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61.发明申请公开(公告)号：US20090130821A1
公开(公告)日：2009-05-21
申请号：US12249812
申请日：2008-10-10
申请人： Damon K. Cox , Todd J. Egan , Michael X. Yang , Jeffrey C. Hudgens , Ingrid B. Peterson , Michael R. Rice
发明人： Damon K. Cox , Todd J. Egan , Michael X. Yang , Jeffrey C. Hudgens , Ingrid B. Peterson , Michael R. Rice
CPC分类号： H01L23/544 , H01L24/94 , H01L24/96 , H01L25/0657 , H01L25/50 , H01L2223/54426 , H01L2223/54453 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01077 , H01L2924/01322 , H01L2924/12044 , Y10T156/17
摘要： A method, a system and a computer readable medium for three dimensional packaging with wafer-level bonding and chip-level repair. A first wafer is provided having a first plurality of chips. A second wafer is provided having a second plurality of chips. At least one chip is removed from the second wafer while retaining the relative alignment of the remaining chips in the second wafer. The first and second wafers are aligned and joined with wafer-to-wafer techniques. Where a bad chip having a relative physical position within the second wafer corresponding to a relative physical position within the first wafer of a good chip is removed, a good chip may be aligned and bonded to the first wafer using die-to-wafer techniques.
摘要翻译： 一种用于具有晶片级结合和芯片级修复的三维封装的方法，系统和计算机可读介质。 提供具有第一多个芯片的第一晶片。 提供具有第二多个芯片的第二晶片。 至少一个芯片从第二晶片移除，同时保持剩余芯片在第二晶片中的相对对准。 第一和第二晶片被对准并且与晶片到晶片技术接合。 如果去除了与第二晶片内的相对物理位置对应于良好芯片的第一晶片内的相对物理位置的不良芯片，则可以使用晶片到晶片技术将良好的芯片对准并结合到第一晶片。
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公开(公告)号：US20080219816A1
公开(公告)日：2008-09-11
申请号：US12026452
申请日：2008-02-05
IPC分类号： H01L21/677
CPC分类号： H01L21/67126 , H01L21/67353 , H01L21/67373 , H01L21/67379 , H01L21/67772 , H01L21/67775
摘要： A substrate handling apparatus and method include a small lot loadport configuration having a plurality of small lot loadports adapted to be coupled to an equipment front end module (EFEM) designed for use with a large lot substrate carrier and having a large lot loadport envelope, where the small lot loadport configuration has a combined envelope substantially similar to the large lot loadport envelope, and where each small lot loadport is adapted to dock with a small lot substrate carrier. A system also is provided that includes (1) the (EFEM) and (2) the small lot loadport configuration. Numerous other aspects are provided.
摘要翻译： 一种基板处理装置和方法包括小批量载荷端口配置，其具有多个小批量载荷端口，其适于耦合到设计用于大批量基板载体并且具有大批载荷端口封套的设备前端模块（EFEM），其中 小批量装载端口配置具有基本上类似于大批量装载端口封套的组合封套，并且其中每个小批量装载端口适于与小批量衬底载体对准。 还提供了一种系统，其中包括（1）（EFEM）和（2）小批量装载端口配置。 提供了许多其他方面。
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公开(公告)号：US20080101912A1
公开(公告)日：2008-05-01
申请号：US11553113
申请日：2006-10-26
申请人： Todd W. Martin , Steven V. Sansoni , Michael R. Rice , Eric Ng , Jeffrey C. Hudgens , Frederick Guckel , Russel Kaplan
发明人： Todd W. Martin , Steven V. Sansoni , Michael R. Rice , Eric Ng , Jeffrey C. Hudgens , Frederick Guckel , Russel Kaplan
CPC分类号： H01L21/681 , G01R31/2893 , H01L21/6719 , H01L21/67196 , H01L21/67201
摘要： Methods for correcting motion of a robot are provided in the present invention. In one embodiment, a method for correcting motion of a robot includes transferring a first substrate supported on a robot to a processing position using a robotic motion routine, depositing a material on the first substrate in the processing position, determining an offset between a center of the deposited material and a center of the first substrate, adjusting the robotic motion routine to compensate for the offset. In another embodiment, a processing chamber is provided configured to obtain samples from which motion of a robot operated therein may be corrected to improve substrate placement on a substrate support through analysis of material deposited on the substrate.
摘要翻译： 在本发明中提供了用于校正机器人运动的方法。 在一个实施例中，一种用于校正机器人运动的方法包括：使用机器人运动程序将支撑在机器人上的第一衬底转移到处理位置，将材料沉积在处理位置的第一衬底上， 沉积材料和第一衬底的中心，调整机器人运动程序以补偿偏移。 在另一个实施例中，提供了一种处理室，其被配置为获得可以通过分析沉积在基板上的材料的方式来校正在其中操作的机器人的运动以便改进衬底支撑件上的衬底放置的样本。
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64.发明授权公开(公告)号：US08078304B2
公开(公告)日：2011-12-13
申请号：US12176381
申请日：2008-07-20
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/37224 , G05B2219/45061 , H01L21/67742 , H01L21/67766 , Y02P90/22 , Y10S414/135
摘要： Electronic device manufacturing systems and methods are provided. In some aspects, a system having a dual-mode robot is provided which is disposed within a system component (e.g., a factory interface or transfer chamber) and adapted to operate in a first mode and a second mode. In the first mode, the robot may transfer a substrate between components of the system (e.g., between a carrier and a process chamber or chamber to chamber) and in the second mode, the robot may execute a process motion profile (e.g., metrology).
摘要翻译： 提供电子设备制造系统和方法。 在一些方面，提供一种具有双模式机器人的系统，其被布置在系统部件（例如，工厂接口或传送室）内并且适于在第一模式和第二模式中操作。 在第一模式中，机器人可以在系统的部件之间（例如，在载体和处理室或室到室之间）传送基板，并且在第二模式中，机器人可以执行过程运动曲线（例如，计量） 。
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公开(公告)号：US20090024241A1
公开(公告)日：2009-01-22
申请号：US12176381
申请日：2008-07-20
CPC分类号： G05B19/41875 , G05B2219/37224 , G05B2219/45061 , H01L21/67742 , H01L21/67766 , Y02P90/22 , Y10S414/135
摘要： Electronic device manufacturing systems and methods are provided. In some aspects, a system having a dual-mode robot is provided which is disposed within a system component (e.g., a factory interface or transfer chamber) and adapted to operate in a first mode and a second mode. In the first mode, the robot may transfer a substrate between components of the system (e.g., between a carrier and a process chamber or chamber to chamber) and in the second mode, the robot may execute a process motion profile (e.g., metrology).
摘要翻译： 提供电子设备制造系统和方法。 在一些方面，提供一种具有双模式机器人的系统，其被布置在系统部件（例如，工厂接口或传送室）内并且适于在第一模式和第二模式中操作。 在第一模式中，机器人可以在系统的部件之间（例如，在载体和处理室或室到室之间）传送基板，并且在第二模式中，机器人可以执行过程运动曲线（例如，计量） 。
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公开(公告)号：US08784033B2
公开(公告)日：2014-07-22
申请号：US12684780
申请日：2010-01-08
申请人： Izya Kremerman , Jeffrey C. Hudgens
发明人： Izya Kremerman , Jeffrey C. Hudgens
IPC分类号： B66C23/00 , B25J9/06 , H01L21/677 , H01L21/683 , B25J9/04 , B25J9/10
CPC分类号： B25J9/043 , B25J9/042 , B25J9/107 , H01L21/67742 , Y10S414/139 , Y10S901/15 , Y10T74/20305
摘要： Substrate transport systems, apparatus and methods are described. The systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then actuating a robot assembly to put or pick the substrate at the destination. Numerous other aspects are provided.
摘要翻译： 描述了基板运输系统，装置和方法。 这些系统适于通过将动臂联动件旋转到与目的地相邻的位置，然后致动机器人组件以将目标物置于或拾取基板，来有效地将目标物放置或拾取目的地的基板。 提供了许多其他方面。
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公开(公告)号：US20090110518A1
公开(公告)日：2009-04-30
申请号：US12257376
申请日：2008-10-23
IPC分类号： H01L21/677
CPC分类号： H01L21/67763 , B65D85/70 , H01L21/67386 , H01L21/67393 , H01L21/67775 , Y10S414/137
摘要： An electronic device manufacturing system is disclosed. The system includes a processing tool having one or more processing chambers each adapted to perform an electronic device manufacturing process on one or more substrates; a substrate carrier adapted to couple to the system and carry one or more substrates; and a component adapted to create a sealed environment relative to at least a portion of the substrate carrier and to substantially equalize the sealed environment with an environment within the substrate carrier. Methods of the invention are described as are numerous other aspects.
摘要翻译： 公开了一种电子设备制造系统。 该系统包括具有一个或多个处理室的处理工具，每个处理室适于在一个或多个基板上执行电子设备制造过程; 衬底载体，其适于耦合到所述系统并携带一个或多个衬底; 以及适于相对于所述衬底载体的至少一部分产生密封环境并且基本上使所述密封环境与所述衬底载体内的环境相等的部件。 本发明的方法被描述为许多其它方面。
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68.发明授权Robot systems, apparatus, and methods adapted to transport substrates in electronic device manufacturing 有权适用于在电子设备制造中传送基板的机器人系统，装置和方法公开(公告)号：US09076829B2
公开(公告)日：2015-07-07
申请号：US13205116
申请日：2011-08-08
IPC分类号： B25J9/04 , H01L21/677
CPC分类号： H01L21/67742 , B25J9/04 , B25J9/041 , B25J9/042 , H01L21/67766
摘要： Substrate transport systems, apparatus, and methods are described. The systems are adapted to efficiently put or pick substrates at a destination by rotating a boom linkage to a position adjacent to the destination and then independently actuating an upper arm link housing and one or more wrist members to put or pick one or more substrates at the destination wherein the wrist member is independently actuated relative to the forearm link housing and the motion of the forearm link member is kinematically linked to the motion of the upper arm link housing. Numerous other aspects are provided.
摘要翻译： 描述了基底输送系统，装置和方法。 这些系统适于通过将动臂连杆机构旋转到与目的地相邻的位置而有效地放置或拾取目的地的基板，然后独立地致动上臂连杆壳体和一个或多个腕部构件以将一个或多个基板放置在 目的地，其中手腕构件相对于前臂连杆壳体独立地致动，并且前臂连杆构件的运动与上臂连杆壳体的运动相关联。 提供了许多其他方面。
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公开(公告)号：US08672121B2
公开(公告)日：2014-03-18
申请号：US12254839
申请日：2008-10-21
申请人： Vinay K. Shah , Jeffrey C. Hudgens
发明人： Vinay K. Shah , Jeffrey C. Hudgens
摘要： A conveyor apparatus adapted to transport and article is provided. The conveyor apparatus has a belt section including a plurality of slots and a plurality of T-shaped stiffeners extending in the slots. Respective belt sections may be spliced together using a plurality of T-shaped stiffeners extending through slots in diagonally-formed ends of each belt section. Methods of the invention are described as are numerous other aspects.
摘要翻译： 提供适于运输和物品的输送设备。 输送装置具有带部分，该带部分包括多个槽和在槽中延伸的多个T形加强件。 可以使用多个T形加强筋将相应的带部分拼接在一起，每个T形加强件穿过每个带部分的对角线形成的端部中的槽。 本发明的方法被描述为许多其它方面。
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公开(公告)号：US08123881B2
公开(公告)日：2012-02-28
申请号：US12248204
申请日：2008-10-09
IPC分类号： B32B37/00
CPC分类号： H01L21/68 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01077 , H01L2924/01322 , H01L2924/14 , H01L2924/1433 , Y10T29/53091 , Y10T29/53174 , Y10T29/53178 , Y10T156/10 , Y10T156/1702
摘要： A method, a system and a computer readable medium having a set of instructions stored thereon for die-to-robot alignment for die-to-substrate bonding are described. First, a robot is aligned with a substrate to provide a pre-aligned robot. Next, a die is aligned with the pre-aligned robot to provide a robot-aligned die. Finally, the robot-aligned die is bonded to a region of the substrate. The substrate is held stationary immediately following the aligning of the robot with the substrate and at least until the robot-aligned die is bonded to the region of the substrate.
摘要翻译： 描述了一种方法，系统和计算机可读介质，其具有存储在其上的用于管芯到基板结合的管芯到机器人对准的一组指令。 首先，机器人与基板对准以提供预对准的机器人。 接下来，模具与预对准机器人对准以提供机器人对准的模具。 最后，将机器人对准的管芯结合到衬底的区域。 在机器人与基板对准之后，基板保持静止，并且至少直到机器人对准的管芯结合到基板的区域。
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