公开(公告)号：US07869674B2

公开(公告)日：2011-01-11

申请号：US12359842

申请日：2009-01-26

申请人： Yong Suk Kim ,  Hoon Hur

发明人： Yong Suk Kim ,  Hoon Hur

IPC分类号： G02B6/32

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/2704 ,  B29C2045/14327 ,  B29L2031/3475 ,  B29L2031/747 ,  H01L33/52

摘要： A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove.

摘要翻译： 公开了一种能够实现光提取效率提高和批量生产率提高的发光单元，其制造方法及其制造方法，其透镜成型装置及其发光装置封装 。 发光单元制造装置包括：模具，其包括第一模具和第二模具，所述模具在第一模具和第二模具之间插入有至少一个发光单元的条件下彼此耦合;沟槽，其形成在第一模具和第二模具之一中; 在面向发光单元的位置处的第二模具，所述凹槽具有透镜形状，以及从模具的外表面延伸到凹槽的通道。

公开(公告)号：US20100307801A1

公开(公告)日：2010-12-09

申请号：US12458958

申请日：2009-07-28

申请人： Yong Suk Kim ,  Yong Soo Oh ,  Byeung Gyu Chang

发明人： Yong Suk Kim ,  Yong Soo Oh ,  Byeung Gyu Chang

IPC分类号： H05K1/09 ,  H01B13/00 ,  B05D5/12 ,  H05K1/11 ,  H05K1/02

CPC分类号： H05K3/381 ,  H05K1/0306 ,  H05K1/112 ,  H05K3/108 ,  H05K3/388 ,  H05K3/4629 ,  H05K2201/09436 ,  H05K2203/0789 ,  H05K2203/0793 ,  H05K2203/095 ,  H05K2203/102 ,  H05K2203/107

摘要： The present invention relates to a multilayer ceramic substrate including: a ceramic stacked structure in which multiple ceramic layers are stacked and interconnected to one another through vias provided in respective ceramic layers, the ceramic stacked structure having surface reforming layers 111a formed by removal of glass component on the surfaces of upper and lower parts of the ceramic layers; and contact pads formed on a top surface and a bottom surface of the ceramic stacked structure so as to be electrically connected to the vias.

摘要翻译： 多层陶瓷基板技术领域本发明涉及一种多层陶瓷基板，其特征在于，具有陶瓷层叠结构体，其中多个陶瓷层通过设置在各陶瓷层中的通孔彼此堆叠而互相连接，所述陶瓷层叠结构具有通过除去玻璃成分而形成的表面重整层111a 在陶瓷层的上部和下部的表面上; 以及形成在陶瓷层叠结构的顶表面和底表面上的接触焊盘，以便电连接到通孔。

公开(公告)号：US20100301009A1

公开(公告)日：2010-12-02

申请号：US12458834

申请日：2009-07-23

申请人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

发明人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

IPC分类号： C23F1/00

CPC分类号： G01R3/00 ,  G01R1/06761 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/143 ,  H05K3/388

摘要： The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.

摘要翻译： 本发明涉及一种形成陶瓷基板的电极图案的方法，包括以下步骤：在陶瓷基板上形成多个导电粘合图案以彼此分开; 在陶瓷基板上形成覆盖导电粘合图案的电镀种子层; 在电镀种子层上形成光致抗蚀剂图案，暴露与导电粘合图案相对应的部分; 在由光致抗蚀剂图案曝光的电镀种子层上形成镀层; 去除光致抗蚀剂图案; 以及通过去除光致抗蚀剂图案来蚀刻暴露的电镀种子层的部分。

公开(公告)号：US20090045432A1

公开(公告)日：2009-02-19

申请号：US12222595

申请日：2008-08-12

申请人： Yong Suk Kim ,  Bu Wan Seo ,  Hoon Hur

发明人： Yong Suk Kim ,  Bu Wan Seo ,  Hoon Hur

IPC分类号： H01L23/00

CPC分类号： H05K1/0206 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K3/107 ,  H05K3/4038 ,  H05K3/42 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/10106 ,  H05K2201/10969 ,  H05K2203/043 ,  H05K2203/0733 ,  H01L2924/00014

摘要： A circuit board for a light emitting device and a light emitting unit using the same, which are capable of achieving an enhancement in light emission efficiency and an enhancement in reliability, are disclosed. The disclosed circuit board includes a substrate having a first surface and a second surface, at least one pair of conductive lines formed on the first surface of the substrate, and electrically connected to a light emitting device package, and a heat transfer member formed in a region where the light emitting device package is coupled to the circuit board, such that the heat transfer member connects the first and second surfaces of the substrate.

摘要翻译： 公开了一种能够实现发光效率提高和可靠性提高的发光元件用电路板及使用该电路的发光单元。 所公开的电路板包括具有第一表面和第二表面的基板，形成在基板的第一表面上并电连接到发光器件封装的至少一对导电线，以及形成在 区域，其中发光器件封装耦合到电路板，使得传热构件连接衬底的第一和第二表面。

公开(公告)号：US20080164587A1

公开(公告)日：2008-07-10

申请号：US11620561

申请日：2007-01-05

申请人： Seong Won Park ,  Cheng Yu Hsia ,  Yong Suk Kim

发明人： Seong Won Park ,  Cheng Yu Hsia ,  Yong Suk Kim

IPC分类号： H01L23/495 ,  H01L21/56

CPC分类号： H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06568 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.

摘要翻译： 半导体封装可以包括附接到衬底的管芯堆叠，其中接合线电连接两者。 通常，多个管芯堆叠被粘附到单个衬底上，使得可以一次制造几个半导体封装。 模制复合流量控制器在一个或多个不同位置处与衬底或半导体封装最佳地相关联。 流动控制器可以在封装过程中控制或引导模塑料的流动。 流量控制器的尺寸，形状和位置可以平滑模制化合物的流动，从而在含有模具的基材的区域和没有模具的基材的超过区域上流动的速度基本相当。 以这种方式，在封装期间可以基本上避免诸如封装，电线清扫和电线短路之类的缺陷的缺陷。