公开(公告)号：US10727240B2

公开(公告)日：2020-07-28

申请号：US16028244

申请日：2018-07-05

Applicant: Silicon Storage Technology, Inc.

Inventor： Serguei Jourba ,  Catherine Decobert ,  Feng Zhou ,  Jinho Kim ,  Xian Liu ,  Nhan Do

IPC: H01L27/1156 ,  H01L27/11524 ,  H01L21/266 ,  H01L21/768 ,  H01L21/8234 ,  H01L21/8238 ,  H01L27/088 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L29/788

Abstract: A memory device including a plurality of upwardly extending fins in a semiconductor substrate upper surface. A memory cell is formed on a first of the fins, and includes spaced apart source and drain regions in the first fin, with a channel region extending along top and opposing side surfaces of the first fin between the source and drain regions. A floating gate extends along a first portion of the channel region. A select gate extends along a second portion of the channel region. A control gate extends along the floating gate. An erase gate extends along the source region. A second of the fins has a length that extends in a first direction which is perpendicular to a second direction in which a length of the first fin extends. The source region is formed in the first fin at an intersection of the first and second fins.

公开(公告)号：US10468428B1

公开(公告)日：2019-11-05

申请号：US15957615

申请日：2018-04-19

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  Jinho Kim ,  Xian Liu ,  Serguei Jourba ,  Catherine Decobert ,  Nhan Do

IPC: H01L27/11531 ,  H01L27/11521 ,  H01L29/10 ,  H01L29/423 ,  H01L29/66 ,  H01L29/78 ,  H01L29/788

Abstract: A semiconductor substrate having an upper surface with a plurality of upwardly extending fins. A memory cell formed on a first of the fins and including spaced apart source and drain regions in the first fin, with a channel region extending therebetween along top and side surfaces of the first fin, a floating gate that extends along a first portion of the channel region, a select gate that extends along a second portion of the channel region, a control gate that extends along and is insulated from the floating gate, and an erase gate that extends along and is insulated from the source region. A logic device formed on a second of the fins and including spaced apart logic source and logic drain regions in the second fin, with a logic channel region of the second fin extending therebetween, and a logic gate that extends along the logic channel region.

公开(公告)号：US10431265B2

公开(公告)日：2019-10-01

申请号：US15467174

申请日：2017-03-23

Applicant: Silicon Storage Technology, Inc.

Inventor： Hieu Van Tran ,  Xian Liu ,  Nhan Do

IPC: G11C16/06 ,  G11C7/10 ,  G11C8/12 ,  H01L21/28 ,  H01L27/11521 ,  G11C16/08 ,  G11C29/02 ,  H01L29/423 ,  H01L29/66 ,  H01L29/788 ,  G11C16/04 ,  G11C8/08 ,  G11C8/10 ,  G11C29/12 ,  H01L27/11524

Abstract: A system and method are disclosed for performing address fault detection in a flash memory system. An address fault detection array is used to confirm that an activated word line or bit line is the word line or bit line that was actually intended to be activated based upon the received address, which will identify a type of fault where the wrong word line or bit line is activated. The address fault detection array also is used to indicate whether more than one word line or bit line was activated, which will identify a type of fault where two or more word lines or bit lines are activated.

公开(公告)号：US20190198647A1

公开(公告)日：2019-06-27

申请号：US16287581

申请日：2019-02-27

Applicant: Silicon Storage Technology, Inc.

Inventor： Chunming Wang ,  Leo Xing ,  Andy Liu ,  Melvin Diao ,  Xian Liu ,  Nhan Do

IPC: H01L29/66 ,  H01L27/11521 ,  H01L21/3213 ,  H01L27/11531 ,  H01L29/423 ,  H01L49/02 ,  H01L27/11536

CPC classification number: H01L29/66825 ,  H01L21/32133 ,  H01L27/11521 ,  H01L27/11531 ,  H01L27/11536 ,  H01L28/00 ,  H01L29/423 ,  H01L29/42328

Abstract: A method of forming a non-volatile memory cell on a substrate having memory cell and logic circuit regions by forming a pair of conductive floating gates in the memory cell region, forming a first source region in the substrate between the pair of floating gates, forming a polysilicon layer in both regions, forming an oxide layer over the polysilicon layer in the logic circuit region, performing a chemical-mechanical polish of the polysilicon layer in the memory cell area leaving a first block of the polysilicon layer between the floating gates that is separated from remaining portions of the polysilicon layer, and selectively etching portions of the polysilicon layer to result in: second and third blocks of the polysilicon layer disposed in outer regions of the memory cell area, and a fourth block of the polysilicon layer in the logic circuit region.

公开(公告)号：US10312247B1

公开(公告)日：2019-06-04

申请号：US15933124

申请日：2018-03-22

Applicant: Silicon Storage Technology, Inc.

Inventor： Serguei Jourba ,  Catherine Decobert ,  Feng Zhou ,  Jinho Kim ,  Xian Liu ,  Nhan Do

IPC: H01L27/11524 ,  H01L29/423 ,  H01L29/78 ,  H01L29/66 ,  H01L29/788 ,  H01L21/28

Abstract: A non-volatile memory cell formed on a semiconductor substrate having an upper surface with an upwardly extending fin with opposing first and second side surfaces. First and second electrodes are in electrical contact with first and second portions of the fin. A channel region of the fin includes portions of the first and second side surfaces that extend between the first and second portions of the fin. A floating gate extends along the first side surface of a first portion of the channel region, where no portion of the floating gate extends along the second side surface. A word line gate extends along the first and second side surfaces of a second portion of the channel region. A control gate is disposed over the floating gate. An erase gate has a first portion disposed laterally adjacent to the floating gate and a second portion disposed vertically over the floating gate.

公开(公告)号：US09673208B2

公开(公告)日：2017-06-06

申请号：US15264457

申请日：2016-09-13

Applicant: Silicon Storage Technology, Inc.

Inventor： Jinho Kim ,  Chien-Sheng Su ,  Feng Zhou ,  Xian Liu ,  Nhan Do ,  Prateep Tuntasood ,  Parviz Ghazavi

IPC: H01L27/115 ,  H01L29/66 ,  H01L27/11531

CPC classification number: H01L27/11531 ,  H01L27/11524 ,  H01L27/11536 ,  H01L27/11539 ,  H01L27/11541 ,  H01L27/11543

Abstract: A method of forming a memory device on a substrate having memory, core and HV device areas. The method includes forming a pair of conductive layers in all three areas, forming an insulation layer over the conductive layers in all three areas (to protect the core and HV device areas), and then etching through the insulation layer and the pair of conductive layers in the memory area to form memory stacks. The method further includes forming an insulation layer over the memory stacks (to protect the memory area), removing the pair of conductive layers in the core and HV device areas, and forming conductive gates disposed over and insulated from the substrate in the core and HV device areas.

公开(公告)号：US09634019B1

公开(公告)日：2017-04-25

申请号：US15225393

申请日：2016-08-01

Applicant: Silicon Storage Technology, Inc.

Inventor： Feng Zhou ,  Xian Liu ,  Jeng-Wei Yang ,  Chien-Sheng Su ,  Nhan Do

IPC: H01L21/28 ,  H01L21/336 ,  H01L29/66 ,  H01L27/115 ,  H01L27/11521 ,  H01L29/788 ,  H01L29/49 ,  H01L29/423 ,  H01L21/8238

CPC classification number: H01L27/11521 ,  H01L21/28273 ,  H01L21/8238 ,  H01L29/42328 ,  H01L29/42332 ,  H01L29/4916 ,  H01L29/66825 ,  H01L29/7881 ,  H01L29/7883

Abstract: A method of forming a pair of memory cells that includes forming a polysilicon layer over and insulated from a semiconductor substrate, forming a pair of conductive control gates over and insulated from the polysilicon layer, forming first and second insulation layers extending along inner and outer side surfaces of the control gates, removing portions of the polysilicon layer adjacent the outer side surfaces of the control gates, forming an HKMG layer on the structure and removing portions thereof between the control gates, removing a portion of the polysilicon layer adjacent the inner side surfaces of the control gates, forming a source region in the substrate adjacent the inner side surfaces of the control gates, forming a conductive erase gate over and insulated from the source region, forming conductive word line gates laterally adjacent to the control gates, and forming drain regions in the substrate adjacent the word line gates.

公开(公告)号：US20160225878A1

公开(公告)日：2016-08-04

申请号：US15091202

申请日：2016-04-05

Applicant: Silicon Storage Technology, Inc.

Inventor： Willem-Jan Toren ,  Xian Liu ,  Gerhard Metzger-Brueckl ,  Nhan Do ,  Stephan Wege ,  Nadia Miridi ,  Chieng-Sheng Su ,  Cecile Bernardi ,  Liz Cuevas ,  Florence Guyot ,  Yueh-Hsin Chen ,  Henry Om'mani ,  Mandana Tadayoni

IPC: H01L29/66 ,  H01L21/28

CPC classification number: H01L29/66545 ,  H01L21/28273 ,  H01L21/28282 ,  H01L21/76283 ,  H01L27/11521 ,  H01L27/11568

Abstract: A stack gate structure for a non-volatile memory array has a semiconductor substrate having a plurality of substantially parallel spaced apart active regions, with each active region having an axis in a first direction. A first insulating material is between each stack gate structure in the second direction perpendicular to the first direction. Each stack gate structure has a second insulating material over the active region, a charge holding gate over the second insulating material, a third insulating material over the charge holding gate, and a first portion of a control gate over the third insulating material. A second portion of the control gate is over the first portion of the control gate and over the first insulating material adjacent thereto and extending in the second direction. A fourth insulating material is over the second portion of the control gate.

Abstract translation: 用于非易失性存储器阵列的堆叠栅极结构具有半导体衬底，该半导体衬底具有多个基本上平行的间隔开的有源区，每个有源区具有沿第一方向的轴。 在垂直于第一方向的第二方向上，第一绝缘材料位于每个堆叠栅极结构之间。 每个堆叠栅极结构在有源区域上具有第二绝缘材料，在第二绝缘材料上方的电荷保持栅极，电荷保持栅极上方的第三绝缘材料以及位于第三绝缘材料上的控制栅极的第一部分。 控制栅极的第二部分在控制栅极的第一部分之上，并且与第一部分相邻并且在第二方向上延伸。 第四绝缘材料位于控制栅极的第二部分之上。

公开(公告)号：US12131786B2

公开(公告)日：2024-10-29

申请号：US18104228

申请日：2023-01-31

Applicant: Silicon Storage Technology, Inc.

Inventor： Louisa Schneider ,  Xian Liu ,  Steven Lemke ,  Parviz Ghazavi ,  Jinho Kim ,  Henry A. Om'Mani ,  Hieu Van Tran ,  Nhan Do

IPC: G11C5/06 ,  G11C16/16 ,  H01L23/48 ,  H01L29/423 ,  H10B41/10 ,  H10B41/27

CPC classification number: G11C16/16 ,  H01L23/481 ,  H01L29/42328 ,  H10B41/10 ,  H10B41/27

Abstract: A memory cell array having rows and columns of memory cells with respective ones of the memory cells including spaced apart source and drain regions formed in a semiconductor substrate with a channel region extending there between, a floating gate over a first portion of the channel region, a select gate over a second portion of the channel region, and an erase gate over the source region. A strap region is disposed between first and second pluralities of the columns. For one memory cell row, a dummy floating gate is disposed in the strap region, an erase gate line electrically connects together the erase gates of the memory cells in the one row and in the first plurality of columns, wherein the erase gate line is aligned with the dummy floating gate with a row direction gap between the erase gate line and the dummy floating gate.

公开(公告)号：US20230292504A1

公开(公告)日：2023-09-14

申请号：US17834746

申请日：2022-06-07

Applicant: Silicon Storage Technology, Inc.

Inventor： Zhuoqiang Jia ,  Leo Xing ,  Xian Liu ,  Serguei Jourba ,  Nhan Do

IPC: H01L27/11531 ,  H01L29/423 ,  H01L21/28 ,  H01L29/788 ,  H01L29/66

CPC classification number: H01L27/11531 ,  H01L29/42328 ,  H01L29/40114 ,  H01L29/7883 ,  H01L29/66825

Abstract: A method includes recessing an upper surface of a substrate in first and second areas relative to a third area, forming a first conductive layer in the first area, forming a second conductive layer in the three areas, selectively removing the first and second conductive layers in the first area, while maintaining the second conductive layer in the second and third areas, leaving pairs of stack structures in the first area respectively having a control gate of the second conductive layer and a floating gate of the first conductive layer, forming a third conductive layer in the three areas, recessing the upper surface of the third conductive layer below tops of the stack structures and removing the third conductive layer from the second and third areas, removing the second conductive layer from the second and third areas, and forming blocks of metal material in the second and third areas.