公开(公告)号：US07338823B2

公开(公告)日：2008-03-04

申请号：US11444397

申请日：2006-06-01

Applicant: Kyung Taeg Han ,  Hun Joo Hahm ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Seong Yeon Han ,  Young Sam Park ,  Seon Goo Lee

Inventor： Kyung Taeg Han ,  Hun Joo Hahm ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Seong Yeon Han ,  Young Sam Park ,  Seon Goo Lee

IPC: H01L21/00 ,  H01L21/48

CPC classification number: H01L33/60 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention relates to a side-emitting LED package and a manufacturing method of the same. The invention provides a side-emitting LED package for emitting light from a light source sideward including a substrate with an electrode formed thereon. The package also includes a light source disposed on the substrate, a molded part that covers and protects the substrate with the light source thereon, and a reflective layer that covers an outer surface of the molded part. The molded part with the reflective layer forms a light transmitting surface in one side thereof. The invention allows easy manufacture of a reflecting surface in a desired shape, miniaturization regardless of the LED chip size, mass-production in an LED array, significantly improving productivity.

Abstract translation: 本发明涉及一种侧面发光LED封装及其制造方法。 本发明提供一种用于从侧向发光的侧光发射LED封装件，其包括形成有电极的基板。 封装还包括设置在基板上的光源，覆盖并保护其上具有光源的基板的模制部件和覆盖模制部件的外表面的反射层。 具有反射层的模制部件在其一侧形成透光表面。 本发明允许容易地制造所需形状的反射表面，而不管LED芯片尺寸如何，小型化，LED阵列中的批量生产，显着提高生产率。

公开(公告)号：US07157029B2

公开(公告)日：2007-01-02

申请号：US10867816

申请日：2004-06-16

Applicant: Joon Ho Yoon ,  Seon Goo Lee ,  Doo Hoon Ahn

Inventor： Joon Ho Yoon ,  Seon Goo Lee ,  Doo Hoon Ahn

IPC: B01J2/22 ,  B29C67/00

CPC classification number: C09K11/02 ,  C09K11/08 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0041 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Disclosed herein is a method for producing a molding compound resin tablet for wavelength conversion. The method comprises the steps of wet-dispersing a phosphor powder in a translucent liquid resin to form a molding compound resin body in which the phosphor powder is dispersed, and grinding the molding compound resin body into a powder form and applying a predetermined pressure to the resin powder. Further disclosed is a method for manufacturing a white light emitting diode using the molding compound resin tablet by a transfer molding process.

Abstract translation: 本文公开了一种用于生产用于波长转换的模塑料树脂片剂的方法。 该方法包括以下步骤：将荧光体粉末分散在半透明液体树脂中以形成其中分散有荧光体粉末的模塑复合树脂体，并将模塑料树脂体研磨成粉末形式，并将预定压力施加到 树脂粉。 进一步公开了一种通过传递模塑法制造使用该模塑复合树脂片的白色发光二极管的方法。

公开(公告)号：US06995448B2

公开(公告)日：2006-02-07

申请号：US10107656

申请日：2002-03-25

Applicant: Sang Ho Lee ,  Jun Young Yang ,  Seon Goo Lee ,  Jong Hae Hyun ,  Choon Heung Lee

Inventor： Sang Ho Lee ,  Jun Young Yang ,  Seon Goo Lee ,  Jong Hae Hyun ,  Choon Heung Lee

IPC: H01L29/00 ,  H01L23/02

CPC classification number: H01L24/32 ,  H01L23/52 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/05554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/351 ,  Y10S257/927 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A semiconductor package including passive elements and a method of manufacturing provide reduced package size, improved performance and higher process yield by mounting the passive elements beneath the semiconductor die on the substrate. The semiconductor die may be mounted above the passive elements by mechanically bonding the semiconductor die to the passive elements, mounting the passive elements within a recess in the substrate or mounting the semiconductor using an adhesive retaining wall on the substrate that protrudes above and extends around the passive elements. The recess may include an aperture through the substrate to vent the package to the outside environment or may comprise an aperture through the substrate and larger than the semiconductor die, permitting the encapsulation to entirely fill the aperture, covering the die and the passive elements to secure them mechanically within the package.