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    METHOD OF FORMING PLATING LAYER
    4.
    发明申请
    METHOD OF FORMING PLATING LAYER 审中-公开
    形成层的方法

    公开(公告)号：US20090294297A1

    公开(公告)日：2009-12-03

    申请号：US12243067

    申请日：2008-10-01

    申请人： Young Suk KIM ,  Yong Soo Oh ,  Byeung Gyu Chang ,  Won Hee Yoo ,  Sung Yeol Park

    发明人： Young Suk KIM ,  Yong Soo Oh ,  Byeung Gyu Chang ,  Won Hee Yoo ,  Sung Yeol Park

    IPC分类号： C25D5/10

    CPC分类号： C25D5/022 ,  C25D5/12 ,  H05K1/0306 ,  H05K3/0076 ,  H05K3/108 ,  H05K2201/0129 ,  H05K2203/1105

    摘要： There is provided a method of forming a plating layer, the method including: forming a seed layer on a substrate; forming a pattern layer on the seed layer, the pattern layer formed of a thermoplastic resin and including openings; forming a plating layer on portions of the seed layer corresponding to the openings; and removing the pattern layer. This method ensures that the plating layer is formed with a sufficient thickness and the substrate, particularly, a ceramic substrate suffers minimal chemical damage during a plating process. Moreover, the plating layer is formed with a more uniform thickness.

    摘要翻译： 提供了形成镀层的方法，该方法包括：在基板上形成种子层; 在种子层上形成图案层，所述图案层由热塑性树脂形成并包括开口; 在对应于开口的种子层的部分上形成镀层; 并去除图案层。 该方法确保镀层形成足够的厚度，并且衬底，特别是陶瓷衬底在电镀过程中遭受最小的化学损伤。 此外，镀层形成为更均匀的厚度。

    Manufacturing method of multi-layer ceramic substrate
    5.
    发明授权
    Manufacturing method of multi-layer ceramic substrate 有权
    多层陶瓷基板的制造方法

    公开(公告)号：US07819995B2

    公开(公告)日：2010-10-26

    申请号：US12411156

    申请日：2009-03-25

    申请人： Yong Suk Kim ,  Byeung Gyu Chang ,  Taek Jung Lee

    发明人： Yong Suk Kim ,  Byeung Gyu Chang ,  Taek Jung Lee

    IPC分类号： C03B29/00 ,  C04B33/34

    CPC分类号： H05K3/4611 ,  C04B33/32 ,  H05K3/4629 ,  H05K2203/0789 ,  H05K2203/308

    摘要： There is provided a method of manufacturing a multilayer ceramic substrate, the method including: providing a non-sintered multilayer ceramic substrate having a plurality of low temperature sintering green sheets laminated therein; disposing a hard-to-sinter constraining green sheet on at least one of top and bottom surfaces of the non-sintered multilayer ceramic substrate; sintering the non-sintered multilayer ceramic substrate having the hard-to-sinter constraining layer disposed thereon; immersing the sintered multilayer ceramic substrate into an acidic solution; and activating a contact between the hard-to-sinter constraining layer and the acidic solution such that the hard-to-sinter constraining layer is removed.

    摘要翻译： 提供一种制造多层陶瓷基板的方法，该方法包括：提供层叠有多个低温烧结生片的非烧结多层陶瓷基板; 在非烧结多层陶瓷基板的顶表面和底表面中的至少一个上设置难以烧结的约束生片; 烧结其上设置有难烧结约束层的非烧结多层陶瓷衬底; 将烧结的多层陶瓷衬底浸入酸性溶液中; 并且激活硬烧结约束层和酸性溶液之间的接触，从而去除硬烧结约束层。

    MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME
    7.
    发明申请
    MULTILAYER CERAMIC SUBSTRATE AND PROBE BOARD USING PILLAR-TYPE CONDUCTOR AND FABRICATING METHODS OF THE SAME 审中-公开
    多层陶瓷基板和探针板使用支柱导体及其制作方法

    公开(公告)号：US20110148447A1

    公开(公告)日：2011-06-23

    申请号：US12836955

    申请日：2010-07-15

    申请人： Won Hee YOO ,  Byeung Gyu Chang ,  Yong Suk Kim

    发明人： Won Hee YOO ,  Byeung Gyu Chang ,  Yong Suk Kim

    IPC分类号： G01R1/067 ,  C04B35/74 ,  H05K1/11

    CPC分类号： B32B18/00 ,  C04B35/63436 ,  C04B35/63456 ,  C04B37/026 ,  C04B2237/04 ,  C04B2237/12 ,  C04B2237/32 ,  C04B2237/40 ,  C04B2237/52 ,  C04B2237/592 ,  C04B2237/62 ,  C04B2237/68 ,  C04B2237/72 ,  G01R1/06711 ,  G01R3/00 ,  H05K3/4007 ,  H05K3/4046 ,  H05K3/4061 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2203/025

    摘要： There are provided a multilayer ceramic substrate and a probe board formed using a pillar-type conductor formed by including preparing a ceramic sheet having at least one through hole; filling the inside of the through hole with a conductive material; firing the ceramic sheet so that the conductive material is fired to form a pillar-type conductor; and removing the ceramic sheet so that the pillar-type conductor remains, and fabricating methods of the same. The multilayer ceramic substrate and the probe board use the pillar-type conductor that can fill the unfilled region formed within the ceramic sintered body, such that the electrical characteristics and surface flatness thereof are improved. In addition, the multilayer ceramic substrate and the probe board formed by using the pillar-type conductor with the improved adhesion and electrical characteristics between the ceramic sintered body and the connecting pad, and the fabricating methods of the same are provided.

    摘要翻译： 提供了一种多层陶瓷基板和使用柱状导体形成的探针板，所述柱状导体通过包括制备具有至少一个通孔的陶瓷片而形成; 用导电材料填充通孔的内部; 烧制陶瓷片，使得导电材料被烧制以形成柱状导体; 并且去除陶瓷片以使柱状导体残留，并且制造其方法。 多层陶瓷基板和探针板使用可以填充陶瓷烧结体内形成的未填充区域的柱状导体，使得其电特性和表面平坦性得到改善。 此外，提供了通过使用具有改善的陶瓷烧结体和连接焊盘之间的粘合性和电特性的柱状导体形成的多层陶瓷基板和探针板及其制造方法。

    Method for forming electrode pattern of ceramic substrate
    8.
    发明授权
    Method for forming electrode pattern of ceramic substrate 有权
    形成陶瓷基板电极图案的方法

    公开(公告)号：US08198198B2

    公开(公告)日：2012-06-12

    申请号：US12458834

    申请日：2009-07-23

    申请人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

    发明人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

    IPC分类号： H01L21/302

    CPC分类号： G01R3/00 ,  G01R1/06761 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/143 ,  H05K3/388

    摘要： The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.

    摘要翻译： 本发明涉及一种形成陶瓷基板的电极图案的方法，包括以下步骤：在陶瓷基板上形成多个导电粘合图案以彼此分开; 在陶瓷基板上形成覆盖导电粘合图案的电镀种子层; 在电镀种子层上形成光致抗蚀剂图案，暴露与导电粘合图案相对应的部分; 在由光致抗蚀剂图案曝光的电镀种子层上形成镀层; 去除光致抗蚀剂图案; 以及通过去除光致抗蚀剂图案来蚀刻暴露的电镀种子层的部分。

    Method for forming electrode pattern of ceramic substrate
    9.
    发明申请
    Method for forming electrode pattern of ceramic substrate 有权
    形成陶瓷基板电极图案的方法

    公开(公告)号：US20100301009A1

    公开(公告)日：2010-12-02

    申请号：US12458834

    申请日：2009-07-23

    申请人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

    发明人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

    IPC分类号： C23F1/00

    CPC分类号： G01R3/00 ,  G01R1/06761 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/143 ,  H05K3/388

    摘要： The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.

    摘要翻译： 本发明涉及一种形成陶瓷基板的电极图案的方法，包括以下步骤：在陶瓷基板上形成多个导电粘合图案以彼此分开; 在陶瓷基板上形成覆盖导电粘合图案的电镀种子层; 在电镀种子层上形成光致抗蚀剂图案，暴露与导电粘合图案相对应的部分; 在由光致抗蚀剂图案曝光的电镀种子层上形成镀层; 去除光致抗蚀剂图案; 以及通过去除光致抗蚀剂图案来蚀刻暴露的电镀种子层的部分。