Abstract:
An electronic device, such as a sensor die, is packaged by first forming a hole through a substrate. The hole is made large enough to position the entire electronic device within the hole. A tape is then applied to the second surface of the substrate to cover a second side of the hole, thereby creating a tape surface at the bottom of the hole. The electronic device is then positioned within the hole such that the electronic device is in contact with, and adhered to, the tape surface at the bottom of the hole. Electronic connections are made between the electronic device and the substrate and a layer of encapsulant is applied. In one embodiment, the electronic device is a sensor die and an optical element is positioned over an active region of the sensor die before the encapsulant is applied. The encapsulant then surrounds and holds the optical element in position over the active region of the sensor die.
Abstract:
Image sensor packages are fabricated simultaneously to minimize the cost associated with each individual image sensor package. To fabricate the image sensor packages, windows are molded in molding compound to form a molded window array. A substrate includes a plurality of individual substrates integrally connected together in an array format. Image sensors are attached and electrically connected to corresponding individual substrates. An adhesive layer attaches the molded window array to the substrate. The substrate and attached molded window array are singulated into a plurality of individual image sensor packages.
Abstract:
An improved safety control mechanism for a pulley apparatus of the type comprising main support bars having at least two wheels mounted at their centers a spaced distance apart between the bars and a swing arm assembly pivotally connected to the bars at a point between the centers of the wheels, the swing arm assembly comprising a pair of arms straddling opposing surfaces of the bars and pivotally connected to the bars by a main pivot mechanism extending through complementary aligned apertures in the arms and the bars, the improvement comprising a second bolt mechanism extending through a second complementary aperture disposed in either the bars or the arms and a slot disposed in the other of the bars or the arms; the second aperture or the slot provided in the bars being disposed in the second distance between the center mountings of the wheels; the second aperture or the slot provided in the arms being aligned with the other of the second aperture or the slot provided in the bars with the arms and the bars connected by the main pivot bolt; the slot having an arcuate engagement surface which follows the pivot of the arms and engages the second bolt mechanism against detachment of the arms upon failure of the main pivot bolt; the second aperture and the slot being disposed around the complementary aligned apertures through which the main pivot bolt extends.
Abstract:
A camera module has an image sensor and a lens assembly that includes a lens barrel having a first cylindrical portion that includes an externally threaded portion and a second cylindrical portion that has a larger diameter than the externally threaded portion. A lens moving mechanism includes a movable sleeve having internal threads that receive the externally threaded portion of the lens assembly. The lens moving mechanism is coupled to the image sensor such that the second cylindrical portion of the lens assembly is closest to the image sensor. The camera module is assembled by inserting the lens assembly into the lens moving mechanism from the side closest to the image sensor. An installation tool may engage the second cylindrical portion to rotate the lens assembly and engage the threaded portions. Features may be provided to retain the lens assembly in the lens moving mechanism before joining the threaded portions.
Abstract:
A digital camera component is described that has a light splitter cube having an entrance face to receive incident light from a camera scene. The cube splits the incident light into first, second, and third color components that emerge from the cube through a first face, a second face, and a third face of the cube, respectively. First, second, and third image sensors are provided, each being positioned to receive a respective one of the color components that emerge from the first, second, and third faces of the cube. Other embodiments are also described and claimed.
Abstract:
A method is disclosed for instructing a user interface (UI) in communication with a first of vision processor (VP) to establish communication with a second (VP). The invention is useful in a machine vision system having a plurality of VPs and at least one UI. The method includes the steps of providing each VP with a link function for establishing communication between a VP and a UI; and activating the link function so as to issue instructions to the UI to establish communication with another VP. The link function enables local dynamic display of a remote VP on the UI, and a dynamic connection that provides a continually updated display representing a current state of the VP connected to the UI. An operator may observe results and alter parameters on any of the VPs in the system without having to first understand the architecture of the machine vision system.
Abstract:
A method is disclosed for instructing a user interface (UI) in communication with a first of vision processor (VP) to establish communication with a second (VP). The invention is useful in a machine vision system having a plurality of VPs and at least one UI. The method includes the steps of providing each VP with a link function for establishing communication between a VP and a UI; and activating the link function so as to issue instructions to the UI to establish communication with another VP. The link function enables local dynamic display of a remote VP on the UI, and a dynamic connection that provides a continually updated display representing a current state of the VP connected to the UI. An operator may observe results and alter parameters on any of the VPs in the system without having to first understand the architecture of the machine vision system.
Abstract:
An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.
Abstract:
A digital camera module (100) includes a lens module (20) and a chip package (50) mounted in a light path of the lens module. The lens module includes a first lens assembly (21) and a second lens assembly (23). The first lens assembly includes a first fixture (211) having a through hole (212) defined therein and at least one lens (218) received in the through hole. The second assembly includes a second fixture (23) having a through hole (232) defined therein and at least one lens (238) attached therein. One of the first fixture and the second fixture has a slotted annular ring (213) protruding therefrom with an annular slot (214) defined therein. The other has a male annular ring (235) extending therefrom, and the slotted annular ring and the male annular ring matingly engage with each other to fix the first lens assembly and second assembly together.
Abstract:
A combination includes a first chip package unit and a second chip package unit on which the first chip package unit is placed. Each of the first and second chip package units includes a substrate having a first surface, a second surface, a chip package electrically connected to the first surface, and a plurality of bonding pads formed on the first and second surfaces. The bonding pads on the first surface of the first chip package unit are respectively electrically connected with the bonding pads on the surface of the second chip package unit. The chip packages electrically connected to the first surfaces are enclosed by the substrates, and the bonding pads on the second surfaces are configured as interface terminals of the combination.