Abstract:
The invention is directed to a self-correcting modular-redundancy-memory device, comprising three bistable-memory elements and a majority voter. The bistable-memory elements receive respective binary data signal, clock signal, and a feedback signal. Each of the bistable-memory elements is configured, in response to the clock signal assuming a first value, to provide a binary output signal with an output-signal value correlated to a data-signal value of the data signal, and in response to the clock signal assuming a second clock-signal value, to provide the output signal with the output-signal value indicative of a current feedback-signal value of the feedback signal. The majority voter receives the output signals each of the bistable-memory elements and is configured to provide the feedback signal with the feedback-signal value indicative of that output-signal value taken on by a majority of the currently received output signals.
Abstract:
The present invention relates to a slot waveguide formed by a vertical material stack comprising a top layer with a first refractive index, a center layer including a ferroelectric material and with a second refractive index, and a Si1-xGex pseudosubstrate layer with 0
Abstract:
The present invention relates to a phased array antenna (10) with an electronically variable antenna pattern, wherein control signals for at least two phased antenna elements (13) are processed for a broadcast transmission and are broadcast to the phased antenna elements (13) via a wireless medium or using feed lines for useful signal components of the phased antenna elements in a frequency band differing from the frequency band of the useful signal components. As a result of using the broadcast transmission in a different frequency band, there is no need for any additional signals or lines for the array antenna, and the complexity of the array antenna can be reduced and the flexibility and reconfigurability can be improved.
Abstract:
The invention relates to an electrooptical device comprising a semiconductor substrate having a front side and a back side, at least one photonic component arranged on the front side of the semiconductor substrate, the photonic component comprising an active layer made of a non-linear optical material, wherein at least one cavity, extends through the semiconductor substrate and connects the active layer on the front side of the semiconductor substrate with the back side of the semiconductor substrate.
Abstract:
A semiconductor light emitter device, comprising a substrate, an active layer made of Germanium, which is configured to emit light under application of an operating voltage to the semiconductor light emitter device, wherein a gap is arranged on the substrate, which extends between two bridgeposts laterally spaced from each other, the active layer is arranged on the bridgeposts and bridges the gap, and wherein the semiconductor light emitter device comprises a stressor layer, which induces a tensile strain in the active layer above the gap.
Abstract:
A method of determining a position of at least one transceiver node comprises, anchor node by anchor node, transmitting respective positioning frames suitable for reception by a transceiver node and by the other anchor nodes. The transceiver node receives the positioning frames transmitted by the anchor nodes and ascertains respective times of reception for each. A solver stage determines the coordinates (xs, ys, zs) of the respective transceiver node and the time ts of transmission of the first positioning frame by an anchor node of first rank in the positioning sequence by numerically solving a non-linear system of at least five equations.
Abstract:
A method for producing a nanotip from a tip material provides a substrate which consists of the tip material or has the material in the form of a coating, produces a mask from a mask material selected so that, in a predefined reactive ion etching process, the mask material is removed at a lower etching rate than the tip material, and carries out the reactive ion etching process in an etching chamber. The mask material is additionally selected so that a gaseous component is released therefrom during the reactive ion etching process, the gaseous component not being released from the tip material. The method further comprises detecting the gaseous component while the ion etching process is being carried out, repeatedly determining whether an amount of the gaseous component in the etching chamber reaches a predefined lower threshold, and stopping the reactive ion etching process when the lower threshold is reached.
Abstract:
A device for multiplying two bit sequences has a controller that selects and activates exactly one multiplier unit from a plurality of parallel multiplier units, according to a random signal. A partial multiplier unit shared by all the multiplier units receives and multiplies operands formed by the respectively activated multiplier unit. Each multiplier unit implements a different multiplication method with a respective selector unit that selects segments of the bit sequences to be multiplied, in accordance with a selection plan adapted to the respective multiplication method, to form operands from one or more segments and outputs the operands. The respective accumulation unit receives step by step partial products from the partial multiplier unit, accumulates the partial products in accordance with an accumulation plan adapted to the implemented multiplication method and matching the selection plan, and outputs the calculated product of after accumulation has been completed.
Abstract:
A method of producing a semiconductor device, comprising a substrate layer made of a semiconductor material of a first conductivity type and having a first insulation region, and a vertical bipolar transistor having a first vertical portion of a collector made of monocrystalline semiconductor material of a second conductivity type and disposed in an opening of the first insulation region, a second insulation region lying partly on the first vertical portion of the collector and partly on the first insulation region and having an opening in the region of the collector, in which opening a second vertical portion of the collector made of monocrystalline material is disposed, the portion including an inner region of the second conductivity type, a base made of monocrystalline semiconductor material of the first conductivity type, a base connection region surrounding the base in the lateral direction, a T-shaped emitter made of semiconductor material of the second conductivity type and overlapping the base connection region, wherein the base connection region, aside from a seeding layer adjacent the substrate or a metallization layer adjacent a base contact, consists of a semiconductor material which differs in its chemical composition from the semiconductor material of the collector, the base and the emitter and in which the majority charge carriers of the first conductivity type have greater mobility compared thereto.
Abstract:
A chip antenna comprising at least one emitter which extends parallel to a main surface of a semiconductor substrate supporting the chip antenna, wherein the emitter is arranged on an island-like support zone of the semiconductor substrate, the support zone being surrounded by at least one trench which is completely filled with a gas, the trench passing through the entire depth of the semiconductor substrate and being bridged by at least one retaining web which forms a supporting connection between the support zone and the rest of the semiconductor substrate.