Electronic device with an upscaling processor and associated methods

    公开(公告)号:US10075702B2

    公开(公告)日:2018-09-11

    申请号:US15204185

    申请日:2016-07-07

    CPC classification number: H04N13/271 G06T3/40 H04N13/139 H04N2013/0081

    Abstract: An electronic device includes a single-photon avalanche diode (SPAD) array and readout circuitry coupled thereto. The readout circuitry generates a depth map having a first resolution, and a signal count map having a second resolution greater than the first resolution. The depth map corresponds to distance observations to an object. The signal count map corresponds to intensity observation sets of the object, with each intensity observation set including intensity observations corresponding to a respective distance observation in the depth map. An upscaling processor is coupled to the readout circuitry to calculate upscaling factors for each intensity observation set so that each distance observation has respective upscaling factors associated therewith. The depth map is then upscaled from the first resolution to the second resolution based on the respective upscaling factors.

    Method for patterning a thin film
    55.
    发明授权

    公开(公告)号:US10014183B2

    公开(公告)日:2018-07-03

    申请号:US15523742

    申请日:2015-11-09

    CPC classification number: H01L21/3086 H01L21/0337 H01L21/31144 H01L27/1203

    Abstract: A method for producing at least one pattern in a layer resting on a substrate, including: a) making amorphous at least one first block of an upper layer of crystalline material resting on a first amorphous supporting layer, while the crystalline structure of a second block of the upper layer that adjoins and is juxtaposed with the first block is preserved; b) partially recrystallizing the first block by using at least one side surface of the second block that is in contact with the first block as an area for the start of a recrystallization front, the partial recrystallization being carried out to preserve a region of amorphous material in the first block; c) selectively etching the amorphous material of the upper layer with respect to the crystalline material of the upper layer to form at least one first pattern in the upper layer.

    Photodetector on silicon-on-insulator

    公开(公告)号:US09997550B2

    公开(公告)日:2018-06-12

    申请号:US14627038

    申请日:2015-02-20

    Inventor: Bruno Rauber

    CPC classification number: H01L27/1446 H01L31/101 H01L31/11

    Abstract: A photodetector is formed in a silicon-on-insulator (SOI) type semiconductor layer. The photodetector includes a first region and a second region of a first conductivity type separated from each other by a central region of a second conductivity type so as to define a phototransistor. A transverse surface of the semiconductor layer is configured to receive an illumination. The transverse surface extends orthogonally to an upper surface of the central region.

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