Abstract:
Circuits are provided for protecting against negative overvoltages of a power supply in an integrated circuit including a power device (P). The protection circuits include a voltage limiting device (T4) interposed between supply and control terminals of the power device, as well as a switching device (T6). The switching device is interposed between a control terminal of the voltage limiting means and ground. The switching means is controlled by the power supply to cause conduction of the voltage limiting means for firing the power device if a positive overvoltage on the supply terminal (CL) of the power device is combined with a negative overvoltage of the power supply (Vb). In some embodiments the switching device and the voltage limiting device are both NPN transistors. In other embodiments the the switching device and the voltage limiting device are both MOS transistors.
Abstract:
The generator comprises a first generator of voltage with thermal drift of zero, a second generator of voltage with given thermal drift, first means for applying a given load to the voltage generated by the first generator, second means for applying a given load to the voltage generated by the second generator, subtracting means for subtracting one from the other the loaded voltages generated by said first and second generator of voltage.
Abstract:
A control circuit for an oscillator comprising a multivibrator with transistors having their emitters connected in common and being supplied corresponding currents on respective legs, comprises a circuit structure adapted to produce on output terminals, on the one side, a current which is proportional to a reference current according to a predetermined parameter, and on the other side, a second current in turn correlated to the reference current as a function of said parameter, thereby to modify the oscillator duty cycle for a given operating frequency.
Abstract:
An output stage with a protection circuit against negative overvoltage at its output terminal, having a transistor with collector output and with the emitter connected to a reference voltage line; a diode for protection against negative overvoltages present on the output is arranged between the collector and the output of the stage. In order to give the output of the stage a presettable minimum voltage level, the reference voltage line is set to a preset voltage which differs from the ground voltage. For this purpose, the circuit comprises an operational amplifier in a voltage-follower configuration, the output whereof is connected to the reference voltage line, a diode which is connected between the ground and the non-inverting terminal of the operational amplifier, and a current source which is connected between the non-inverting input of the operational amplifier and a negative supply line.
Abstract:
A microprocessor reset device comprising a first comparator which, when the input signal of the device falls below a first threshold, closes a switch controlling discharging of a condenser. A second comparator connected to the condenser enables the reset signal when its input signal, correlated with the voltage of the condenser, falls below a seond threshold. For enabling of the reset signal to be dependent on both the duration of the reduction in the input signal below the first threshold, as measured by the voltage present at the terminals of the condenser, as well as on the amount of reduction, the input signal of the second comparator consists of a linear combination of the input signal and the voltage of the condenser, effected by an adding element.
Abstract:
A data output stage of the buffer type for CMOS logic circuits, being of the type having at least one pair of MOS transistors associated to drive an output node of said stage, comprises first and second feedback loops which are structurally independent and respectively connected between said node and a corresponding gate electrode of each transistor to precharge said output node at a predetermined value and reduce the noise to ground during the switching phase.
Abstract:
A process for manufacturing devices with improved connections between the pins and the semiconductor material chip which integrates electronic components. In order to allow the integration of signal components and power components in a same device with a reduced use of area for the soldering pads and with high reliability of the connections, the connecting wires are made of different materials. Advantageously, the wires for the power connections are based on aluminum and have large diameters, and the wires for the signal connections are gold-based and have a small diameter. In order to ensure good soldering, the ends of the pins on which the connecting wires are to be soldered are gold-plated.
Abstract:
The matrix of EPROM memory cells comprises on a semiconductor substrate lines of source and drain parallel and alternated one to another, floating gate areas interposed in a checkerboard pattern between said source and drain lines and control gate lines parallel to one another and perpendicular to said source and drain lines in a superimposed condition with intermediate dielectric and aligned with respect to said floating gate areas. Field oxide areas are provided for, formed on the substrate between one and the other of said control gate lines and side fins of the floating gate areas and of the control gate lines superimposed over said field oxide areas.
Abstract:
A method for the quantitative assessment of the degree of geometrical deformation undergone by a surface profile of a wafer following the formation of a conformal surface layer employs a simple mechanical profilometer, whose stylus is run over a target morphological detail comprising at least two mutually parallel ridges or reliefs which rise above the plane of the surface of the wafer for a height of between 0.1 and 0.5 .mu.m, and which enclose between them a depression of a width of between 2 and 4 .mu.m, in order to determine the elevation of the bottom of the valley between the two ridges relative to the plane of the surface of the wafer from which the ridges rise following the formation of one or more similar surface layers. The vertical measurement of the elevation undergone by the bottom of the valley in itself represents a quantitative index of the vertical and horizontal geometrical deformation undergone by the details of the surface profile of the wafer. In order to determine characteristics of automatic alignability by a particular apparatus employing said target details for automatic alignment, it is possible to establish a maximum value for said distortion index, determined as above, above which the automatic alignment capability is lost.
Abstract:
A circuit for detecting the current in an MOS type power transistor comprises a detection transistor (T2) connected with its drain and gate in common to the power transistor (T1) and having characteristics such that the current flowing through it is equal to a fraction of the current (I1) flowing through the power transistor (T1). Downstream from the detection transistor (T2) is a comparison transistor (T6, T13) for comparing a first current (I3), which is equal to a fraction of the current flowing through the detection transistor, with a second or reference current (Ig1) having a pre-set value. The comparison transistor (T6, T13) produces a detection signal of the value of the current in the power transistor (I1) in relation to the difference between the first current (I3) and the reference current (Ig1).