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    Modifying the electro-mechanical behavior of devices
    61.
    发明授权
    Modifying the electro-mechanical behavior of devices 有权
    修改设备的机电性能

    公开(公告)号：US07060895B2

    公开(公告)日：2006-06-13

    申请号：US10839307

    申请日：2004-05-04

    Applicant: Manish Kothari ,  Clarence Chui ,  Lauren Palmateer

    Inventor： Manish Kothari ,  Clarence Chui ,  Lauren Palmateer

    IPC: H01L23/18

    CPC classification number: G02B26/001 ,  B81B7/0038

    Abstract: A MEMS device is packaged with a control material that is included in the package to affect an operation of a moveable element of the device. The control material may affect operational characteristics including actuation and release voltages and currents, mechanical affects including damping and stiffness, lifetime of the device, optical properties, thermal affects and corrosion. The control material may be inserted into the package as part of any of several structural components of the package or the MEMS device.

    Abstract translation: MEMS装置与包含在包装中的控制材料一起被包装以影响装置的可移动元件的操作。 控制材料可能影响操作特性，包括致动和释放电压和电流，机械影响包括阻尼和刚度，器件寿命，光学性能，热影响和腐蚀。 控制材料可以作为封装或MEMS器件的几个结构部件中的任何一个插入到封装中。

    Method of making an electronic device with a curved backplate
    62.
    发明授权
    Method of making an electronic device with a curved backplate 有权
    制造具有弯曲背板的电子设备的方法

    公开(公告)号：US08853747B2

    公开(公告)日：2014-10-07

    申请号：US12904825

    申请日：2010-10-14

    Applicant: Lauren Palmateer ,  Brian J. Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

    Inventor： Lauren Palmateer ,  Brian J. Gally ,  William J. Cummings ,  Manish Kothari ,  Clarence Chui

    IPC: H01L29/80 ,  G02B26/00

    CPC classification number: G02B26/001

    Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate includes a curved portion relative to the substrate. The curved portion is substantially throughout the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package.

    Abstract translation: 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 背板包括相对于基板的弯曲部分。 弯曲部分基本上遍及后板。 背板在环境条件下用背密封件密封到基板的背面，由此形成封装。

    Electromechanical devices having support structures
    65.
    发明授权
    Electromechanical devices having support structures 有权
    具有支撑结构的机电装置

    公开(公告)号：US08344470B2

    公开(公告)日：2013-01-01

    申请号：US13099221

    申请日：2011-05-02

    Applicant: Jeffrey B. Sampsell ,  Clarence Chui ,  Manish Kothari ,  Mark W. Miles ,  Teruo Sasagawa ,  Wonsuk Chung ,  Ming-Hau Tung

    Inventor： Jeffrey B. Sampsell ,  Clarence Chui ,  Manish Kothari ,  Mark W. Miles ,  Teruo Sasagawa ,  Wonsuk Chung ,  Ming-Hau Tung

    IPC: H01L31/0232

    CPC classification number: G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

    Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.

    Abstract translation: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，可以使用铆钉和柱。 在某些实施方案中，这些支撑结构由诸如金属或氧化物的刚性无机材料形成。 在某些实施例中，还可以沉积蚀刻阻挡层以促进材料在形成相对于MEMS器件内的其它部件不能选择性蚀刻的支撑结构的形成中的使用。

    METHODS OF MANUFACTURING ILLUMINATION SYSTEMS
    67.
    发明申请
    METHODS OF MANUFACTURING ILLUMINATION SYSTEMS 审中-公开
    制造照明系统的方法

    公开(公告)号：US20120051088A1

    公开(公告)日：2012-03-01

    申请号：US12868649

    申请日：2010-08-25

    Applicant: Clarence Chui ,  Gaurav Sethi ,  Jonathan Charles Griffiths ,  Manish Kothari

    Inventor： Clarence Chui ,  Gaurav Sethi ,  Jonathan Charles Griffiths ,  Manish Kothari

    IPC: F21V5/02 ,  H01J9/00

    CPC classification number: G02B6/0036 ,  G02B6/006 ,  G02B6/0068

    Abstract: Illumination systems and methods of manufacturing the same. In one embodiment, an illumination system includes a plurality of light sources configured to emit light into a light panel and a plurality of light turning features disposed on the light panel configured to turn light out of the light panel. The light sources can be configured to emit different colors of light than one another and the light turning features can be arranged such that a first light turning feature turns more light having a first color than any other color of light and such that a second light turning feature turns more light having a second color than any other color of light. In another embodiment, a method of manufacturing an illumination system includes providing a light panel and positioning a luminance altering element on the light panel such that a luminance characteristic of the panel changes.

    Abstract translation: 照明系统及其制造方法。 在一个实施例中，照明系统包括被配置为将光发射到光面板中的多个光源和设置在所述光面板上的多个光转动特征，所述多个光转动特征被配置为将光从所述光面板转出。 光源可以被配置为发射彼此不同的光的颜色，并且光转动特征可以被布置成使得第一光转向特征使得具有比任何其它颜色的光具有第一颜色的更多的光，并且使得第二光转向 特征使得具有比任何其他颜色的光具有第二颜色的更多的光。 在另一个实施例中，一种制造照明系统的方法包括提供一个光面板，并将亮度改变元件定位在该光板上，使得该面板的亮度特性发生变化。

    Controlling electromechanical behavior of structures within a microelectromechanical systems device
    70.
    发明授权
    Controlling electromechanical behavior of structures within a microelectromechanical systems device 有权
    控制微机电系统设备内结构的机电行为

    公开(公告)号：US07781850B2

    公开(公告)日：2010-08-24

    申请号：US11090911

    申请日：2005-03-25

    Applicant: Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    Inventor： Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    IPC: H01L27/14

    CPC classification number: B81B3/0086 ,  B81C2201/0109 ,  B81C2201/014 ,  B81C2201/053 ,  G02B26/001

    Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

    Abstract translation: 在一个实施例中，本发明提供一种用于制造微机电系统装置的方法。 该方法包括制造包括具有特征机电响应的膜的第一层和特征光学响应，其中特征光学响应是期望的，并且特征机电响应是不期望的; 以及通过在所述微机电系统装置的启动期间至少减少其上的电荷积累来修改所述第一层的特征机电响应。

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