Abstract:
Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a semiconductor substrate including a cell array region, memory cell transistors disposed at the cell array region, bitlines disposed on the memory cell transistors, and a source plate disposed between the memory cell transistors and the bitlines to veil the memory cell transistors thereunder.
Abstract:
A semiconductor device includes a plurality of transistors disposed on a semiconductor substrate, a device isolation layer disposed around the transistors, a guard ring disposed to surround the device isolation layer and the transistors, and a guard region disposed between adjacent transistors.
Abstract:
Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes a semiconductor substrate including a cell array region, memory cell transistors disposed at the cell array region, bitlines disposed on the memory cell transistors, and a source plate disposed between the memory cell transistors and the bitlines to veil the memory cell transistors thereunder.
Abstract:
Embodiments of the invention provide a semiconductor device and a related method of fabricating a semiconductor device. In one embodiment, the invention provides a semiconductor device comprising a first gate electrode comprising a lower silicon pattern and an upper silicon pattern and disposed on an active region of a semiconductor substrate, wherein the upper silicon pattern has the same crystal structure as the lower silicon pattern and the active region is defined by a device isolation layer. The semiconductor device further comprises a gate insulating layer disposed between the active region and the first gate electrode.
Abstract:
A semiconductor memory device can include select transistors and cell transistors on a semiconductor substrate. An insulation layer covers the select transistors and the cell transistors. The bit lines are in the insulation layer and are electrically connected to respective ones of the select transistors. The bit lines are arranged along at least two different parallel planes having different heights relative to the semiconductor substrate.
Abstract:
The present invention provides a semiconductor device in which the gate is self-aligned to the device isolation film and a fabricating method thereof. A device isolation film restricting an active region is disposed on a portion of a semiconductor substrate, and a word line is across over the device isolation film. A gate pattern is disposed between the word line and the active region, and a tunnel oxide film is disposed between the gate pattern and the active region. The gate pattern comprises a floating gate pattern, a gate interlayer dielectric film pattern and a control gate electrode pattern deposited in the respective order, and has a sidewall self-aligned to the device isolation film. To form the gate pattern having the sidewall self-aligned to the device isolation film, a gate insulation film and a gate material film are formed in the respective order on the semiconductor substrate.
Abstract:
A nonvolatile memory device includes an active region defined by a device isolation layer in a semiconductor substrate, a word line passing over the active region and a charge storage region defined by a crossing of the active region and the word line and disposed between the active region and the word line. The charge storage region is disposed at an oblique angle with respect to the word line.
Abstract:
A method of forming a semiconductor device can include forming a plurality of gate structure patterns including gates and first mask patterns stacked on a semiconductor substrate, the gate structure patterns being spaced apart from each other and extending in a first direction, forming a first interlayer insulating layer covering the gate structure patterns, forming a plurality of second mask patterns extending in a second direction crossing the first direction and spaced apart from each other, and etching the first interlayer insulating layer to form a contact hole, self-aligned to the first and second mask patterns, in at least one contact region defined by a neighboring pair of the first mask patterns and a neighboring pair of the second mask patterns. Related devices are also disclosed.
Abstract:
There is provided a non-volatile memory device having a multi-bit cell structure. In the non-volatile memory device, a memory cell array includes a plurality of cells of a first conductivity type which has different threshold voltages and are arranged in a matrix on a semiconductor substrate. A bulk region of a second conductivity type opposite to the first conductivity underlies the memory cell array and receives a predetermined back bias voltage when a cell is driven. The threshold voltage difference between states can be sufficiently widened because a state having a high bulk concentration is highly susceptible to a body effect. Therefore, reduction of masks leads to process simplicity, reduced turnaround time, and improved process margin.
Abstract:
A method for manufacturing a buried transistor, which includes the steps of forming a field oxide layer in a substrate, the field oxide region having a central portion having a greater thickness than opposite edge portions thereof, forming source/drain regions in the substrate, on opposite sides of the field oxide layer, removing the field oxide layer, and forming a gate electrode on the resultant structure.