Abstract:
Metrology targets designs, design methods and measurement methods are provided, which reduce noise and enhance measurement accuracy. Disclosed targets comprise an additional periodic structure which is orthogonal to the measurement direction along which given target structures are periodic. For example, in addition to two or more periodic structures along each measurement direction in imaging or scatterometry targets, a third, orthogonal periodic structure may be introduced, which provides additional information in the orthogonal direction, can be used to reduce noise, enhances accuracy and enables the application of machine learning algorithms to further enhance accuracy. Signals may be analyzed slice-wise with respect to the orthogonal periodic structure, which can be integrated in a process compatible manner in both imaging and scatterometry targets.
Abstract:
A system for providing illumination to a measurement head for optical metrology is configured to combine illumination beams from a plurality of illumination sources to deliver illumination at one or more selected wavelengths to the measurement head. The intensity and/or spatial coherence of illumination delivered to the measurement head is controlled. Illumination at one or more selected wavelengths is delivered from a broadband illumination source configured for providing illumination at a continuous range of wavelengths.
Abstract:
The disclosure is directed to a system and method of controlling spectral attributes of illumination. According to various embodiments, a portion of illumination including an excluded selection of illumination spectra is blocked, while another portion of the illumination including a transmitted selection of illumination spectra is directed along an illumination path. In some embodiments, optical metrology is performed utilizing the spectrally controlled illumination to enhance measurement capability. For instance, the spectral attributes of illumination utilized to analyze different portions of a sample, such as different semiconductor layers, may be selected according to certain measurement characteristics associated with the analyzed portions of the sample.
Abstract:
Methods and systems are provided, which pattern an illumination of a metrology target with respect to spectral ranges and/or polarizations, illuminate a metrology target by the patterned illumination, and measure radiation scattered from the target by directing, at a pupil plane, selected pupil plane pixels from a to respective single detector(s) by applying a collection pattern to the pupil plane pixels. Single detector measurements (compressive sensing) has increased light sensitivity which is utilized to pattern the illumination and further enhance the information content of detected scattered radiation with respect to predefined metrology parameters.
Abstract:
Methods are provided for deriving a partially continuous dependency of metrology metric(s) on recipe parameter(s), analyzing the derived dependency, determining a metrology recipe according to the analysis, and conducting metrology measurement(s) according to the determined recipe. The dependency may be analyzed in form of a landscape such as a sensitivity landscape in which regions of low sensitivity and/or points or contours of low or zero inaccuracy are detected, analytically, numerically or experimentally, and used to configure parameters of measurement, hardware and targets to achieve high measurement accuracy. Process variation is analyzed in terms of its effects on the sensitivity landscape, and these effects are used to characterize the process variation further, to optimize the measurements and make the metrology both more robust to inaccuracy sources and more flexible with respect to different targets on the wafer and available measurement conditions.
Abstract:
The disclosure is directed to a system and method of controlling spectral attributes of illumination. According to various embodiments, a portion of illumination including an excluded selection of illumination spectra is blocked, while another portion of the illumination including a transmitted selection of illumination spectra is directed along an illumination path. In some embodiments, optical metrology is performed utilizing the spectrally controlled illumination to enhance measurement capability. For instance, the spectral attributes of illumination utilized to analyze different portions of a sample, such as different semiconductor layers, may be selected according to certain measurement characteristics associated with the analyzed portions of the sample.
Abstract:
An overlay target for a semiconductor device is disclosed. The overlay measurement target includes a first ring target located on a first measured layer of the semiconductor device. The first ring target includes a plurality of detectable features arranged in a circular manner having a first circumference. The overlay measurement target also includes a second ring target located on a second measured layer of the semiconductor device. The second ring target includes a plurality of detectable features arranged in a circular manner having a second circumference different from the first circumference. The displacement between a detected center of the first ring target and a detected center of the second ring target indicates an overlay error between the first measured layer and the second measured layer.
Abstract:
Aspects of the present disclosure describe systems and methods for calibrating a metrology tool by using proportionality factors. The proportionality factors may be obtained by measuring a substrate under different measurement conditions. Then calculating the measured metrology value and one or more quality merits. From this information, proportionality factors may be determined. Thereafter the proportionality factors may be used to quantify the inaccuracy in a metrology measurement. The proportionality factors may also be used to determine an optimize measurement recipe. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
Abstract:
Metrology targets and method of using the metrology targets for measurement of critical dimension, overlay or scanner aberration are disclosed. A target may include an unresolved grid having a plurality of lines spaced equally apart from each other according to a pre-determined pitch distance and at least one resolved feature tilted at an angle with respect to the unresolved grid. The method may indentify multiple regions of interest (ROIs) and determine a series of center points between the ROIs as the ROIs are being shifted. Critical dimension, overlay or scanner aberration may be calculated by analyzing the series of center points between the ROIs.
Abstract:
The disclosure is directed to a system and method of controlling spectral attributes of illumination. According to various embodiments, a portion of illumination including an excluded selection of illumination spectra is blocked, while another portion of the illumination including a transmitted selection of illumination spectra is directed along an illumination path. In some embodiments, optical metrology is performed utilizing the spectrally controlled illumination to enhance measurement capability. For instance, the spectral attributes of illumination utilized to analyze different portions of a sample, such as different semiconductor layers, may be selected according to certain measurement characteristics associated with the analyzed portions of the sample.