公开(公告)号：US20240421126A1

公开(公告)日：2024-12-19

申请号：US18598938

申请日：2024-03-07

Applicant: Apple Inc.

Inventor： Chi Nung Ni ,  Wei Chen ,  Weiming Chris Chen ,  Vidhya Ramachandran ,  Jie-Hua Zhao ,  Suk-Kyu Ryu ,  Myung Jin Yim ,  Chih-Ming Chung ,  Jun Zhai ,  Young Doo Jeon ,  Seungjae Lee

IPC: H01L25/065 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/528 ,  H01L23/538 ,  H01L23/58 ,  H01L29/06

Abstract: Integrated circuit (IC) structures, electronic modules, and methods of fabrication are described in which direct bonded interfaces are removed at corners or edges to counteract the potential for non-bonding or delamination. This can be accomplished during singulation, in which a side recess is formed through an entire thickness of an electronic component and into a direct bonded die, followed by final singulation of the IC structure.

公开(公告)号：US20240395686A1

公开(公告)日：2024-11-28

申请号：US18324612

申请日：2023-05-26

Applicant: Apple Inc.

Inventor： Wei Chen ,  Jie-Hua Zhao ,  Jun Zhai ,  Kunzhong Hu ,  Arun Sasi ,  Balaji Nandhivaram Muthuraman ,  Zezhou Liu

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/538

Abstract: Electronic packages and electronic systems are described in which a package redistribution layer of the electronic package includes structural features such a via line connections to reduce stress concentration, particularly when the package redistribution layer is formed of organic dielectric materials.

公开(公告)号：US20240249989A1

公开(公告)日：2024-07-25

申请号：US18158090

申请日：2023-01-23

Applicant: Apple Inc.

Inventor： Wei Chen ,  Balaji Nandhivaram Muthuraman ,  Arun Sasi ,  Jie-Hua Zhao ,  Suk-Kyu Ryu ,  Jun Zhai ,  Dominic Morache ,  Young Doo Jeon

IPC: H01L23/31 ,  H01L23/00 ,  H01L23/34

CPC classification number: H01L23/3157 ,  H01L23/34 ,  H01L24/16 ,  H01L24/17 ,  H01L2224/16113 ,  H01L2224/16225 ,  H01L2224/17055 ,  H01L2924/10162 ,  H01L2924/1811 ,  H01L2924/182

Abstract: Microelectronic structures with selectively applied underfill material and/or edge bond material are described. In an embodiment, isolated underfill regions and/or edge bond regions are applied to adjacent to one or more edges of an electronic device and form a plurality of vent openings along the one or more edges.

公开(公告)号：US11972713B2

公开(公告)日：2024-04-30

申请号：US17714804

申请日：2022-04-06

Applicant: Apple Inc.

Inventor： Hari P. Paudel ,  Chaohao Wang ,  Hopil Bae ,  Mahdi Farrokh Baroughi ,  Wei Chen ,  Wei H. Yao

IPC: G09G3/20

CPC classification number: G09G3/20 ,  G09G2300/0439 ,  G09G2320/0233 ,  G09G2330/10

Abstract: An electronic device may display image content via an electronic display by controlling light emission from display pixels of the electronic display. A processor of the electronic device may receive image data destined for a defective display pixel (e.g., dim pixel, dead pixel). The processor may convert a gray level of the image data into a luminance domain to generate a target luminance that would have been emitted by the defective display pixel had the display pixel not been defective. After selecting a compensation mask, the processor may distribute the target luminance of the defective display pixels to nearby non-defective pixels of the electronic display to conceal the presence of the defective display pixel.

公开(公告)号：US20230317624A1

公开(公告)日：2023-10-05

申请号：US18058991

申请日：2022-11-28

Applicant: Apple Inc.

Inventor： Wei Chen ,  Yi Xu ,  Jie-Hua Zhao ,  Jun Zhai

IPC: H01L23/538 ,  H01L23/31 ,  H01L25/065 ,  H01L25/18 ,  H01L23/00

CPC classification number: H01L23/5386 ,  H01L23/3128 ,  H01L23/5383 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/18 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/48225

Abstract: Microelectronic packages and methods of fabrication are described. In an embodiment, a redistribution layer spans across multiple components, and includes a region of patterned wiring traces that may mitigate stress in the RDL between the multiple components.

公开(公告)号：US11646302B2

公开(公告)日：2023-05-09

申请号：US17013279

申请日：2020-09-04

Applicant: Apple Inc.

Inventor： Wei Chen ,  Jie-Hua Zhao ,  Jun Zhai ,  Po-Hao Chang ,  Hsien-Che Lin ,  Ying-Chieh Ke ,  Kunzhong Hu

IPC: H01L25/18 ,  H01L23/24

CPC classification number: H01L25/18 ,  H01L23/24

Abstract: Multiple chip module (MCM) structures are described. In an embodiment, a module includes a first and second components on the top side of a module substrate, a stiffener structure mounted on the top side of the module substrate, and a lid mounted on the stiffener structure and covering the first component and the second component. The stiffener is joined to the lid within a trench formed in a roof of the lid.

公开(公告)号：US20220358867A1

公开(公告)日：2022-11-10

申请号：US17714804

申请日：2022-04-06

Applicant: Apple Inc.

Inventor： Hari P. Paudel ,  Chaohao Wang ,  Hopil Bae ,  Mahdi Farrokh Baroughi ,  Wei Chen ,  Wei H. Yao

IPC: G09G3/20

Abstract: An electronic device may display image content via an electronic display by controlling light emission from display pixels of the electronic display. A processor of the electronic device may receive image data destined for a defective display pixel (e.g., dim pixel, dead pixel). The processor may convert a gray level of the image data into a luminance domain to generate a target luminance that would have been emitted by the defective display pixel had the display pixel not been defective. After selecting a compensation mask, the processor may distribute the target luminance of the defective display pixels to nearby non-defective pixels of the electronic display to conceal the presence of the defective display pixel.

公开(公告)号：US20210366861A1

公开(公告)日：2021-11-25

申请号：US16879596

申请日：2020-05-20

Applicant: Apple Inc.

Inventor： Wei Chen ,  Jun Zhai ,  Kunzhong Hu

IPC: H01L23/00

Abstract: Electronic packages and modules are described. In an embodiment, a hybrid thermal interface material including materials with different thermal conductivities is used to attach a lid to a device. In an embodiment, a low temperature solder material is included as part of an adhesion layer for attachment with a stiffener structure.

公开(公告)号：US20210042188A1

公开(公告)日：2021-02-11

申请号：US16535643

申请日：2019-08-08

Applicant: Apple Inc.

Inventor： Wei Chen ,  Sanjay Pant

IPC: G06F11/10 ,  G11C29/52

Abstract: An apparatus includes a non-volatile storage circuit that includes a primary copy of a data value in a first storage location and a redundant copy of the data value in a second, different storage location. The data value includes one or more bits. The apparatus further includes an error detection circuit configured to retrieve contents of the first and second storage locations in response to a request for the data value. The error detection circuit is further configured to perform an error correction operation on the retrieved contents of the first and second storage locations to generate a data output responsive to the request, and to perform an error detection operation to generate an error signal that indicates whether the retrieved contents of the first and second storage locations are different.

公开(公告)号：US20200348789A1

公开(公告)日：2020-11-05

申请号：US16936245

申请日：2020-07-22

Applicant: Apple Inc.

Inventor： Wei Chen ,  Steven P. Hotelling ,  John Z. Zhong ,  William C. Athas ,  Wei H. Yao

IPC: G06F3/041 ,  G09G3/32 ,  H04N9/30 ,  G06F3/044

Abstract: An electronic device may include a display. The display may be formed by an array of light-emitting diodes mounted to the surface of a substrate. The substrate may be a silicon substrate. Circuitry may be located in spaces between the light-emitting diodes. Circuitry may also be located on the rear surface of the silicon substrate and may be coupled to the array of light-emitting diodes using through-silicon vias. The circuitry may include integrated circuits and other components that are attached to the substrate and may include transistors and other circuitry formed within the silicon substrate. Touch sensor electrodes, light sensors, and other components may be located in the spaces between the light-emitting diodes. The substrate may be formed from a transparent material that allows image light to reach a lens and image sensor mounted below the substrate.