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51.发明申请Electronic component mounting apparatus and electronic component mounting method 有权电子元件安装装置和电子元件安装方法公开(公告)号：US20050274004A1
公开(公告)日：2005-12-15
申请号：US11134498
申请日：2005-05-23
申请人： Takashi Yoshii , Akihiro Urakawa
发明人： Takashi Yoshii , Akihiro Urakawa
CPC分类号： H05K13/0812 , Y10T29/49131 , Y10T29/49133 , Y10T29/49144 , Y10T29/49165 , Y10T29/53178 , Y10T29/53191
摘要： The invention prevents mismounting of an electronic component caused by missetting of a component feeding unit in an apparatus. A recognition process of an electronic component is performed according to component library data stored in a RAM. According to “normal” data as a check condition in the component library data, a recognition processing device checks whether leads indicated by group numbers “1” and “2” exist or not in the electronic component, on command of a CPU. When all the leads are detected, the CPU commands the recognition processing device to calculate an amount of shifting from a proper position based on an image taken by a component recognition camera, and a position and an angle of the electronic component are calculated. Next, the recognition processing device performs an absence check of leads which must not exist in the electronic component. When even one of the leads which must not exist is detected, the CPU judges the electronic component the “lead detection error in absence check”, so that the CPU makes the electronic component released from a suction nozzle and collected in an exhaust box.
摘要翻译： 本发明可以防止装置内部件供给装置的错位引起的电子部件的错位。 根据存储在RAM中的组件库数据执行电子部件的识别处理。 根据作为部件库数据中的检查条件的“正常”数据，识别处理装置根据CPU的命令检查电子部件中是否存在由组号“1”和“2”指示的引线。 当检测到所有引线时，CPU命令识别处理装置基于由部件识别相机拍摄的图像来计算从适当位置的偏移量，并且计算电子部件的位置和角度。 接下来，识别处理装置执行不存在于电子部件中的引线的不检查。 当检测到不能存在的引线中的一个时，CPU判断电子部件为“不检查的引线检测错误”，使得CPU使电子部件从吸嘴释放并收集在排气箱中。
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52.发明申请Electronic component mounting method and electronic component mounting apparatus 有权电子部件安装方法和电子部件安装装置公开(公告)号：US20050250223A1
公开(公告)日：2005-11-10
申请号：US11113318
申请日：2005-04-25
CPC分类号： H05K13/0413 , H05K13/041 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53091 , Y10T29/53178 , Y10T29/53191
摘要： The invention is directed to increased stabilization of a pickup operation by reducing a reaction against disturbance by reducing a feedback value when a pickup rate is improved. A positional shifting amount of an electronic component on a suction nozzle before the electronic component is mounted on a printed board is stored in a RAM each time the component is picked up at a component feeding unit until a pickup count number reaches a predetermined pickup number, and a CPU calculates an average of the positional shifting amounts. When the pickup count number reaches the predetermined pickup number, the CPU obtains a temporary coefficient by adding an initial value to a value obtained by multiplying a negative coefficient by the pickup count number, and calculates a feedback value by multiplying the temporary coefficient by the average. The calculated feedback value is added to an offset value of a component pickup position to modify the offset value, and uses the offset value in the next pickup operation at the component feeding unit.
摘要翻译： 本发明旨在通过在提高拾取速率时减少反馈值来降低对干扰的反应来增加拾取操作的稳定性。 每当在元件供给单元拾取元件直到拾取数量达到预定的拾取数量时，将RAM上的电子元件安装在印刷电路板上之后的吸嘴上的电子元件的位置移动量存储在RAM中， 并且CPU计算位置偏移量的平均值。 当拾取次数达到预定的拾取次数时，CPU通过将初始值与乘以负系数获得的值乘以拾取计数数来获得临时系数，并且通过将临时系数乘以平均值来计算反馈值 。 计算出的反馈值被添加到组件拾取位置的偏移值以修改偏移值，并且在组件馈送单元的下一个拾取操作中使用偏移值。
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公开(公告)号：US20050224183A1
公开(公告)日：2005-10-13
申请号：US11054601
申请日：2005-02-10
CPC分类号： H05K13/0417 , H05K13/0452
摘要： The invention provides a component feeding device where heat generation of a drive circuit is minimized and a printed board mounted with this drive circuit is miniaturized by forming an inexpensive structure using a single microcomputer and by energizing each of the servomotors only when necessary. In a component feeding unit of a dual lane type, a CPU in a microcomputer controls a start of driving of one of servomotors by energizing the servomotor through a drive circuit based on a component feeding signal for one lane outputted from a CPU of an electronic component mounting apparatus, and the CPU in the microcomputer controls one of the servomotors so that the servomotor is not energized when a component feeding signal for another lane is inputted before a predetermine time passes after a delay timer starts timekeeping when receiving a detection signal about rotation of the servomotor by a predetermined amount from an encoder detecting a rotation amount of the servomotor.
摘要翻译： 本发明提供了一种部件供给装置，其中驱动电路的发热最小化，并且安装有该驱动电路的印刷电路通过使用单个微计算机形成廉价的结构并且仅在必要时激励每个伺服电机而小型化。 在双通道类型的分量供给单元中，微型计算机通过基于从电子部件的CPU输出的一个通道的分量供给信号，通过驱动电路对伺服电机进行通电，来控制伺服电机中的一个的开始驱动 微型计算机中的CPU控制其中一个伺服电动机，使得当在延迟定时器开始计时之后预定的时间过去之前输入另一车道的分量馈送信号时伺服电机不通电，当接收到关于旋转的检测信号 伺服电动机从检测伺服电动机的旋转量的编码器预定量。
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公开(公告)号：US20050166392A1
公开(公告)日：2005-08-04
申请号：US10731431
申请日：2003-12-10
CPC分类号： H05K13/0812 , H05K13/0409 , Y10T29/53087 , Y10T29/53178
摘要： The invention is directed to correcting of a lower end level of a suction nozzle during manufacturing running based on the lower end level of the suction nozzle measured after a mounting operation. An electronic component mounting apparatus for picking electronic components up from component feeding units by suction nozzles and mounting the electronic component on a printed board is provided with a line sensor unit for measuring a lower end level of the suction nozzle after a component mounting operation on a printed board. A CPU calculates a descending amount of the suction nozzle at a pickup station and a mounting station based on a value measured by the line sensor unit, and rotates a stroke motor to move a moving body to a position where the suction nozzle can descend by the amount. Therefore, the electronic component can be picked up and mounted on the printed board properly even if the suction nozzle is worn with time.
摘要翻译： 本发明涉及在制造运行期间根据在安装操作之后测量的吸嘴的下端水平来校正吸嘴的下端水平。 一种用于通过吸嘴从部件供给单元拾取电子部件并将电子部件安装在印刷电路板上的电子部件安装装置设置有线传感器单元，用于在部件安装操作之后测量吸嘴的下端高度 印刷板 CPU根据由线传感器单元测量的值计算拾取站和安装站处的吸嘴的下降量，并使行程电动机旋转，使移动体移动到吸嘴能够下降的位置 量。 因此，即使吸嘴随时间磨损，电子部件也可以适当地拾取并安装在印刷电路板上。
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公开(公告)号：US20050132565A1
公开(公告)日：2005-06-23
申请号：US10974967
申请日：2004-10-28
CPC分类号： H05K13/0452 , H05K13/0406 , Y10T29/53087 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T29/53187 , Y10T29/53191
摘要： The invention is directed to quick adjustment of a positional relationship between two axes when an error occurs in the positional relationship between the axes when a beam is moved by two drive sources. According to movement of the beam for component picking and mounting operations, linear scale signals (outputs relating to positions of one drive axis and another drive axes) from linear scale reading heads are inputted to a Y2 driver and a Y1 driver respectively. Since each of the Y2 driver and the Y1 driver has a calculation means and a control means, when inputted with both the linear scale signals, each of the Y2 driver and the Y1 driver calculates a difference between positions of the drive axes of the beam by the calculation means, and controls a moving member of a linear motor by the control means based on the difference so as to increase thrust of one drive axis in a case where the one drive axis is in a more backward position than another drive axis and reduces the thrust of one drive axis in a case where the one drive axis in a more forward position than another drive axis.
摘要翻译： 本发明涉及当通过两个驱动源移动光束时在轴之间的位置关系发生错误时，快速调整两个轴之间的位置关系。 根据用于部件拾取和安装操作的光束的移动，线性刻度信号（与一个驱动轴和另一个驱动轴的位置相关的输出）从线性刻度读取头分别输入到Y 2驱动器和Y 1驱动器。 由于Y 2驱动器和Y 1驱动器中的每一个具有计算装置和控制装置，当输入了两个线性刻度信号时，Y 2驱动器和Y 1驱动器中的每一个计算驱动轴的位置之间的差异 并且通过控制装置基于该差来控制线性电动机的移动部件，以便在一个驱动轴处于比另一驱动轴更靠后的位置的情况下增加一个驱动轴的推力 在一个驱动轴处于比另一个驱动轴更向前的位置的情况下，减小一个驱动轴的推力。
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公开(公告)号：US20050080508A1
公开(公告)日：2005-04-14
申请号：US10920449
申请日：2004-08-18
申请人： Shigeru Kuribara , Hiroaki Ito , Takuya Imoto
发明人： Shigeru Kuribara , Hiroaki Ito , Takuya Imoto
CPC分类号： H05K13/0069 , H05K13/0061
摘要： This invention provides a board positioning method where a stopper and so on are not required when positioning a printed board in an X direction. Servo motors of a board supplying conveyer portion and a board positioning portion are driven to start carrying of a board. When a first board detection sensor detects the board before timeout of a first timer which starts timekeeping together with the carrying of the board, second and third timers start timekeeping. The servo motor starts decelerating, decelerates to an arbitrary speed, and keeps a constant speed after timeout of the second timer. When a second board detection sensor detects the board before timeout of the third timer, the servo motor is controlled to decelerate and stop the board at an arbitrary position, and a board recognition camera takes an image of a positioning mark of the board stopping at the board positioning portion to recognize a position of the printed board. The CPU controls the servo motors based on a result of the recognition in manufacturing running.
摘要翻译： 本发明提供了一种板定位方法，其中当将打印板定位在X方向上时，不需要止动件等。 驱动供给输送部的板和板定位部的伺服电动机，开始进行板的搬运。 当第一板检测传感器在第一定时器超时之前检测到板，其与板的携带一起开始计时，第二和第三定时器开始计时。 伺服电机开始减速，减速至任意速度，并在第二定时器超时后保持恒定速度。 当第二板检测传感器在第三定时器超时之前检测到板时，伺服电机被控制以使板在任意位置减速停止，并且板识别摄像机拍摄板上的定位标记的图像， 板定位部分以识别印刷板的位置。 CPU根据制造运行中的识别结果控制伺服电机。
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公开(公告)号：US20050005435A1
公开(公告)日：2005-01-13
申请号：US10850440
申请日：2004-05-21
申请人： Tsutomu Yanagida
发明人： Tsutomu Yanagida
CPC分类号： H05K13/0417 , H05K13/0452 , H05K13/08 , Y10T29/49117 , Y10T29/4913 , Y10T29/49131 , Y10T29/49133 , Y10T29/53174 , Y10T29/53178
摘要： The invention provides an electronic component mounting method which improves a work efficiency and enables pickup of electronic components without fail. A component feeding unit mounted with a master tape formed with pickup position indication holes is fixed to an adjusting jig. A recognition camera takes an image of a recognition mark to calculate a center position thereof, moves to a position corresponding to a component pickup position previously stored in a memory portion, and takes an image of the pickup position indication hole provided in the master tape to calculate a component pickup position. Data on a positional relationship between the recognition mark and the pickup position based on a result of this recognition processing are stored in a memory in the component feeding unit. The component feeding units each mounted with a storage tape are fixed to a base of an electronic component mounting apparatus. When an electronic component mounting operation is performed, a board recognition camera takes an image of the recognition mark provided in the component feeding unit to calculate a center position thereof, and the CPU corrects a pickup position of a suction nozzle based on the pickup position data stored in the memory.
摘要翻译： 本发明提供了一种电子部件安装方法，其提高了工作效率，并且能够使电子部件的拾取能够无故障。 安装有形成有拾取位置指示孔的母带的部件供给单元固定到调整夹具。 识别照相机拍摄识别标记的图像以计算其中心位置，移动到与先前存储在存储器部分中的部件拾取位置相对应的位置，并且将设置在母带中的拾取位置指示孔的图像作为 计算组件拾取位置。 基于该识别处理的结果的识别标记和拾取位置之间的位置关系的数据被存储在分量供给单元中的存储器中。 每个安装有存储带的部件供给单元固定到电子部件安装装置的基座。 当执行电子部件安装操作时，电路板识别摄像机拍摄设置在分量供给单元中的识别标记的图像来计算其中心位置，并且CPU基于拾取位置数据来校正吸嘴的拾取位置 存储在内存中。
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公开(公告)号：US20140069564A1
公开(公告)日：2014-03-13
申请号：US13784253
申请日：2013-03-04
发明人： Ryuichi TAKANO , Naoki OKAMOTO
IPC分类号： H01L23/00
CPC分类号： H01L24/74 , H01L24/75 , H01L2224/75317 , Y10T156/10
摘要： The present invention provides a bonding device and a bonding method with a high operation ratio by solving the problems of conventional techniques.In the present invention, a collet holder grasping a used collet is inserted from a first opening portion with the upper face open; the used collet is engaged with first engagement portions provided at the first opening portion of a discarding unit; the used collet is removed from the collet holder to be discarded by lifting the collet holder; the collet holder is inserted from a second opening portion with the upper face open of a supplying unit; the uppermost unused collet among plural stacked unused collets is grasped; and the uppermost unused collet ejected from the first opening portion is attached to the collet holder.
摘要翻译： 本发明通过解决现有技术的问题提供了具有高操作比的接合装置和接合方法。 在本发明中，夹持使用过的夹头的夹头架从上面打开的第一开口部插入， 使用过的夹头与设置在废弃单元的第一开口部的第一接合部接合; 使用过的夹头从夹头夹持器中取出，通过提起夹头固定器而被丢弃; 夹头保持器从供给单元的上表面打开的第二开口部插入; 掌握多个堆叠的未使用的夹头中最上面的未使用夹头; 并且从第一开口部分排出的最上面未使用的夹头附接到夹头保持器。
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公开(公告)号：US08456126B2
公开(公告)日：2013-06-04
申请号：US13044000
申请日：2011-03-09
申请人： Mitsuaki Tate , Yasushi Ishii , Masamichi Kihara
发明人： Mitsuaki Tate , Yasushi Ishii , Masamichi Kihara
IPC分类号： G05B19/416 , G05B19/35
CPC分类号： G05B19/351 , G05B11/26 , G05B2219/41217 , H02P23/20
摘要： There is provided a motor control system and motor control method which can shorten settling time by restraining vibration and deviation relative to an advancing direction during operation. Moreover, according to the present invention, it is possible to cause a motor to be operated with an ideal track and, since it is possible to always monitor a present position, it is made easy to cause a plurality of axes to be synchronously operated. The motor control system is provided with a unit generating command waveforms from a jerk data which has significant effects on the vibration relative to the advancing direction, and a unit performing a real time real position control of regenerating future command waveforms according to a deviation amount, while always performing jerk-limit, whereby the vibration and the deviation relative to the advancing direction when the motor operates at high speed are restrained.
摘要翻译： 提供了一种电动机控制系统和电动机控制方法，其可以通过在运行期间通过抑制振动和相对于前进方向的偏差来缩短建立时间。 此外，根据本发明，可以使电动机以理想轨道进行操作，并且由于可以始终监视当前位置，所以容易使多个轴同步操作。 电动机控制系统设置有从相对于前进方向的振动具有显着影响的加加数据产生指令波形的单元，以及根据偏差量执行再生未来指令波形的实时实际位置控制的单元， 同时总是进行加加速度限制，从而抑制当电动机高速运转时相对于前进方向的振动和偏差。
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公开(公告)号：US20130068826A1
公开(公告)日：2013-03-21
申请号：US13415920
申请日：2012-03-09
CPC分类号： H01L24/27 , H01L24/75 , H01L2224/83191 , H01L2224/83192
摘要： A die bonder includes a die supply stage, which is configured to hold a wafer; a first head having a first collet, which is configured to pick up a die from the wafer and to attach the die, provisionally, on a target to be conducted with mounting thereon, on the attach stage; a second head having a second collet, which is configured to conduct main compression of the die, which is provisionally attached on the attach stage, on the target to be conducted with mounting; and a controller apparatus, wherein the controller apparatus controls the first head to pick up a next die from the die supply stage, during when the second head conducts the main compression on the die onto the target to be conducted with mounting, thereby achieving the die bonder and the die bonding method being stable in quality.
摘要翻译： 芯片接合器包括：晶片供给台，其配置成保持晶片; 第一头具有第一夹头，其被配置为从所述晶片拾取模具并且临时地将所述管芯附着到要安装在其上的待导电的靶上; 具有第二夹头的第二头部，其被构造成在临时安装在附接台上的模具上进行主压缩，以安装在导向件上; 以及控制装置，其特征在于，所述控制装置控制所述第一头从所述模具供给台拾取下一个模具，在所述第二头部将所述模具上的主压缩导向所述待进行导向的所述靶上，从而实现所述模具 粘合剂和芯片焊接方法质量稳定。
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