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公开(公告)号：US11942144B2
公开(公告)日：2024-03-26
申请号：US17582675
申请日：2022-01-24
发明人： Marco Pasotti , Marcella Carissimi , Antonio Gnudi , Eleonora Franchi Scarselli , Alessio Antolini , Andrea Lico
IPC分类号： G11C11/4096 , G06F7/544 , G11C11/4074 , G11C11/4076 , G11C11/408 , G11C11/4094
CPC分类号： G11C11/4096 , G06F7/5443 , G11C11/4074 , G11C11/4076 , G11C11/4085 , G11C11/4094
摘要： A circuit includes a memory array with memory cells arranged in a matrix of rows and columns, where each row includes a word line connected to the memory cells of the row, and each column includes a bit line connected to the memory cells of the column. Computational weights for an in-memory compute operation (IMCO) are stored in the memory cells. A word line control circuit simultaneously actuates word lines in response to input signals providing coefficient data for the IMCO by applying word line signal pulses. A column processing circuit connected to the bit lines processes analog signals developed on the bit lines in response to the simultaneous actuation of the word lines to generate multiply and accumulate output signals for the IMCO. Pulse widths of the signal pulses are modulated to compensate for cell drift. The IMCO further handles positive/negative calculation for the coefficient data and computational weights.
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公开(公告)号：US11941961B2
公开(公告)日：2024-03-26
申请号：US17823709
申请日：2022-08-31
摘要： In accordance with an embodiment, a detection device includes: an infrared temperature sensor configured to provide a temperature signal associated with an heat emission of at least one individual within a monitored area; an electrostatic-charge-variation sensor configured to provide a charge-variation signal indicative of a variation of electrostatic charge associated with the at least one individual; and a processing unit, coupled to the infrared temperature sensor and to the electrostatic-charge-variation sensor, the processing unit configured to detect a presence of the at least one individual within the monitored area by receiving the temperature signal and the charge-variation signal, and jointly processing the temperature signal and charge.
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公开(公告)号：US20240085960A1
公开(公告)日：2024-03-14
申请号：US18516453
申请日：2023-11-21
IPC分类号： G06F1/16 , G01B7/31 , G06F1/3231 , G06F1/3246
CPC分类号： G06F1/1677 , G01B7/31 , G06F1/1616 , G06F1/3231 , G06F1/3246 , G01C1/00
摘要： The present disclosure is directed to a device and method for lid angle detection that is accurate even if the device is activated in an upright position. While the device is in a sleep state, first and second sensor units measure acceleration and angular velocity, and calculate orientations of respective lid components based on the acceleration and angular velocity measurements. Upon the device exiting the sleep state, a processor estimates the lid angle using the calculated orientations, sets the estimated lid angle as an initial lid angle, and updates the initial lid angle using, for example, two accelerometers; two accelerometers and two gyroscopes; two accelerometers and two magnetometers; or two accelerometers, two gyroscopes, and two magnetometers.
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公开(公告)号：US11929674B2
公开(公告)日：2024-03-12
申请号：US17732281
申请日：2022-04-28
发明人： Francesco Pulvirenti
IPC分类号： H02M3/07
CPC分类号： H02M3/07
摘要： In an embodiment, a voltage multiplier comprises an input node, an output node, and first and second control nodes for receiving first and second clock signals defining two commutation states. An ordered sequence of intermediate nodes is coupled between the input and output nodes and includes two ordered sub-sequences. Capacitors are coupled: between each odd intermediate node in the first sub-sequence and the first control node; between each even intermediate node in the first sub-sequence and the second control node; between each odd intermediate node in the second sub-sequence and a corresponding odd intermediate node in the first sub-sequence; and between each even intermediate node in the second sub-sequence and a corresponding even intermediate node in the first sub-sequence. The circuit comprises selectively conductive electronic components coupled to the intermediate nodes.
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65.发明公开公开(公告)号：US20240079237A1
公开(公告)日：2024-03-07
申请号：US18363349
申请日：2023-08-01
CPC分类号： H01L21/0485 , H01L29/401 , H01L29/66068
摘要： Method of manufacturing an electronic device, comprising forming an ohmic contact at an implanted region of a semiconductor body. Forming the ohmic contact provides for performing a high-temperature thermal process for allowing a reaction between a metal material and the material of the semiconductor body, for forming a silicide of the metal material. The step of forming the ohmic contact is performed prior to a step of forming one or more electrical structures which include materials that may be damaged by the high temperature of the thermal process of forming the silicide.
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公开(公告)号：US20240072922A1
公开(公告)日：2024-02-29
申请号：US17898335
申请日：2022-08-29
IPC分类号： H04J3/06
CPC分类号： H04J3/0685 , H04J3/0617
摘要： An integrated circuit includes a control circuit, a primary sensor device coupled to the control circuit, and a plurality of groups of secondary sensor devices coupled to the primary sensor device. The primary sensor device receives a master clock signal from the control device and outputs, to each group of secondary sensor devices, a respective secondary clock signal with a frequency lower than the primary clock signal. The primary sensor device generates primary sensor data. The primary sensor device receives secondary sensor data from each group of secondary sensor devices. The primary sensor device combines the primary sensor data and all of the secondary sensor data into a sensor data stream with a time division-multiplexing scheme and outputs the sensor data stream to the control circuit.
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公开(公告)号：US11909849B2
公开(公告)日：2024-02-20
申请号：US16556593
申请日：2019-08-30
发明人： Lorenzo Guerrieri , Angelo Poloni , Edoardo Lauri
CPC分类号： H04L69/18 , H04L27/0012 , H04L27/12 , H04L27/2643 , H04L27/2666 , H04B2203/5408
摘要： A communication circuit supports a first communication protocol and a second communication protocol that is different from the first communication protocol. A number of signals include first signals conveying first information messages and second signals conveying second information messages. The first information messages include a repetitive message having fixed repeated content and the second information messages include a non-repetitive message having variable content. The first signals and the second signals are transmitted via the communication circuit using the first communication protocol for the first signals and the second communication protocol for the second signals.
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公开(公告)号：US11901250B2
公开(公告)日：2024-02-13
申请号：US17411585
申请日：2021-08-25
发明人： Pierangelo Magni , Michele Derai
IPC分类号： H01L23/495 , H01L23/31 , H01L21/56 , H01L23/18 , H01L23/498
CPC分类号： H01L23/3107 , H01L21/561 , H01L23/18 , H01L23/49838
摘要： A semiconductor chip or die is mounted at a position on a support substrate. A light-permeable laser direct structuring (LDS) material is then molded onto the semiconductor chip positioned on the support substrate. The semiconductor chip is visible through the LDS material. Laser beam energy is directed to selected spatial locations of the LDS material to structure in the LDS material a pat gstern of structured formations corresponding to the locations of conductive lines and vias for making electrical connection to the semiconductor chip. The spatial locations of the LDS material to which laser beam energy is directed are selected as a function of the position the semiconductor chip which is visible through the LDS material, thus countering undesired effects of positioning offset of the chip on the substrate.
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公开(公告)号：US11898943B2
公开(公告)日：2024-02-13
申请号：US17562829
申请日：2021-12-27
CPC分类号： G01M5/0041 , G01L1/18 , G01L5/162
摘要： A stress sensor includes: a substrate, having a face and a recess, open to the face; and a sensor chip of semiconductor material, housed in the recess and bonded to the substrate, the sensor chip being provided with a plurality of sensing components of piezoresistive material. The substrate has a thickness which is less by at least one order of magnitude with respect to a main dimension of the face. Further, the sensor chip has a thickness which is less by at least one order of magnitude with respect to the thickness of the substrate, and a Young's module of the substrate and a Young's module of the sensor chip are of the same order of magnitude.
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公开(公告)号：US20240043265A1
公开(公告)日：2024-02-08
申请号：US18359754
申请日：2023-07-26
CPC分类号： B81B7/0022 , B81C1/00269 , B81B2201/0228 , B81B2203/0315 , B81B2207/053 , B81C2203/0154 , B81C2203/0109 , B81C2203/038
摘要： Electronic device including: a MEMS sensor device including a functional structure which transduces a chemical or physical quantity into a corresponding electrical quantity; a cap including a semiconductive substrate; and a bonding dielectric region, which mechanically couples the cap to the MEMS sensor device. The cap further includes a conductive region, which extends between the semiconductive substrate and the MEMS sensor device and includes: a first portion, which is arranged laterally with respect to the semiconductive substrate and is exposed, so as to be electrically coupleable to a terminal at a reference potential by a corresponding wire bonding; and a second portion, which contacts the semiconductive substrate.
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