公开(公告)号：US20120309277A1

公开(公告)日：2012-12-06

申请号：US13587371

申请日：2012-08-16

申请人： Hozumi YASUDA ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

发明人： Hozumi YASUDA ,  Tetsuji Togawa ,  Osamu Nabeya ,  Kenichiro Saito ,  Makoto Fukushima ,  Tomoshi Inoue

IPC分类号： B24B41/06

CPC分类号： B24B37/32

摘要： A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

摘要翻译： 基板保持装置防止基板滑出并允许基板被稳定地抛光。 基板保持装置具有用于将基板保持并压靠在研磨面上的顶环体，以及用于按压研磨面的保持环，保持环设置在顶环体的外周部。 保持环包括由磁性材料制成的第一构件和具有设置在其表面上的磁体的第二构件，该磁体保持抵靠第一构件。

公开(公告)号：US07988537B2

公开(公告)日：2011-08-02

申请号：US12073430

申请日：2008-03-05

申请人： Tetsuji Togawa ,  Hiroshi Yoshida ,  Osamu Nabeya ,  Makoto Fukushima ,  Koichi Fukaya

发明人： Tetsuji Togawa ,  Hiroshi Yoshida ,  Osamu Nabeya ,  Makoto Fukushima ,  Koichi Fukaya

IPC分类号： B24B7/22

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

摘要翻译： 基板保持装置用于将基板如半导体晶片保持在用于抛光基板的抛光装置中以达到平整。 基板保持装置包括可垂直移动的构件和用于限定腔室的弹性构件。 弹性构件包括与基板接触的接触部分和从接触部分向上延伸并连接到可垂直移动部件的圆周壁。 周壁具有可伸缩的部分，其可垂直伸缩。

公开(公告)号：US20110159783A1

公开(公告)日：2011-06-30

申请号：US13057605

申请日：2009-08-07

申请人： Makoto Fukushima ,  Tetsuji Togawa ,  Shingo Saito ,  Tomoshi Inoue

发明人： Makoto Fukushima ,  Tetsuji Togawa ,  Shingo Saito ,  Tomoshi Inoue

IPC分类号： B24B1/00 ,  B24B47/02

CPC分类号： B24B37/20 ,  B24B37/005 ,  B24B37/042 ,  B24B37/32 ,  B24B49/10 ,  B24B49/12

摘要： A polishing method is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. A method of polishing a substrate by a polishing apparatus includes a polishing table (100) having a polishing surface, a top ring (1) for holding a substrate and pressing the substrate against the polishing surface, and a vertically movable mechanism (24) for moving the top ring (1) in a vertical direction. The top ring (1) is moved to a first height before the substrate is pressed against the polishing surface, and then the top ring (1) is moved to a second height after the substrate is pressed against the polishing surface.

摘要翻译： 抛光方法用于将半导体晶片等基板研磨成平面镜面。 通过研磨装置研磨基板的方法包括具有研磨面的研磨台（100），用于保持基板并将基板压靠在研磨面上的顶环（1），以及可升降机构 沿垂直方向移动顶环（1）。 在将衬底压靠在抛光表面之前，将顶环（1）移动到第一高度，然后在衬底被压靠在抛光表面上之后将顶环（1）移动到第二高度。

公开(公告)号：US20100273405A1

公开(公告)日：2010-10-28

申请号：US12747225

申请日：2009-02-09

申请人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

发明人： Makoto Fukushima ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Osamu Nabeya ,  Tomoshi Inoue

IPC分类号： B24B7/20 ,  B24B41/06 ,  B24B55/02

CPC分类号： B24B37/30

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table (100) having a polishing surface (101a), a top ring body (2) configured to hold and press a substrate against the polishing surface (101a), and a retainer ring (3) provided at an outer peripheral portion of the top ring body (2) and configured to press the polishing surface (101a). A fulcrum for receiving a lateral force applied from the substrate to the retainer ring (3) during polishing of the substrate is located above a central portion of the substrate.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有抛光面（101a）的抛光台（100），被配置为将基板保持并压靠在抛光表面（101a）上的顶环体（2），以及设置在抛光表面 所述顶环体（2）的外周部分构造成按压所述抛光表面（101a）。 用于在衬底抛光期间接收从衬底施加到保持环（3）的侧向力的支点位于衬底的中心部分的上方。

公开(公告)号：US20090111362A1

公开(公告)日：2009-04-30

申请号：US12285941

申请日：2008-10-16

申请人： Osamu Nabeya ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Makoto Fukushima

发明人： Osamu Nabeya ,  Tetsuji Togawa ,  Hozumi Yasuda ,  Koji Saito ,  Makoto Fukushima

IPC分类号： B24B7/00

CPC分类号： B24B37/32

摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing table having a polishing surface, a top ring body configured to hold and press a substrate against the polishing surface, a retainer ring provided at an outer peripheral portion of the top ring body and configured to press the polishing surface, and a retainer ring guide fixed to the top ring body and configured to be brought into sliding contact with a ring member of the retainer ring to guide a movement of said ring member. Either one of sliding contact surfaces of the ring member and the retainer ring guide which are brought into sliding contact with each other comprises a low friction material.

摘要翻译： 抛光装置用于将半导体晶片等基板研磨成平面镜面。 抛光装置包括具有研磨面的研磨台，配置为将基板保持并压靠在研磨面上的顶环体，设置在顶环体的外周部并构造成按压抛光面的保持环， 以及保持环导向件，其固定到所述顶环主体并且被构造成与所述保持环的环形构件滑动接触以引导所述环构件的运动。 彼此滑动接触的环构件和保持器环导向件的滑动接触表面中的任一个包括低摩擦材料。

公开(公告)号：US20080166957A1

公开(公告)日：2008-07-10

申请号：US12073430

申请日：2008-03-05

申请人： Tetsuji Togawa ,  Hiroshi Yoshida ,  Osamu Nabeya ,  Makoto Fukushima ,  Koichi Fukaya

发明人： Tetsuji Togawa ,  Hiroshi Yoshida ,  Osamu Nabeya ,  Makoto Fukushima ,  Koichi Fukaya

IPC分类号： B24B7/22

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： A substrate holding apparatus is for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus comprises a vertically movable member, and an elastic member for defining a chamber. The elastic member comprises a contact portion which is brought into contact with the substrate, and a circumferential wall extending upwardly from the contact portion and connected to the vertically movable member. The circumferential wall has a stretchable and contractible portion which is stretchable and contractible vertically.

摘要翻译： 基板保持装置用于将基板如半导体晶片保持在用于抛光基板的抛光装置中以达到平整。 基板保持装置包括可垂直移动的构件和用于限定腔室的弹性构件。 弹性构件包括与基板接触的接触部分和从接触部分向上延伸并连接到可垂直移动部件的圆周壁。 周壁具有可伸缩的部分，其可垂直伸缩。

公开(公告)号：US20070224916A1

公开(公告)日：2007-09-27

申请号：US11802353

申请日：2007-05-22

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： B24B49/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

公开(公告)号：US07234999B2

公开(公告)日：2007-06-26

申请号：US11599351

申请日：2006-11-15

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： B24B49/00 ,  G06F19/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

公开(公告)号：US07198552B2

公开(公告)日：2007-04-03

申请号：US11294365

申请日：2005-12-06

申请人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

发明人： Toyomi Nishi ,  Tetsuji Togawa ,  Harumitsu Saito ,  Manabu Tsujimura ,  Hiromi Yajima ,  Kazuaki Himukai ,  Shoichi Kodama ,  Yukio Imoto ,  Riichiro Aoki ,  Masako Watase ,  Atsushi Shigeta ,  Shiro Mishima ,  Gisuke Kouno

IPC分类号： B24B1/00

CPC分类号： B24B37/345 ,  B08B1/04 ,  B08B15/02 ,  B24B27/0023 ,  B24B51/00 ,  B24B55/12 ,  F24F3/161 ,  H01L21/67017 ,  H01L21/67028 ,  H01L21/67057 ,  H01L21/67219

摘要： A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on an upper surface thereof and a top ring positioned above the turntable for supporting the workpiece to be polished and pressing the workpiece against the abrasive cloth, and a cleaning section disposed in the second chamber and cleaning the workpiece which has been polished. The polishing apparatus further includes a transferring device for transferring the workpiece which has been polished from the polishing section to the cleaning section through an opening and an exhaust system for exhausting ambient air from each of the polishing section and cleaning section separately and independently.

摘要翻译： 用于抛光工件表面的抛光装置包括壳体单元，将壳体单元的内部分隔成第一室和第二室的分隔壁，设置在第一室中的抛光部分，并且具有带有研磨布的转台 安装在其上表面和位于转台上方的顶环，用于支撑待抛光的工件并将工件压靠在研磨布上，以及设置在第二室中并清洁已经被抛光的工件的清洁部。 抛光装置还包括转印装置，用于通过用于从每个抛光部分和清洁部分分别且独立地排出周围空气的开口和排气系统将已经从抛光部分抛光的工件传送到清洁部分。

公开(公告)号：US20070061036A1

公开(公告)日：2007-03-15

申请号：US11599351

申请日：2006-11-15

申请人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

发明人： Kunihiko Sakurai ,  Tetsuji Togawa ,  Yoshihiro Mochizuki ,  Akira Fukuda ,  Hirokuni Hiyama ,  Kazuto Hirokawa ,  Manabu Tsujimura

IPC分类号： G06F19/00

CPC分类号： B24B37/30 ,  B24B37/005 ,  B24B37/042 ,  B24B49/00

摘要： A polishing method can automatically reset polishing conditions according to a state of a polishing member based on data on a polishing profile changing with time, thereby extending life of the polishing member and obtaining flatness of a polished surface with higher accuracy. The polishing method, includes steps of: independently applying a desired pressure by each of pressing portions of a top ring on a polishing object; estimating a polishing profile of the polishing object based on set pressure values, and calculating a recommended polishing pressure value so that a difference between the polishing profile of the polishing object after it is polished under certain polishing conditions and a desired polishing profile becomes smaller; and polishing the polishing object with the recommended polishing pressure value.

摘要翻译： 抛光方法可以根据抛光轮廓随着时间的变化的数据，根据研磨部件的状态自动复位抛光条件，从而延长抛光部件的使用寿命，并且以更高的精度获得抛光表面的平坦度。 抛光方法包括以下步骤：通过顶环的每个按压部分独立地施加所需的压力在抛光对象上; 基于设定压力值估计抛光对象的抛光轮廓，并且计算推荐的抛光压力值，使得在某些抛光条件下抛光抛光对象的抛光轮廓与期望的抛光轮廓之间的差异变小; 并用推荐的抛光压力值抛光抛光对象。