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公开(公告)号：US20080142208A1
公开(公告)日：2008-06-19
申请号：US11611704
申请日：2006-12-15
CPC分类号： H01L21/67109 , F28D15/02 , F28D15/06 , F28D2021/0077 , F28F13/14 , F28F13/185
摘要： A method and apparatus for heating a substrate is provided herein. In one embodiment, a substrate heater includes a vessel having an upper member including a top surface for supporting a substrate thereon; a liquid disposed within and partially filling the vessel; and a heat source for providing sufficient heat to the liquid to boil the liquid. Optionally, a pressure controller for regulating the pressure within the vessel may be provided. The substrate is heated by first placing the substrate on the support surface of the vessel of the substrate heater. The liquid contained in the vessel is then boiled. As the liquid is boiling, a uniform film of heated condensation is deposited on a bottom side of the support surface. The heated condensation heats the support surface which in turn, heats the substrate.
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公开(公告)号：US5769540A
公开(公告)日：1998-06-23
申请号：US180852
申请日：1994-01-12
CPC分类号： G01B11/0658 , G01B11/06 , G01J5/0003 , G01J5/0007 , G01J5/08 , G01J5/0821 , G01J5/0846 , G01J5/602 , G01N21/474 , G01N21/8422 , G01J2005/068 , G01N2021/4742
摘要： Thermal, optical, physical and chemical characteristics of a substrate (11) surface are determined with non-contact optical techniques that include illuminating (23) the surface with radiation having a ripple intensity characteristic (51), and then measuring the combined intensities (53) of that radiation after modification by the substrate surface and radiation emitted from the surface. Precise determinations of emissivity, reflectivity, temperature, changing surface composition, the existence of any layer formed on the surface and its thickness are all possible from this measurement. They may be made in situ and substantially in real time, thus allowing the measurement to control (39, 41) various processes of treating a substrate surface. This has significant applicability to semiconductor wafer processing and metal processing.
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63.发明授权
公开(公告)号：US5318362A
公开(公告)日：1994-06-07
申请号：US943927
申请日：1992-09-11
CPC分类号： G01J5/602 , G01J5/0003 , G01J5/0007 , G01J5/08 , G01J5/0818 , G01J5/0834 , G01J2005/068 , G01J5/026
摘要： A non-contact pyrometric technique is provided for measuring the temperature and/or emissivity of an object that is being heated by electromagnetic radiation within the optical range. The measurement is made at short wavelengths for the best results. The measurement may be made at wavelengths within those of the heating optical radiation, and the resulting potential error from detecting heating radiation reflected from the object is avoided by one of two specific techniques. A first technique utilizes a mirror positioned between the heating lamps and the object, the mirror reflecting a narrow wavelength band of radiation in which the optical pyrometer detector operates. The second technique is to independently measure the a.c. ripple of the heating lamp radiation and subtract the background optical noise from the detected object signal in order to determine temperature and emissivity of the object. Both of these techniques can be combined, if desired.
摘要翻译： 提供了一种非接触式高温测量技术，用于测量由光学范围内的电磁辐射加热的物体的温度和/或发射率。 在短波长下进行测量以获得最佳效果。 可以在加热光辐射的波长处进行测量，并且通过两种特定技术之一避免从检测从物体反射的加热辐射的结果的潜在误差。 第一种技术利用位于加热灯和物体之间的镜子，镜子反射出光学高温计检测器工作的窄的辐射波长带。 第二种技术是独立测量a.c. 加热灯辐射的波动，并从检测到的物体信号中减去背景光学噪声，以确定物体的温度和发射率。 如果需要，可以组合这两种技术。
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64.发明授权Non-contact techniques for measuring temperature or radiation-heated objects 失效用于测量温度或辐射加热物体的非接触式技术
公开(公告)号：US5154512A
公开(公告)日：1992-10-13
申请号：US507605
申请日：1990-04-10
CPC分类号： G01J5/602 , G01J5/0003 , G01J5/0007 , G01J5/08 , G01J5/0818 , G01J5/0834 , G01J2005/068 , G01J5/026
摘要： A non-contact pyrometric technique is provided for measuring the temperature and/or emissivity of an object that is being heated by electromagnetic radiation within the optical range. The measurement is made at short wavelengths for the best results. The measurement may be made at wavelengths within those of the heating optical radiation, and the resulting potential error from detecting heating radiation reflected from the object is avoided by one of two specific techniques. A first technique utilizes a mirror positioned between the heating lamps and the object, the mirror reflecting a narrow wavelength band of radiation in which the optical pyrometer detector operates. The second technique is to independently measure the a.c. ripple of the heating lamp radiation and subtract the background optical noise from the detected object signal in order to determine temperature and emissivity of the object. Both of these techniques can be combined, if desired.
摘要翻译： 提供了一种非接触式高温测量技术，用于测量由光学范围内的电磁辐射加热的物体的温度和/或发射率。 在短波长下进行测量以获得最佳效果。 可以在加热光辐射的波长处进行测量，并且通过两种特定技术之一避免从检测从物体反射的加热辐射的结果的潜在误差。 第一种技术利用位于加热灯和物体之间的镜子，镜子反射出光学高温计检测器工作的窄的辐射波长带。 第二种技术是独立测量a.c. 加热灯辐射的波动，并从检测到的物体信号中减去背景光学噪声，以确定物体的温度和发射率。 如果需要，可以组合这两种技术。
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65.发明授权Heat resistant curable surface coating composition comprising the reaction product of an unsaturated polyaryloxyphosphazene and an unsaturated aryloxycyclotriphosphazene 失效耐热可固化表面涂料组合物，其包含不饱和聚芳氧基磷腈和不饱和芳氧基环三磷腈的反应产物
公开(公告)号：US4145479A
公开(公告)日：1979-03-20
申请号：US922309
申请日：1978-07-06
申请人： Bruce E. Adams , Robert D. Hensel , Edwin J. Quinn
发明人： Bruce E. Adams , Robert D. Hensel , Edwin J. Quinn
IPC分类号： E04F13/02 , C08F283/00 , C08G79/00 , C08G79/02 , C08L85/00 , C08L85/02 , C09D4/00 , C09D5/00 , C09D5/18 , C09D143/02 , C09D185/00 , B32B27/16 , B32B27/18 , C08L43/02 , C08L47/00
CPC分类号： C09D4/00 , C08F283/00 , C08G79/025 , C09D143/02 , Y10T428/24876 , Y10T428/31855
摘要： A curable coating composition comprising the reaction product of at least one unsaturated polyaryloxyphosphazene, at least one unsaturated aryloxycyclotriphosphazene, and a crosslinking agent is disclosed. In one embodiment, the coating composition is suitable for use as a cigarette burn resistant wear layer coating for thermoplastic floor coverings.
摘要翻译： 公开了包含至少一种不饱和聚芳氧基膦腈，至少一种不饱和芳氧基三环磷腈和交联剂的反应产物的可固化涂料组合物。 在一个实施方案中，涂料组合物适合用作热塑性地板覆盖物的卷烟耐烧损耐磨层涂层。
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66.发明申请TEMPERATURE MEASUREMENT AND CONTROL OF WAFER SUPPORT IN THERMAL PROCESSING CHAMBER 审中-公开温度测量和控制热处理室中的支撑公开(公告)号：US20110089166A1
公开(公告)日：2011-04-21
申请号：US12973112
申请日：2010-12-20
CPC分类号： H01L21/67248 , H01L21/67115
摘要： The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.
摘要翻译： 本发明提供了用于在快速热处理期间实现对衬底的均匀加热的装置和方法。 更具体地，本发明提供了用于在快速热处理期间控制支撑衬底的边缘环的温度的装置和方法，以改善穿过衬底的温度均匀性。
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公开(公告)号：US20100124248A1
公开(公告)日：2010-05-20
申请号：US12273809
申请日：2008-11-19
IPC分类号： G01J5/00
CPC分类号： H01L21/67248
摘要： A substrate processing system includes a processing chamber, a pedestal for supporting a substrate disposed within the processing chamber, and an optical pyrometry assembly coupled to the processing chamber to measure an emitted light originating substantially from a portion of the pedestal or substrate. The optical pyrometry assembly further includes a light receiver, and an optical detector. The optical pyrometry assembly receives a portion of the emitted light, and a temperature of the substrate is determined from an intensity of the portion of the emitted light near at least one wavelength. A method of measuring a temperature of a substrate during processing, includes disposing a light pipe near a portion of the pedestal supporting the substrate or pedestal, shielding the end of the light pipe from stray light so that the end of the light pipe receives light from the portion of the pedestal or substrate, purging the end of the light pipe with a gas to reduce contamination of the end of the light pipe, detecting a portion of the light emitted from the pedestal and received by the light pipe, and determining a temperature of the substrate from the intensity of the portion of the emitted light from the pedestal or the substrate near at least one wavelength.
摘要翻译： 基板处理系统包括处理室，用于支撑设置在处理室内的基板的基座和耦合到处理室的光学高温测量组件，以测量基本上从基座或基板的一部分发出的发射光。 光学高温测量组件还包括光接收器和光学检测器。 光学高温计组件接收一部分发射的光，并且基于发射光的至少一个波长附近的部分的强度确定衬底的温度。 一种在处理过程中测量基板的温度的方法，包括在支撑基板或基座的基座的一部分附近设置光管，将光管的端部遮蔽于杂散光，使得光管的端部接收来自 基座或基板的部分，用气体吹扫光管的端部，以减少光管的端部的污染，检测从基座发射并被光管接收的光的一部分，并且确定温度 从基板或基板的发射光的部分的强度接近至少一个波长。
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公开(公告)号：US07598150B2
公开(公告)日：2009-10-06
申请号：US11561851
申请日：2006-11-20
申请人： Joseph M. Ranish , Bruce E. Adams
发明人： Joseph M. Ranish , Bruce E. Adams
IPC分类号： H01L21/331 , A21B1/00 , A21B2/00 , F27D1/00
摘要： Methods for compensating for a thermal profile in a substrate heating process are provided herein. In one embodiment, a method of processing a substrate includes determining an initial thermal profile of a substrate resulting from a process; imposing a compensatory thermal profile on the substrate based on the initial thermal profile; and performing the process to create a desired thermal profile on the substrate. In other embodiments of the invention, the initial substrate thermal profile is compensated for by adjusting a local mass heated per unit area, a local heat capacity per unit area, or an absorptivity or reflectivity of a component proximate the substrate prior to performing the process. In another embodiment, the heat provided by an edge ring to the substrate may be controlled either prior to or during the substrate heating process.
摘要翻译： 本文提供了补偿基板加热过程中的热分布的方法。 在一个实施例中，处理衬底的方法包括确定由工艺产生的衬底的初始热分布; 基于初始热分布在衬底上施加补偿热分布; 并执行该过程以在衬底上产生期望的热分布。 在本发明的其它实施例中，通过在执行该过程之前通过调整每单位面积加热的局部质量，每单位面积的局部热容量或靠近该衬底的部件的吸收率或反射率来补偿初始衬底热分布。 在另一个实施例中，由边缘环向衬底提供的热量可以在衬底加热过程之前或期间被控制。
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69.发明申请公开(公告)号：US20080170842A1
公开(公告)日：2008-07-17
申请号：US11623238
申请日：2007-01-15
IPC分类号： A21B2/00
CPC分类号： H01L21/67248 , H01L21/67115
摘要： The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.
摘要翻译： 本发明提供了用于在快速热处理期间实现对衬底的均匀加热的装置和方法。 更具体地，本发明提供了用于在快速热处理期间控制支撑衬底的边缘环的温度的装置和方法，以改善穿过衬底的温度均匀性。
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公开(公告)号：US20080145038A1
公开(公告)日：2008-06-19
申请号：US11611680
申请日：2006-12-15
IPC分类号： F26B3/28
CPC分类号： H01L21/67103 , H01L21/67098 , H01L21/67109 , H01L21/68714
摘要： A method and apparatus for heating a substrate is provided herein. In one embodiment, a substrate heater includes a vessel having an upper member including a top surface for supporting a substrate thereon; a liquid disposed within and partially filling the vessel; and a heat source for providing sufficient heat to the liquid to boil the liquid. Optionally, a pressure controller for regulating the pressure within the vessel may be provided. The substrate is heated by first placing the substrate on the support surface of the vessel of the substrate heater. The liquid contained in the vessel is then boiled. As the liquid is boiling, a uniform film of heated condensation is deposited on a bottom side of the support surface. The heated condensation heats the support surface which in turn, heats the substrate.
摘要翻译： 本文提供了一种用于加热衬底的方法和装置。 在一个实施例中，衬底加热器包括具有上部构件的容器，所述上部构件包括用于在其上支撑衬底的顶表面; 设置在容器内并部分填充容器的液体; 以及用于向液体提供足够的热量以使液体沸腾的热源。 可选地，可以提供用于调节容器内的压力的压力控制器。 首先将基板放置在基板加热器的容器的支撑表面上来加热基板。 然后将包含在容器中的液体煮沸。 当液体沸腾时，在支撑表面的底侧上沉积有均匀的加热冷凝膜。 加热的冷凝会加热支撑表面，从而加热基板。
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