摘要:
A memory system according to an embodiment of the present invention comprises: a log overflow control unit that, when a third condition in which a second log accumulated in a log storage area exceeds a set value is satisfied, stops a recording operation of the second log in the log storage area by a log recording unit and causes a log recording unit to perform an update operation of a second management table in a master table and a recording operation of a first log in the log storage area, and that, when a first condition is satisfied next time, prohibits a commit operation by a log reflecting unit and causes a snapshot storing unit to perform a snapshot storing operation.
摘要:
In a field effect transistor, a Group III nitride semiconductor layer structure containing a hetero junction, a source electrode 101 and a drain electrode 103 formed apart from each other over the Group III nitride semiconductor layer structure, and a gate electrode 102 disposed between these electrodes, are provided. Over the surface of the Group III nitride semiconductor layer structure, a SiO2 film 122 containing oxygen as a constitutive element is provided, in contact with both side faces of the gate electrode 102. Over the surface of the Group III nitride semiconductor layer structure, a SiN film 121 is provided so as to cover the region between the SiO2 film 122 and the source electrode 101, and the region between the SiO2 film 122 and the drain electrode 103. The SiN film 121 is composed of a material different from that composing the SiO2 film 122, and contains nitrogen as a constitutive element.
摘要:
A semiconductor device, comprising: a semiconductor element 20 having a rectangular two-dimensional geometry and serving as a heat source; and a heat sink section 25 having the semiconductor element 20 mounted thereon, wherein a relation among the directional components of said thermal conductivity is: Kzz≧Kyy>Kxx, where directional components of three-dimensional thermal conductivity of the heat sink section 25 in X, Y and Z directions are determined as Kxx, Kyy and Kzz, and where the longer side direction of the semiconductor element 20 is defined as X direction, the shorter side direction thereof is defined as Y direction and the thickness direction is defined as Z direction.
摘要:
There is provided a technology for obtaining an electrode having a low contact resistance and less surface roughness. There is provided an electrode comprising a semiconductor film 101, and a first metal layer 102 and a second metal layer 103 sequentially stacked in this order on the semiconductor film 101, characterized in that the first metal film 102 is formed of Al, and the second metal film 103 is formed of at least one metal selected from the group consisting of Nb, W, Fe, Hf, Re, Ta and Zr.
摘要:
In a group III nitride-type field effect transistor, the present invention reduces a leak current component by conduction of residual carriers in a buffer layer, and achieves improvement in a break-down voltage, and enhances a carrier confinement effect (carrier confinement) of a channel to improve pinch-off characteristics (to suppress a short channel effect). For example, when applying the present invention to a GaN-type field effect transistor, besides GaN of a channel layer, a composition-modulated (composition-gradient) AlGaN layer in which aluminum composition reduces toward a top gradually or stepwise is used as a buffer layer (hetero buffer). To gate length Lg of a FET to be prepared, a sum a of layer thicknesses of an electron supply layer and a channel layer is selected so as to fulfill Lg/a≧5, and in such a case, the layer thickness of the channel layer is selected in a range of not exceeding 5 times (about 500 Å) as long as a de Broglie wavelength of two-dimensional electron gas accumulated in the channel layer in room temperature.
摘要翻译:在III族氮化物型场效应晶体管中,本发明通过缓冲层中的残留载流子的传导来减少漏电流成分,并且可以实现击穿电压的提高,并提高载流子限制效应(载流子限制) 提高夹断特性的通道(抑制短路效应)。 例如,当将本发明应用于GaN型场效应晶体管时,除了沟道层的GaN之外,使用其中铝组成逐渐或逐步朝向顶部的组分调制(组成梯度)AlGaN层用作 缓冲层(杂质缓冲液)。 对于要制备的FET的栅极长度Lg,选择电子供给层和沟道层的层厚度的和a以满足Lg / a> = 5,并且在这种情况下, 在不超过5倍(约500)的范围内选择通道层,只要在室温下积聚在通道层中的二维电子气的德布罗意波长即可。
摘要:
There is provided a technology for obtaining an electrode having a low contact resistance and less surface roughness. There is provided an electrode comprising a semiconductor film 101, and a first metal layer 102 and a second metal layer 103 sequentially stacked in this order on the semiconductor film 101, characterized in that the first metal film 102 is formed of Al, and the second metal film 103 is formed of at least one metal selected from the group consisting of Nb, W, Fe, Hf, Re, Ta and Zr.
摘要:
The present invention provides a Schottky electrode for a nitride semiconductor device having a high barrier height, a low leak current performance and a low resistance and being thermally stable, and a process for production thereof. The Schottky electrode for a nitride semiconductor has a layered structure that comprises a copper (Cu) layer being in contact with the nitride semiconductor and a first electrode material layer formed on the copper (Cu) layer as an upper layer. As the first electrode material, a metal material which has a thermal expansion coefficient smaller than the thermal expansion coefficient of copper (Cu) and starts to undergo a solid phase reaction with copper (Cu) at a temperature of 400° C. or higher is employed.
摘要:
There is provided a technology for obtaining an electrode having a low contact resistance and less surface roughness. There is provided an electrode comprising a semiconductor film 101, and a first metal layer 102 and a second metal layer 103 sequentially stacked in this order on the semiconductor film 101, characterized in that the first metal film 102 is formed of Al, and the second metal film 103 is formed of at least one metal selected from the group consisting of Nb, W, Fe, Hf, Re, Ta and Zr.
摘要:
A hetero-junction FET has an intermediate layer including n-type-impurity doped layer between an electron supply layer and an n-type cap layer. The intermediate layer cancels the polarized negative charge generated between the electron supply layer and the n-type cap layer by ionized positive charge, thereby reducing the barrier against the electrons and source/drain resistance.
摘要:
Referred to is a flag pattern in an interrupt activation condition flag storing unit which stores an event as an interrupt activation condition flag. As a result thereof, it is determined whether or no the flag pattern exists in an operational key description storing unit which stores the position for the operation corresponding to the flag pattern n the interrupt activation condition flag storing unit. As a result of the determination, an interrupt process is performed in accordance with an operational description storing unit which stores a process corresponding to the flag pattern if the pattern exits. Thereafter, bit for the flag corresponding to the executed process is cleared out.