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96 条记录 (耗时 0.032 秒)

    Omnidirectional dipole antenna
    62.
    发明授权
    Omnidirectional dipole antenna 失效
    全向偶极天线

    公开(公告)号：US5914695A

    公开(公告)日：1999-06-22

    申请号：US783938

    申请日：1997-01-17

    申请人： Duixian Liu ,  Modest Michael Oprysko

    发明人： Duixian Liu ,  Modest Michael Oprysko

    IPC分类号： H03H7/38 ,  H01Q1/38 ,  H01Q9/26 ,  H01Q9/28

    CPC分类号： H01Q9/285 ,  H01Q9/28

    摘要： The invention is a novel antenna configuration that has a substantially smaller size than existing antennas tuned to a given frequency. Compact size is provided without substantial loss in performance, making the antenna particularly suitable for hand-held devices. An antenna in accordance with the invention is preferably situated on an FR4 substrate, and includes a dipole having first and second pairs of copper radiating strips, one pair on each of the top and bottom surfaces of the substrate. Each radiating strip in a pair has a copper conductive strip coupled thereto, the strip of one radiating element being situated on the same surface of the substrate as the respective strip, with the conducting element of the other radiating strip being disposed on the opposite surface of the substrate. The effect of the configuration is to lengthen the radiating strips without an increase in substrate dimensions, thereby allowing tuning to low frequencies for a given substrate size. An on-board matching network includes adjustable capacitance and inductance to match the impedance of the antenna with that of a connector coupled to an off-substrate transceiver. A preferred implementation for a 900 MHz antenna is described.

    摘要翻译： 本发明是一种新颖的天线配置，其具有比调谐到给定频率的现有天线更小的尺寸。 提供紧凑的尺寸而没有实质性的损失，使得天线特别适合于手持装置。 根据本发明的天线优选地位于FR4基板上，并且包括具有第一和第二对铜辐射条的偶极子，在基板的每个顶表面和底表面上都有一对。 一对中的每个辐射带具有耦合到其上的铜导电条，一个辐射元件的条与位于相应条的位于基板的相同表面上，另一辐射带的导电元件设置在 底物。 该配置的效果是延长辐射条而不增加衬底尺寸，从而允许在给定衬底尺寸下调谐到低频。 车载匹配网络包括可调电容和电感，以将天线的阻抗与耦合到非基板收发器的连接器的阻抗相匹配。 描述了900MHz天线的优选实现。

    Phased-array transceiver
    63.
    发明授权
    Phased-array transceiver 有权
    相控阵收发器

    公开(公告)号：US09203159B2

    公开(公告)日：2015-12-01

    申请号：US13371924

    申请日：2012-02-13

    申请人： Daniel J. Friedman ,  Xiaoxiong Gu ,  Duixian Liu ,  Arun S. Natarajan ,  Scott K. Reynolds ,  Alberto Valdes Garcia

    发明人： Daniel J. Friedman ,  Xiaoxiong Gu ,  Duixian Liu ,  Arun S. Natarajan ,  Scott K. Reynolds ,  Alberto Valdes Garcia

    IPC分类号： H01Q1/24 ,  H01Q21/06

    CPC分类号： H01Q21/061 ,  H01L2224/16225 ,  H01Q21/065 ,  H01Q23/00 ,  H04B7/04 ,  Y10T29/49016

    摘要： Systems, methods, devices and apparatuses directed to transceiver devices are disclosed. In accordance with one method, a first set of antenna positions in a first section of a set of sections of a circuit layout for the circuit package is selected. The method further includes selecting another set of antenna positions in another section of the circuit layout such that an arrangement of selected antenna positions of the other set is different from an arrangement of selected antenna positions of a previously selected set of antenna positions. The selecting another set of positions in another section is iterated until selections have been made for a total number of antennas. The selecting the other set is performed such that consecutive unselected positions in the other section do not exceed a predetermined number of positions. In addition, antenna elements are formed at the selected positions to fabricate the circuit package.

    摘要翻译： 公开了针对收发器设备的系统，方法，设备和设备。 根据一种方法，选择电路封装的电路布局的一组部分的第一部分中的第一组天线位置。 该方法还包括在电路布局的另一部分中选择另一组天线位置，使得另一组的所选择的天线位置的布置与先前选择的一组天线位置的选定天线位置的布置不同。 迭代在另一部分中选择另一组位置，直到对天线总数进行选择。 执行另一组的选择，使得另一部分中的连续未选定位置不超过预定数量的位置。 此外，天线元件形成在所选择的位置以制造电路封装。

    Antenna array package and method for building large arrays
    64.
    发明授权
    Antenna array package and method for building large arrays 有权
    天线阵列封装和构建大阵列的方法

    公开(公告)号：US08816929B2

    公开(公告)日：2014-08-26

    申请号：US13191917

    申请日：2011-07-27

    申请人： Dong G. Kam ,  Duixian Liu ,  Scott K. Reynolds

    发明人： Dong G. Kam ,  Duixian Liu ,  Scott K. Reynolds

    IPC分类号： H01Q1/48 ,  H01Q1/38

    CPC分类号： H01Q21/065 ,  H01Q9/0414 ,  H01Q21/0025 ,  H01Q21/064

    摘要： Array packages and methods for forming large-scale antenna arrays. One method includes aligning two or more array packages. The two or more array packages each include one or more bottom dielectric layers, an array of antennas arranged in a plane above the one or more bottom dielectric layers, a ground plane layer above the one or more bottom dielectric layers, and a conductive surface on at least a part of an outside surface of the array package and orthogonal to the plane of the array of antennas. The conductive surface is electrically connected to the ground plane layer.

    摘要翻译： 用于形成大型天线阵列的阵列封装和方法。 一种方法包括对准两个或更多个阵列封装。 两个或更多个阵列封装每个包括一个或多个底部电介质层，布置在一个或多个底部电介质层上方的平面中的天线阵列，一个或多个底部电介质层上方的接地平面层，以及位于 阵列封装的外表面的至少一部分并且与天线阵列的平面正交。 导电表面电连接到接地层。

    Compact millimeter wave packages with integrated antennas
    67.
    发明授权
    Compact millimeter wave packages with integrated antennas 有权
    具有集成天线的紧凑型毫米波封装

    公开(公告)号：US08256685B2

    公开(公告)日：2012-09-04

    申请号：US12494671

    申请日：2009-06-30

    申请人： Ho Chung Chen ,  Brian A. Floyd ,  Duixian Liu

    发明人： Ho Chung Chen ,  Brian A. Floyd ,  Duixian Liu

    IPC分类号： G06K19/06

    CPC分类号： G06K19/07749 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/1903 ,  H01Q1/2283 ,  H01L2924/00014

    摘要： A radio-frequency integrated circuit chip package has at least one integrated antenna. The package includes at least one generally planar ground plane formed with at least one slot therein. A first substrate structure has an outer surface and an inner surface. The at least one generally planar ground plane is formed on the outer surface of the first substrate structure. At least one feed line is spaced inwardly from the ground plane and parallel thereto. The at least one feed line has an inner surface and an outer surface and is a transmission line formed on the inner surface of the first substrate structure with the outer surface of the at least one feed line adjacent the inner surface of the first substrate structure. At least one radio frequency chip is coupled to the feed line and the ground plane. A second substrate structure, spaced inwardly from the feed line, defines a chip-receiving cavity. The chip is located in the chip-receiving cavity. The inner surface of the at least one feed line borders the chip-receiving cavity. An antenna patch may be provided. Planar phased array embodiments, assemblies with motherboards and heat sinks, and fabrication techniques are also disclosed.

    摘要翻译： 射频集成电路芯片封装具有至少一个集成的天线。 该封装包括至少一个在其中形成有至少一个槽的大致平面的接地平面。 第一衬底结构具有外表面和内表面。 至少一个大致平面的接地平面形成在第一基板结构的外表面上。 至少一个进料管线从接地平面向内隔开并与其平行。 所述至少一个进料管线具有内表面和外表面，并且是形成在所述第一基材结构的内表面上的传输线，所述至少一个进料管线的外表面邻近所述第一基材结构的内表面。 至少一个射频芯片被耦合到馈线和接地平面。 从馈电线向内隔开的第二衬底结构限定了芯片接收腔。 芯片位于芯片接收腔中。 所述至少一个馈送线的内表面与所述芯片接收腔相接。 可以提供天线贴片。 还公开了平面相控阵实施例，具有主板和散热器的组件以及制造技术。

    Method and apparatus for packaging an integrated chip and antenna
    69.
    发明授权
    Method and apparatus for packaging an integrated chip and antenna 有权
    用于封装集成芯片和天线的方法和装置

    公开(公告)号：US08018384B2

    公开(公告)日：2011-09-13

    申请号：US12130562

    申请日：2008-05-30

    申请人： Brian Allan Floyd ,  Duixian Liu ,  Robert M. Morton

    发明人： Brian Allan Floyd ,  Duixian Liu ,  Robert M. Morton

    IPC分类号： H01Q1/38

    CPC分类号： H01Q21/065 ,  H01Q9/0457 ,  H01Q21/0006 ,  Y10T29/49016

    摘要： In an illustrative embodiment, an apparatus includes at least one antenna structure located on a first surface of a first substrate; at least one pad located on the first surface of the first substrate; and at least one via traversing the first substrate and thereby connecting the at least one pad located on the first surface of the first substrate to at least one pad located on a second surface. The at least one pad located on the first surface of the first substrate is operatively coupleable to at least one pad located on a surface of an integrated circuit and the at least one pad located on the second surface is operatively coupleable to at least one pad located on a surface of a printed circuit board. The at least one via is thereby operative to couple the at least one pad located on the surface of the integrated circuit and the at least one pad located on the surface of the printed circuit board.

    摘要翻译： 在说明性实施例中，装置包括位于第一基板的第一表面上的至少一个天线结构; 位于所述第一基板的所述第一表面上的至少一个焊盘; 以及穿过第一衬底的至少一个通孔，从而将位于第一衬底的第一表面上的至少一个衬垫连接到位于第二表面上的至少一个衬垫。 位于第一基板的第一表面上的至少一个焊盘可操作地耦合到位于集成电路的表面上的至少一个焊盘，并且位于第二表面上的至少一个焊盘可操作地耦合到至少一个位于 在印刷电路板的表面上。 因此，至少一个通孔可操作地耦合位于集成电路的表面上的至少一个焊盘和位于印刷电路板表面上的至少一个焊盘。

    Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities
    70.
    发明授权
    Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities 有权
    射频（RF）集成电路（IC）封装，在环和/或偏移空腔中集成了孔耦合贴片天线

    公开(公告)号：US07696930B2

    公开(公告)日：2010-04-13

    申请号：US12102051

    申请日：2008-04-14

    申请人： Johannes A. G. Akkermans ,  Brian A. Floyd ,  Duixian Liu

    发明人： Johannes A. G. Akkermans ,  Brian A. Floyd ,  Duixian Liu

    IPC分类号： H01Q1/38

    CPC分类号： H01Q21/065 ,  G06K19/07749 ,  G06K19/07786 ,  H01L23/3121 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15323 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q9/0457 ,  H01Q21/061 ,  H01Q23/00 ,  Y10T29/49016

    摘要： A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity. A second substrate layer is interposed in a region between the ground plane and a plane defined by the patch, the patch is formed in a first metal layer, the ground plane is formed in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located. “Island” and “offset” configurations, as well as fabrication methods, are also disclosed.

    摘要翻译： 射频集成电路芯片封装具有N个集成的孔耦合贴片天线，N为至少两个，并且包括N个通常为平面的贴片，以及至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并基本上与之平行。 。 接地平面在其中形成有至少N个耦合孔隙，并且槽基本上与贴片相对。 N个进料管线从接地平面向内隔开并基本上与其平行，并且至少一个射频芯片与进料管线向内间隔开并连接到进料管线和接地平面。 第一衬底层从馈电线向内隔开，并且形成有芯片接收腔，芯片位于芯片接收腔中。 第二基板层插入在接地平面和由贴片限定的平面之间的区域中，贴片形成在第一金属层中，接地平面形成在第二金属层中，第二基板层限定天线 其中N个大体平面的贴片位于其中。 还公开了“岛”和“偏移”结构以及制造方法。