Polymer, resist composition and patterning process
    61.
    发明授权
    Polymer, resist composition and patterning process 有权
    聚合物,抗蚀剂组合物和图案化工艺

    公开(公告)号:US06673518B2

    公开(公告)日:2004-01-06

    申请号:US10170346

    申请日:2002-06-14

    IPC分类号: G03C1492

    摘要: A polymer comprising recurring units of formula (1) wherein R1 is H or methyl, R2 is H or C1-8 alkyl, R3 is hydrogen or CO2R4, and R4 is C1-15 alkyl and recurring units having a carboxylic acid protected with an acid-decomposable protecting group containing an adamantane or tetracyclo-[4.4.0.12,5.17,10]dodecane structure and having a Mw of 1,000-500,000 is novel. A resist composition comprising the polymer as a base resin is sensitive to high-energy radiation, has excellent sensitivity, resolution and etching resistance and lends itself to micropatterning with electron beams or deep-UV.

    摘要翻译: 包含式(1)的重复单元的聚合物,其中R 1是H或甲基,R 2是H或C 1-8烷基,R 3是氢或CO 2 R 4,R 4是 C1-15烷基和具有羧酸保护的重复单元,所述羧酸用含有金刚烷或四环 - [4.4.0.1,2.5,1.1,7,10]]十二烷结构的酸可分解保护基团保护,并具有Mw为1,000 -500,000是小说。 包含作为基础树脂的聚合物的抗蚀剂组合物对高能量辐射敏感,具有优异的灵敏度,分辨率和耐蚀刻性,并且适用于电子束或深紫外线的微图案化。

    Polymer, resist composition and patterning process
    62.
    发明授权
    Polymer, resist composition and patterning process 有权
    聚合物,抗蚀剂组合物和图案化工艺

    公开(公告)号:US06670094B2

    公开(公告)日:2003-12-30

    申请号:US10000221

    申请日:2001-12-04

    IPC分类号: G03F7038

    摘要: A polymer comprising recurring units of formula (1-1) or (1-2) wherein R1 and R2 are H or C1-15 alkyl, R1 and R2, taken together, may form a ring; R3 is H, C1-15 alkyl, acyl or alkylsulfonyl or C2-15 alkoxycarbonyl or alkoxyalkyl which may have halogen substituents, not all R1, R2 and R3 are hydrogen; and k=0 or 1, and having a Mw of 1,000-500,000 is novel. A resist composition comprising the polymer as a base resin is sensitive to high-energy radiation, has excellent sensitivity, resolution, etching resistance, and minimized swell and lends itself to micropatterning with electron beams or deep-UV.

    摘要翻译: 包含式(1-1)或(1-2)的重复单元的聚合物,其中R 1和R 2是H或C 1-15烷基,R 1和R 2一起可以一起 形成戒指 R 3为H,C 1-15烷基,酰基或烷基磺酰基或可具有卤素取代基的C 2-5烷氧基羰基或烷氧基烷基,并不全部为R 1,R 2和R 3为氢; 并且k = 0或1,并且具有1,000-500,000的Mw是新颖的。 包含作为基础树脂的聚合物的抗蚀剂组合物对高能辐射敏感,具有优异的灵敏度,分辨率,耐腐蚀性和最小化的溶胀,并且使其自身具有电子束或深UV的微图形化。

    Pattern forming process and resist-modifying composition
    67.
    发明授权
    Pattern forming process and resist-modifying composition 有权
    图案形成工艺和抗蚀剂改性组合物

    公开(公告)号:US08367310B2

    公开(公告)日:2013-02-05

    申请号:US12708196

    申请日:2010-02-18

    IPC分类号: G03F7/26

    摘要: A patterning process includes (1) coating and baking a first positive resist composition to form a first resist film, exposing, post-exposure baking, and alkali developing to form a first resist pattern, (2) applying a resist-modifying composition to the first resist pattern and heating to modify the first resist pattern, (3) coating and baking a second positive resist composition to form a second resist film, exposing, post-exposure baking, and alkali developing to form a second resist pattern. The modified first resist film has a contact angle with pure water of 50°-85°.

    摘要翻译: 图案化工艺包括(1)涂覆和烘烤第一正性抗蚀剂组合物以形成第一抗蚀剂膜,曝光,曝光后烘烤和碱显影以形成第一抗蚀剂图案,(2)将抗蚀剂改性组合物施加到 第一抗蚀剂图案和加热以修饰第一抗蚀剂图案,(3)涂覆和烘烤第二正性抗蚀剂组合物以形成第二抗蚀剂膜,曝光,曝光后烘烤和碱显影以形成第二抗蚀剂图案。 改性的第一抗蚀剂膜与纯水的接触角为50°-85°。

    Double patterning process
    68.
    发明授权
    Double patterning process 有权
    双重图案化工艺

    公开(公告)号:US08129099B2

    公开(公告)日:2012-03-06

    申请号:US12370901

    申请日:2009-02-13

    摘要: Double patterns are formed by coating a first chemically amplified positive resist composition comprising an acid labile group-bearing resin and a photoacid generator and prebaking to form a resist film on a processable substrate, exposing the resist film to high-energy radiation, PEB, and developing with an alkaline developer to form a first positive resist pattern, treating the first resist pattern to be alkali soluble and solvent resistant, coating a second resist composition and prebaking to form a reversal film, and exposing the reversal film to high-energy radiation, PEB, and developing with an alkaline developer to form a second positive resist pattern. The last development step includes dissolving away the reversed first resist pattern and achieving reversal transfer.

    摘要翻译: 通过涂布第一化学放大的正型抗蚀剂组合物形成双重图案,该组合物包含含酸不稳定基团的树脂和光酸产生剂,并且预烘烤以在可加工的基材上形成抗蚀剂膜,将抗蚀剂膜暴露于高能辐射,PEB和 用碱性显影剂显影以形成第一正性抗蚀剂图案,将第一抗蚀剂图案处理为碱溶性和耐溶剂性,涂覆第二抗蚀剂组合物和预烘烤以形成反转膜,并将反转膜暴露于高能量辐射, PEB,并用碱性显影剂显影以形成第二正性抗蚀剂图案。 最后的发展步骤包括将反转的第一抗蚀剂图案溶解并实现反转印。

    RESIST-MODIFYING COMPOSITION AND PATTERN FORMING PROCESS
    70.
    发明申请
    RESIST-MODIFYING COMPOSITION AND PATTERN FORMING PROCESS 有权
    电阻修饰组合物和图案形成工艺

    公开(公告)号:US20100297563A1

    公开(公告)日:2010-11-25

    申请号:US12785930

    申请日:2010-05-24

    IPC分类号: G03F7/20

    摘要: A patterning process includes (1) coating a first positive resist composition onto a substrate, baking, exposing, post-exposure baking, and alkali developing to form a first resist pattern, (2) coating a resist-modifying composition onto the first resist pattern and heating to effect modifying treatment, and (3) coating a second positive resist composition, baking, exposing, post-exposure baking, and alkali developing to form a second resist pattern. The resist modifying composition comprises a base resin comprising recurring units having formula (1) wherein A1 is alkylene, R1 is H or methyl, R2 is alkyl or bond together to form a nitrogen-containing heterocycle, and an alcohol-based solvent.

    摘要翻译: 图案化工艺包括(1)将第一正性抗蚀剂组合物涂覆在基材上,烘烤,曝光,曝光后烘烤和碱显影以形成第一抗蚀剂图案,(2)将抗蚀剂改性组合物涂覆到第一抗蚀剂图案上 加热进行改性处理,(3)涂布第二正性抗蚀剂组合物,烘烤,曝光,曝光后烘烤和碱显影以形成第二抗蚀剂图案。 抗蚀剂改性组合物包括含有式(1)的重复单元的基础树脂,其中A1是亚烷基,R1是H或甲基,R2是烷基或键合在一起形成含氮杂环,和醇类溶剂。