Use of amorphous carbon for gate patterning
    62.
    发明授权
    Use of amorphous carbon for gate patterning 失效
    无定形碳用于栅极图案化

    公开(公告)号:US07015124B1

    公开(公告)日:2006-03-21

    申请号:US10424420

    申请日:2003-04-28

    IPC分类号: H01L21/3205 H01L21/4763

    摘要: A method of producing an integrated circuit includes providing a mask definition structure above a layer of conductive material and providing a mask above the layer of conductive material and in contact with at least a portion of the mask definition structure. The mask definition structure comprises a first material and the mask comprises a second material, wherein at least one of the first and second materials comprises amorphous carbon. The mask definition structure is removed, and the layer of conductive material is patterned according to the mask.

    摘要翻译: 一种制造集成电路的方法包括在导电材料层之上提供掩模定义结构,并在导电材料层之上提供掩模,并与掩模定义结构的至少一部分接触。 掩模定义结构包括第一材料,掩模包括第二材料,其中第一和第二材料中的至少一个包括无定形碳。 去除掩模定义结构,并根据掩模对导电材料层进行图案化。

    Electrical critical dimension measurement and defect detection for reticle fabrication
    63.
    发明授权
    Electrical critical dimension measurement and defect detection for reticle fabrication 失效
    电子临界尺寸测量和掩模版制作的缺陷检测

    公开(公告)号:US06972576B1

    公开(公告)日:2005-12-06

    申请号:US10160334

    申请日:2002-05-31

    CPC分类号: H01L22/34 G03F1/44 G03F1/84

    摘要: A system for testing a reticle used in semiconductor wafer fabrication is provided. The system includes a reticle that has an opaque metal layer over a translucent substrate. The reticle includes one or more test features containing probe points operable for electrical contact. The system includes a reticle test system that is capable of applying a voltage to the probe points, measuring the resulting current, calculating the corresponding resistance of the test features, and determining the critical dimensions of the test features. The system is also capable of determining defects based on the resistance measurements. The critical dimension information and defect information can then be used to refine the processes used in the fabrication of subsequent reticles.

    摘要翻译: 提供了一种用于半导体晶片制造中使用的掩模版的测试系统。 该系统包括在半透明基底上具有不透明金属层的掩模版。 掩模版包括一个或多个测试特征,其中包含可操作用于电接触的探针点。 该系统包括能够对探针点施加电压,测量所得电流,计算相应的测试特征的电阻以及确定测试特征的临界尺寸的光罩测试系统。 该系统还能够基于电阻测量来确定缺陷。 关键尺寸信息和缺陷信息随后可被用于改进在随后的掩模版的制造中使用的工艺。

    Scatterometry of grating structures to monitor wafer stress
    67.
    发明授权
    Scatterometry of grating structures to monitor wafer stress 失效
    光栅结构的散射法监测晶片应力

    公开(公告)号:US06771356B1

    公开(公告)日:2004-08-03

    申请号:US10050626

    申请日:2002-01-16

    IPC分类号: G01B1116

    CPC分类号: G01B11/165

    摘要: A system for monitoring a fabrication process is provided. The system includes one or more light sources, each light source directing light to one or more gratings on a wafer. Light reflected from the gratings is collected by a measuring system that processes the collected light. The collected light is indicative of distortion due to stress at respective portions of the wafer. The measuring system provides distortion/stress related data to a processor that determines the acceptability of the distortion of the respective portions of the wafer. The collected light may be analyzed by scatterometry systems to produce scatterometry signatures associated with distortion and to produce feed-forward control information that can be employed to control semiconductor fabrication processes.

    摘要翻译: 提供了一种用于监视制造工艺的系统。 该系统包括一个或多个光源,每个光源将光引导到晶片上的一个或多个光栅。 从光栅反射的光被处理收集的光的测量系统收集。 所收集的光指示由于晶片的各个部分处的应力引起的变形。 测量系统向处理器提供失真/应力相关数据,该处理器确定晶片各部分的失真的可接受性。 收集的光可以通过散射测量系统进行分析,以产生与失真相关联的散射仪签名并产生可用于控制半导体制造过程的前馈控制信息。

    Quartz crystal monitor wafer for lithography and etch process monitoring
    68.
    发明授权
    Quartz crystal monitor wafer for lithography and etch process monitoring 失效
    用于光刻和蚀刻过程监控的石英晶体监视器晶圆

    公开(公告)号:US06654659B1

    公开(公告)日:2003-11-25

    申请号:US10178084

    申请日:2002-06-24

    IPC分类号: G06F1900

    摘要: One aspect of the present invention relates to a feedback-driven, closed loop system/method for obtaining consistently formed semiconductor structures. The system/method involves controlling the progression of a lithography process such as a deposition or etching process. The system employs one or more piezoelectric sensors, such as quartz crystal sensors, integrated on a wafer. During the lithography process, the sensors produce frequency data which is analyzed and communicated to a lithography process controller in order to modulate one or more process parameters and/or one or more process components. The frequency data indicates the progression of the lithography process and facilitates determining whether the parameters/components need correction to obtain structures which are consistent throughout the wafer and from wafer to wafer. Data generated by each sensor located at an area on the wafer may be cross-referenced with data from other sensors on the wafer and with data from other wafers to ensure uniformity and consistency among the wafers.

    摘要翻译: 本发明的一个方面涉及一种用于获得一致形成的半导体结构的反馈驱动的闭环系统/方法。 该系统/方法涉及控制诸如沉积或蚀刻工艺的光刻工艺的进展。 该系统采用集成在晶片上的一个或多个压电传感器,例如石英晶体传感器。 在光刻过程期间,传感器产生频率数据,其被分析并传送到光刻过程控制器,以便调制一个或多个过程参数和/或一个或多个过程组件。 频率数据指示光刻过程的进展,并且有助于确定参数/组件是否需要校正以获得在整个晶片和晶片与晶片之间一致的结构。 由位于晶片上的每个传感器生成的数据可以与来自晶片上的其他传感器的数据和来自其他晶片的数据进行交叉参考,以确保晶片之间的均匀性和一致性。

    Planar finFET patterning using amorphous carbon
    69.
    发明授权
    Planar finFET patterning using amorphous carbon 有权
    使用无定形碳的平面finFET图案化

    公开(公告)号:US06605514B1

    公开(公告)日:2003-08-12

    申请号:US10237824

    申请日:2002-09-09

    IPC分类号: H01L21336

    摘要: An exemplary embodiment relates to a method of finFET patterning. The method can include patterning a fin structure above a substrate, forming amorphous carbon spacers along lateral sidewalls of the fin structure, depositing an oxide layer and polishing the oxide layer to expose top portions of the fin structure and the amorphous carbon spacers, removing amorphous carbon spacers, and depositing polysilicon where the amorphous carbon spacers were located.

    摘要翻译: 示例性实施例涉及finFET图案化的方法。 该方法可以包括在衬底上图案化翅片结构,在翅片结构的横向侧壁上形成非晶碳间隔物,沉积氧化物层并抛光氧化物层以暴露翅片结构的顶部和无定形碳间隔物,去除无定形碳 间隔物和沉积多晶硅,其中无定形碳间隔物位于其中。

    Gate array with multiple dielectric properties and method for forming same
    70.
    发明授权
    Gate array with multiple dielectric properties and method for forming same 失效
    具有多种介电特性的门阵列及其形成方法

    公开(公告)号:US06563183B1

    公开(公告)日:2003-05-13

    申请号:US10085949

    申请日:2002-02-28

    IPC分类号: H01L2976

    摘要: The invention provides an integrated circuit fabricated on a semiconductor substrate. The integrated circuit comprises a first field effect transistor and a second field effect transistor. The first field effect transistor comprises a first polysilicon gate positioned above a first channel region of the substrate and isolated from the first channel region by a first dielectric layer extending the entire length of the first polysilicon gate. The first dielectric layer comprises a first dielectric material with a first dielectric constant. The second field effect transistor comprises a second polysilicon gate positioned above a second channel region on the substrate and isolated from the second channel region by a second dielectric layer extending the entire length of the second polysilicon gate. The second dielectric layer comprises a second dielectric material with a second dielectric constant. The first dielectric constant and the second dielectric constant may be different and both may be greater than the dielectric constant of silicon dioxide.

    摘要翻译: 本发明提供一种在半导体衬底上制造的集成电路。 集成电路包括第一场效应晶体管和第二场效应晶体管。 第一场效应晶体管包括位于衬底的第一沟道区上方的第一多晶硅栅极,并通过延伸第一多晶硅栅极的整个长度的第一电介质层与第一沟道区隔离。 第一电介质层包括具有第一介电常数的第一电介质材料。 第二场效应晶体管包括位于衬底上的第二沟道区上方的第二多晶硅栅极,并且通过延伸第二多晶硅栅极的整个长度的第二电介质层与第二沟道区隔离。 第二电介质层包括具有第二介电常数的第二电介质材料。 第一介电常数和第二介电常数可以是不同的,并且它们都可以大于二氧化硅的介电常数。