Thermal conductive grease
    58.
    发明申请
    Thermal conductive grease 审中-公开
    导热油脂

    公开(公告)号:US20080004191A1

    公开(公告)日:2008-01-03

    申请号:US11478482

    申请日:2006-06-29

    Inventor: Tsukasa Ishigaki

    Abstract: A thermal conductive grease used for diffusion of heat generated in electronic appliances is provided. The thermal conductive grease comprises: (A) a base oil having a viscosity of 112 to 770 mm2 at 40° C. and comprising a copolymer of an unsaturated dicarboxylic acid dibutyl ester and an α-olefin; and (B) a thermal conductive filler filled in the base oil. The thermal conductive grease does not include conventionally used silicone oil so that insulating substances will not be formed in the thermal conductive grease.

    Abstract translation: 提供了用于在电子设备中产生的热扩散的导热油脂。 导热油脂包括:(A)在40℃下粘度为112至770mm 2的基础油,并且包含不饱和二羧酸二丁酯和α-烯烃的共聚物; 和(B)填充在基础油中的导热填料。 导热油脂不包括常规使用的硅油,从而不会在导热油脂中形成绝缘物质。

Patent Agency Ranking