公开(公告)号：US08574708B2

公开(公告)日：2013-11-05

申请号：US12287859

申请日：2008-10-14

申请人： Douglas S. Cinoman ,  Edward G. Nicholl

发明人： Douglas S. Cinoman ,  Edward G. Nicholl

IPC分类号： B05D3/02 ,  B32B15/092 ,  B32B15/18

CPC分类号： C08G59/182 ,  C09D163/00 ,  Y10T428/24967 ,  Y10T428/31522 ,  Y10T428/31529

摘要： The present invention provides chip-resistant powder topcoats for corrosion resistant powder coated steel substrates, such as, for example, automotive suspension coil springs, comprising powder coatings formed from one or more wax and a resin component of one or more toughened epoxy resin. The present invention provides dual coatings of toughened epoxy powder basecoats and topcoats, which may be foamed and/or fiber reinforced. The powder used to form the chip resistant topcoat can further comprise up to 200 phr or, preferably, up to 75 phr of one or more extender, or 0.5 or more phr of one or more extender, such as barium sulfate, while fully retaining its chip resistant properties. In addition, the powder used to form the chip resistant topcoat can be a low temperature curing powder comprising one or more low temperature curing agent. The invention provides methods for making the dual coatings comprising applying to the substrate a toughened, zinc-loaded, epoxy coating powder, applying to the powder coated substrate a wax containing toughened epoxy topcoat and heating to fuse or cure the coating powders.

公开(公告)号：US20130165600A1

公开(公告)日：2013-06-27

申请号：US13777318

申请日：2013-02-26

申请人： Henkel Corporation

发明人： Chunfu Chen

IPC分类号： C08L63/04

CPC分类号： C08G59/56 ,  C08G59/182 ,  C08G59/50 ,  C08G59/621

摘要： Problem to be solved of the invention is to provide a one component epoxy resin composition having a high curing property, wherein a cured resin thereof exhibits a physical strength equal to that in the case where a latent curing agent is predominantly used. Means for solving the problem is a one component epoxy resin composition comprising (a) 100 parts by weight of liquid epoxy resin; (b) suitable amounts for curing the liquid epoxy resin of a latent curing agent; and (c) not more than 30 parts by weight of liquid phenol resin.

摘要翻译： 本发明要解决的问题是提供具有高固化性的单组分环氧树脂组合物，其中其固化树脂具有与主要使用潜在性固化剂的情况相同的物理强度。 解决问题的手段是单组分环氧树脂组合物，其包含（a）100重量份的液体环氧树脂; （b）用于固化潜伏性固化剂的液体环氧树脂的合适量; 和（c）不超过30重量份的液体酚醛树脂。

公开(公告)号：US20130072597A1

公开(公告)日：2013-03-21

申请号：US13580568

申请日：2011-03-04

申请人： Jim Elmore ,  Pascale Claeys-Bouuaert ,  Françoise Heine

发明人： Jim Elmore ,  Pascale Claeys-Bouuaert ,  Françoise Heine

IPC分类号： C08K5/17

CPC分类号： C08K5/17 ,  C08G59/182 ,  C08G59/184 ,  C08K3/08 ,  C08K3/10 ,  C08K2003/0868 ,  C08L63/00 ,  C09D163/00 ,  C09J163/00

摘要： The invention relates to non aqueous curing agents for water dispersed epoxy resins. The curing agent composition offers a binder pot life of several hours, and in the presence of a metal, such as zinc, nearly no hydrogen generation is observed. The present curing composition can be mixed with a metal powder to provide a storage stable paste. The curing agent composition and/or paste is fully compatible with an epoxy water based resin. After low shear blending, the epoxy curing agent and metal system is storage stable for several hours working pot life that provides for cured coatings having good performance.

摘要翻译： 本发明涉及水分散环氧树脂的非水性固化剂。 固化剂组合物提供几个小时的粘合剂适用期，并且在诸如锌的金属存在下，几乎不观察到产生氢。 本发明的固化组合物可以与金属粉末混合以提供保存稳定的糊剂。 固化剂组合物和/或糊剂与环氧水基树脂完全相容。 在低剪切共混后，环氧固化剂和金属体系在几个小时的使用寿命内保持稳定，为固化涂料提供了良好的性能。

公开(公告)号：US20120308729A1

公开(公告)日：2012-12-06

申请号：US13510987

申请日：2010-11-22

申请人： Thomas Fischer ,  Elfriede Prucher

发明人： Thomas Fischer ,  Elfriede Prucher

IPC分类号： C09D163/00 ,  B05D3/12 ,  B05D3/00

CPC分类号： C09D163/00 ,  C03C17/326 ,  C03C2217/20 ,  C03C2217/78 ,  C03C2218/32 ,  C08G59/1438 ,  C08G59/182 ,  C08L63/00 ,  C08L2201/54 ,  C08L71/02

摘要： The invention relates to an aqueously dispersible epoxy resin E, comprising building blocks derived from an aliphatic polyether polyol A, an epoxy resin B having at least two epoxide groups per molecule, an epoxy resin B′ having at least two epoxide groups per molecule, which may be identical to B, or different from B, an epoxy-functional fatty acid ester D, and an aromatic polyol C, a process for the preparation thereof, and a method of use thereof.

摘要翻译： 本发明涉及一种高分散性环氧树脂E，其包含衍生自脂族聚醚多元醇A的结构单元，每分子具有至少两个环氧基团的环氧树脂B，每分子具有至少两个环氧基团的环氧树脂B'，其中 可以与B相同，或不同于B，环氧官能的脂肪酸酯D和芳族多元醇C，其制备方法及其使用方法。

公开(公告)号：US20120238709A1

公开(公告)日：2012-09-20

申请号：US13512705

申请日：2010-11-10

申请人： Guillaume Metral ,  Johann-Wilhelm Frey ,  Bernd Hoevel ,  Robert E. Hefner, JR. ,  Michael J. Mullins

发明人： Guillaume Metral ,  Johann-Wilhelm Frey ,  Bernd Hoevel ,  Robert E. Hefner, JR. ,  Michael J. Mullins

IPC分类号： C08G59/14 ,  C08G59/02

CPC分类号： C08G59/182 ,  C08G59/4021

摘要： An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates.

摘要翻译： 由二羟基二苯基 - 环烷烃化合物制备的环氧树脂组合物，以形成二羟基二苯基环烷烃化合物的二缩水甘油醚，其可用于制备各种产品，包括例如粉末涂料，复合材料和电层压材料。

公开(公告)号：US08231820B2

公开(公告)日：2012-07-31

申请号：US12808304

申请日：2008-09-16

申请人： Amit Dixit ,  Pradip Kumar Dubey ,  Thitikan Prommaneewat

发明人： Amit Dixit ,  Pradip Kumar Dubey ,  Thitikan Prommaneewat

IPC分类号： C08J5/08 ,  C08L63/02 ,  B32B27/04

CPC分类号： C08L63/00 ,  C08G59/182 ,  C08G59/42 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/02 ,  Y10T428/31511

摘要： A process for making a molded composite comprising the following steps: reacting a reaction mass containing a polyepoxide, in the proportion of about 20% to 50% with respect to the reaction mass, a diol, in the proportion of about 10% to 20% with respect to the reaction mass, a hardener, in the proportion of about 20% to 50% with respect to the reaction mass, in the presence of an accelerator in the proportion of about 0.5 to 10.0% with respect to the reaction mass either alone or in solution with compatible diluents, to obtain an epoxy resin mix having intrinsic viscosity in the range of 100 to 850 cPs, pouring the resin mix in a mold having an in-situ glass fiber scaffold at a mold temperature in the range of 45 to 50 C. and applying pressure to the resin mix in the mold to form a compressed green composition: partially curing the compressed green composition at a temperature in the range of 60 to 80 C. to obtain a partially cured composite; and further curing the partially cured composite at a temperature in the range of 80 to 90 C. to obtain a fully cured composite. The composite is used for structural applications like windmill blades, yachts, domes, ships made from a composite made in accordance with the process as mentioned herein.

摘要翻译： 一种制备模塑复合材料的方法，包括以下步骤：以相对于反应物质为约20％至50％的比例含有聚环氧化物的反应物质以约10％至20％的比例反应， 相对于反应物质，相对于反应物质，在促进剂存在下，相对于单独的反应物质为约0.5〜10.0％的比例，固化剂为约20〜50％ 或在与相容的稀释剂的溶液中，以获得特性粘度在100至850cPs范围内的环氧树脂混合物，将树脂混合物倒入具有原位玻璃纤维支架的模具中，模具温度范围为45至 并向模具中的树脂混合物施加压力以形成压缩的生坯组合物：在60至80℃的温度范围内部分固化压缩的生坯组合物以获得部分固化的复合材料; 并在80至90℃的温度下进一步固化部分固化的复合材料，以获得完全固化的复合材料。 该复合材料用于结构应用，如风车叶片，游艇，穹顶，由根据本文所述方法制成的复合材料制成的船舶。

公开(公告)号：US20120111618A1

公开(公告)日：2012-05-10

申请号：US13161760

申请日：2011-06-16

申请人： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

发明人： Hyung Mi Jung ,  Jae Choon Cho ,  Choon Keun Lee

IPC分类号： H05K1/02 ,  C08L63/04 ,  C08L63/10 ,  C08L63/00

CPC分类号： H05K1/0353 ,  C08G59/08 ,  C08G59/182 ,  C08G59/186 ,  C08G59/304 ,  C08G59/621 ,  H05K1/0326 ,  H05K3/4655 ,  H05K2201/012 ,  Y10T428/12396

摘要： There are provided a flame-retardant resin composition for a multilayer wiring board and a multilayer wiring board having the same. The flame-retardant resin composition for a multilayer wiring board according to an exemplary embodiment of the present invention includes a composite epoxy resin including a naphthalene modified epoxy resin, a cresol novolac epoxy resin, a rubber modified epoxy resin and a phosphorous-based epoxy resin, as well as a flame retardant represented by a specific chemical formula. The flame-retardant resin composition for a multilayer wiring board and the multilayer wiring board having the same disclosed herein exhibits excellent flame retardancy, moisture resistance and peel strength.

摘要翻译： 提供了一种用于多层布线板的阻燃树脂组合物和具有该阻燃树脂组合物的多层布线板。 根据本发明的示例性实施方案的用于多层布线板的阻燃树脂组合物包括包含萘改性环氧树脂，甲酚酚醛环氧树脂，橡胶改性环氧树脂和磷基环氧树脂的复合环氧树脂 ，以及由特定化学式表示的阻燃剂。 用于多层布线板的阻燃树脂组合物和其中所公开的多层布线板具有优异的阻燃性，耐湿性和剥离强度。

公开(公告)号：US20120088862A1

公开(公告)日：2012-04-12

申请号：US12899805

申请日：2010-10-07

申请人： Siamanto Abrami ,  Jin Song ,  Guangliang Tang

发明人： Siamanto Abrami ,  Jin Song ,  Guangliang Tang

IPC分类号： C09D163/00 ,  C09D175/04

CPC分类号： C08G18/585 ,  C08G18/581 ,  C08G59/066 ,  C08G59/182 ,  C08G59/302 ,  C08G59/4028 ,  C09D163/00 ,  C09D175/04

摘要： Diethylene glycol monomethyl ether resistant coatings include a base component including a sulfur-containing, epoxy functional polyol, and an activator component including an isocyanate curing agent.

摘要翻译： 二甘醇单甲醚耐受涂层包括含有硫的环氧官能多元醇的基础组分和包含异氰酸酯固化剂的活化剂组分。

公开(公告)号：US20120077943A1

公开(公告)日：2012-03-29

申请号：US13075403

申请日：2011-03-30

申请人： Atteye Houssein Abdourazak ,  Gamini Ananda Vedage

发明人： Atteye Houssein Abdourazak ,  Gamini Ananda Vedage

IPC分类号： C08L63/00 ,  C08L63/04 ,  C08L63/02 ,  C08L61/06

CPC分类号： C08G59/502 ,  C08G59/182 ,  C08G59/504 ,  C08G59/621 ,  C08G59/623 ,  C08L63/00

摘要： A heat curable epoxy composition comprising the contact product of an epoxy resin, an epoxy curing agent and an accelerator for the epoxy curing agent, the curing agent or the accelerator comprising the reaction product of (a) a phenolic resin (a) of general formula: Where R1, R2, R3, R4 are each independently of one another a hydrogen or unbranched or branched alky group having 1 to 17 carbon atoms, and n is an integer form 0 to 50; and (b) a modified amine compound which is the reaction product of an epoxy resin and a methylated polyalkylenepolyamine having one primary or secondary amine and at least two tertiary amines of the general formula: Where R1, R2, R3, R4 and R5 represent hydrogen, methyl or ethyl; n and m independently are integers from 1 to 10 and; X is an integer from 1 to 10.

摘要翻译： 一种热固性环氧组合物，其包含环氧树脂，环氧固化剂和环氧固化剂促进剂的接触产物，固化剂或促进剂，其包含（a）通式（a）的酚醛树脂（a） 其中，R 1，R 2，R 3，R 4各自独立地为碳原子数为1〜17的氢或无支链或支链烷基，n为0〜50的整数。 和（b）改性胺化合物，其是环氧树脂和具有一个伯胺或仲胺和至少两个以下通式的叔胺的甲基化聚亚烷基多胺的反应产物：其中R 1，R 2，R 3，R 4和R 5表示氢 ，甲基或乙基; n和m独立地为1至10的整数; X为1〜10的整数。

公开(公告)号：US20120064231A1

公开(公告)日：2012-03-15

申请号：US13235060

申请日：2011-09-16

申请人： Jae-Choon Cho ,  Myeong-Ho Hong ,  Hwa-Young Lee ,  Hee-Sun Chun ,  Choon-Keun Lee

发明人： Jae-Choon Cho ,  Myeong-Ho Hong ,  Hwa-Young Lee ,  Hee-Sun Chun ,  Choon-Keun Lee

IPC分类号： H05K3/46

CPC分类号： C09K21/14 ,  C08G59/182 ,  C08K3/00 ,  C08K3/36 ,  C08L63/00 ,  H05K1/0326 ,  H05K1/036 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209

摘要： The present invention relates to a method for manufacturing a printed circuit board including a flame retardant insulation layer. The printed circuit board of the present invention exhibits excellent thermal stability and excellent mechanical strength, is suitable for imprinting lithography process, provides improved reliability by reducing coefficient of thermal expansion, and has excellent adhesion between circuit patterns and an insulation layer.

摘要翻译： 本发明涉及包含阻燃绝缘层的印刷电路板的制造方法。 本发明的印刷电路板显示出优异的热稳定性和优异的机械强度，适用于压印光刻工艺，通过降低热膨胀系数提供改进的可靠性，并且在电路图案和绝缘层之间具有优异的粘附性。