IPC分类号： H01L31/18 ,  H01L21/67 ,  H01L21/677 ,  H01L31/032 ,  B05D1/26

CPC分类号： H01L31/18 ,  B05D1/26 ,  B05D2252/02 ,  B05D2252/04 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/6776 ,  H01L31/0322 ,  Y02E10/541 ,  Y02E10/543 ,  Y02P70/521

摘要： A coating apparatus including a coating part which has a nozzle which ejects a liquid material including an oxidizable metal from a tip portion, and a relative driving unit which moves a substrate and the nozzle in relation to each other so that the tip portion passes through the substrate, such that at least the tip portion of the nozzle provides an affinity control part which is formed so that affinity between the affinity control part and the liquid material is less than that between the liquid materials.

摘要翻译： 一种涂布装置，其具有涂布部，该涂布部具有从顶端部喷射包含可氧化金属的液体材料的喷嘴，以及相对驱动部，其相对于彼此移动基板和喷嘴，使得前端部穿过 使得喷嘴的至少尖端部分提供亲和力控制部分，该亲和控制部分形成为使亲和控制部分和液体材料之间的亲和力小于液体材料之间的亲和力。

公开(公告)号：US09186696B2

公开(公告)日：2015-11-17

申请号：US12874984

申请日：2010-09-02

申请人： Hidenori Miyamoto ,  Kenji Maruyama ,  Tadahiko Hirakawa ,  Koichi Misumi

发明人： Hidenori Miyamoto ,  Kenji Maruyama ,  Tadahiko Hirakawa ,  Koichi Misumi

IPC分类号： B05C11/00 ,  B05C11/10 ,  B05C5/00 ,  C23C16/52 ,  H01L21/67 ,  H01L21/677 ,  H01L31/0216 ,  H01L31/032 ,  H01L31/18 ,  B41J2/045

CPC分类号： B05C11/1015 ,  B05C5/005 ,  B41J2/04566 ,  C23C16/52 ,  H01L21/6715 ,  H01L21/67173 ,  H01L21/6776 ,  H01L31/02167 ,  H01L31/0322 ,  H01L31/18 ,  Y02E10/541 ,  Y02P70/521

摘要： A coating apparatus including a coating part which applies a liquid material including an oxidizable metal on a substrate, a chamber having a coating space in which the coating part applies the liquid material on the substrate and a transport space into which the substrate is transported, and a removal unit which removes the liquid material from the inside of the chamber when at least one of oxygen concentration and humidity inside the chamber exceeds a threshold value.

摘要翻译： 一种涂布装置，包括：涂布部，其将包含可氧化金属的液体材料涂布在基板上;具有涂布空间的室，其中所述涂布部将所述液体材料施加到所述基板上;以及输送空间，所述基板被输送到所述输送空间中;以及 当所述室内的氧浓度和湿度中的至少一个超过阈值时，所述去除单元从所述室的内部除去所述液体材料。

公开(公告)号：US20140072500A1

公开(公告)日：2014-03-13

申请号：US13611499

申请日：2012-09-12

申请人： Masaru Kuwahara ,  Koichi Misumi ,  Hidenori Miyamoto

发明人： Masaru Kuwahara ,  Koichi Misumi ,  Hidenori Miyamoto

IPC分类号： C01B21/092

CPC分类号： C01B21/092 ,  C01B19/002 ,  C01B19/007 ,  C01G3/12 ,  C01G9/08 ,  C01G15/00 ,  C01G15/006 ,  C01G19/00 ,  C01G30/008 ,  H01L31/02168 ,  H01L31/0322 ,  H01L31/0326 ,  H01L31/18 ,  Y02E10/541

摘要： A method of producing a hydrazine-coordinated Cu chalcogenide complex, including: a step (I) in which Cu or Cu2Se and a chalcogen are reacted in dimethylsulfoxide in the presence of hydrazine, a step (II) in which a solution obtained in the step (I) is subjected to concentration and filtration, and a step (III) in which a purifying solvent is added to a solution obtained in the step (II).

摘要翻译： 一种制备肼配位的Cu硫属元素化合物的方法，包括：在肼的存在下，在二甲亚砜中使Cu或Cu 2 Se和硫族元素反应的步骤（I），其中在步骤（II）中获得的溶液 （I）进行浓缩和过滤，以及步骤（III），其中将纯化溶剂加入到步骤（II）中获得的溶液中。

公开(公告)号：US08148457B2

公开(公告)日：2012-04-03

申请号：US12514633

申请日：2007-09-26

申请人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

发明人： Takahiro Asai ,  Koichi Misumi ,  Atsushi Miyanari ,  Yoshihiro Inao ,  Akihiko Nakamura

IPC分类号： C08L31/00

CPC分类号： C09J153/00 ,  C08F212/08 ,  C08F220/06 ,  C08F220/18 ,  C08F290/046 ,  C08F2220/301 ,  C09J7/381 ,  C09J133/10 ,  C09J133/12 ,  C09J135/06 ,  C09J2205/114 ,  C09J2433/00 ,  C09J2453/00 ,  Y10T428/2852 ,  Y10T428/2891

摘要： Disclosed is an adhesive composition whose component is a polymer obtained by copolymerizing a monomer composition containing styrene, a (meth)acrylic acid ester having a cyclic structure, and an alkyl(meth)acrylate having a chain structure. The monomer composition further contains a carboxylic acid having an ethylene double bond, a bifunctional monomer, and a styrene macromonomer. The polymer has a styrene block segment. This can improve heat resistance, adhesive strength in a high temperature environment, alkaline resistance, and easiness in stripping of an adhesive composition that has been subjected to a high temperature process. As a result, there can be obtained an adhesive composition which has high heat resistance, adhesive strength in a high temperature environment, and alkali resistance, and which can be easily stripped off after the adhesive composition is processed at a high temperature.

摘要翻译： 公开了一种粘合剂组合物，其组分是通过共聚包含苯乙烯的单体组合物，具有环状结构的（甲基）丙烯酸酯）和具有链结构的（甲基）丙烯酸烷基酯获得的聚合物。 单体组合物还含有具有乙烯双键的羧酸，双官能单体和苯乙烯大分子单体。 聚合物具有苯乙烯嵌段。 这可以提高耐热性，在高温环境下的粘合强度，耐碱性，以及剥离已经进行高温处理的粘合剂组合物的容易性。 结果，可以获得耐热性高，在高温环境下的粘合强度和耐碱性的粘合剂组合物，并且在粘合剂组合物在高温下加工后可以容易地剥离。

公开(公告)号：US08088448B2

公开(公告)日：2012-01-03

申请号：US12950203

申请日：2010-11-19

申请人： Takahiro Asai ,  Koichi Misumi ,  Hirofumi Imai

发明人： Takahiro Asai ,  Koichi Misumi ,  Hirofumi Imai

IPC分类号： B05D3/02

CPC分类号： C09J133/14 ,  C09J133/12 ,  C09J135/06 ,  Y10T428/2852 ,  Y10T428/2861 ,  Y10T428/2887 ,  Y10T428/2896 ,  C08F212/08 ,  C08F220/14 ,  C08F2222/402

摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

摘要翻译： 本发明的粘合剂组合物含有通过使含有具有马来酰亚胺基团的单体的单体组合物共聚而得到的聚合物，并且还含有热聚合抑制剂。 结果，可以提供一种粘合剂组合物，其能够在粘合剂层经受高温处理之后形成粘合剂层，其优异地溶解。

公开(公告)号：US20110081544A1

公开(公告)日：2011-04-07

申请号：US12960819

申请日：2010-12-06

申请人： Takahiro ASAI ,  Koichi Misumi ,  Hirofumi Imai

发明人： Takahiro ASAI ,  Koichi Misumi ,  Hirofumi Imai

IPC分类号： C09J133/24 ,  B32B27/28 ,  B29C41/00

CPC分类号： C09J133/14 ,  C09J133/12 ,  C09J135/06 ,  Y10T428/2852 ,  Y10T428/2861 ,  Y10T428/2887 ,  Y10T428/2896 ,  C08F212/08 ,  C08F220/14 ,  C08F2222/402

摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

摘要翻译： 本发明的粘合剂组合物含有通过使含有具有马来酰亚胺基团的单体的单体组合物共聚而得到的聚合物，并且还含有热聚合抑制剂。 结果，可以提供一种粘合剂组合物，其可以在粘合剂层经受高温处理之后形成粘合剂层，其优异地溶解。

公开(公告)号：US20090311526A1

公开(公告)日：2009-12-17

申请号：US12457579

申请日：2009-06-16

申请人： Takahiro Asai ,  Koichi Misumi ,  Hirofumi Imai

发明人： Takahiro Asai ,  Koichi Misumi ,  Hirofumi Imai

IPC分类号： C09J7/00 ,  C09J145/00 ,  C09J153/00 ,  C09J133/10 ,  C08J5/00

CPC分类号： C09J133/14 ,  C09J133/12 ,  C09J135/06 ,  Y10T428/2852 ,  Y10T428/2861 ,  Y10T428/2887 ,  Y10T428/2896 ,  C08F212/08 ,  C08F220/14 ,  C08F2222/402

摘要： An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

摘要翻译： 本发明的粘合剂组合物含有通过使含有具有马来酰亚胺基团的单体的单体组合物共聚而得到的聚合物，并且还含有热聚合抑制剂。 结果，可以提供一种粘合剂组合物，其可以在粘合剂层经受高温处理之后形成粘合剂层，其优异地溶解。

公开(公告)号：US07268061B2

公开(公告)日：2007-09-11

申请号：US11001575

申请日：2004-12-01

申请人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

发明人： Atsushi Miyanari ,  Kosuke Doi ,  Ken Miyagi ,  Yoshihiro Inao ,  Koichi Misumi

IPC分类号： H01L21/20

CPC分类号： H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  Y10T428/28

摘要： A method for attaching a substrate such as a semiconductor wafer in which cracking or chipping can be prevented when the substrate is thinned involves applying adhesive liquid onto a circuit (element)-formed surface of a semiconductor wafer. The adhesive liquid undergoes preliminary drying, so that its flowability is reduced and it can keep its shape as an adhesive layer. For the preliminary drying, heating is conducted for 5 minutes at a temperature of 80° C. by using an oven. The thickness of the adhesive layer is determined based on the irregularities of the circuit which has been formed on the surface of the semiconductor wafer. Next, a supporting plate is attached to the semiconductor wafer on which the adhesive layer of a desired thickness has been formed.

摘要翻译： 一种用于安装诸如半导体晶片的衬底的方法，其中当衬底变薄时可以防止裂纹或碎裂，包括将粘合剂液体施加到半导体晶片的电路（元件）形成表面上。 粘合剂液体进行预干燥，其流动性降低，并且可以保持其作为粘合剂层的形状。 对于预干燥，通过使用烘箱在80℃的温度下加热5分钟。 基于在半导体晶片的表面上形成的电路的凹凸来确定粘合剂层的厚度。 接下来，将支撑板安装到其上形成有所需厚度的粘合剂层的半导体晶片上。

公开(公告)号：US07081327B2

公开(公告)日：2006-07-25

申请号：US11025870

申请日：2004-12-29

申请人： Toshiki Okui ,  Koichi Misumi

发明人： Toshiki Okui ,  Koichi Misumi

IPC分类号： G03C1/73 ,  G03C1/76 ,  G03F7/039 ,  G03F7/20 ,  G03F7/30 ,  G03F7/40

CPC分类号： G03F7/0397 ,  Y10S430/111

摘要： A chemically amplified positive photoresist composition for thick film that is used for forming a thick-film photoresist layer with a film thickness of 10 to 150 μm on top of a support, including (A) a compound that generates acid on irradiation with active light or radiation, and (B) a resin that displays increased alkali solubility under the action of acid, wherein the component (B) includes a resin formed from a copolymer containing a structural unit (b1) with a specific structure.

摘要翻译： 一种用于厚膜的化学放大型正性光致抗蚀剂组合物，其用于在载体上形成膜厚度为10至150μm的厚膜光致抗蚀剂层，包括（A）在用活性光照射时产生酸的化合物或 辐射，（B）在酸的作用下显示增加的碱溶性的树脂，其中组分（B）包括由含有具体结构的结构单元（b1）的共聚物形成的树脂。